公开(公告)号：US09178120B2

公开(公告)日：2015-11-03

申请号：US13638992

申请日：2011-03-30

申请人： Tadashi Kokubo ,  Katsuya Ouchi ,  Takahisa Iwahara ,  Kazuhiko Hirabayashi ,  Hiroshi Okoshi ,  Tomokazu Tozawa ,  Shuhei Ozaki

发明人： Tadashi Kokubo ,  Katsuya Ouchi ,  Takahisa Iwahara ,  Kazuhiko Hirabayashi ,  Hiroshi Okoshi ,  Tomokazu Tozawa ,  Shuhei Ozaki

IPC分类号： H01L33/56 ,  H01L23/29 ,  H01L33/60 ,  H01L23/31 ,  C08K3/22 ,  C08K3/36 ,  C08K5/098 ,  H01L23/495 ,  H01L33/62

CPC分类号： H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C08K5/098 ,  C08K2003/2241 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3171 ,  H01L23/49586 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

摘要翻译： 本发明的目的在于提供一种固化性树脂组合物，其具有低的线性膨胀系数的固化物。 本发明的固化性树脂组合物含有作为必要成分的（A）每分子具有至少两个与SiH基反应的碳 - 碳双键的有机化合物，（B）每分子含有至少两个SiH基的化合物， （C）氢化硅烷化催化剂，（D）每分子具有至少一个与SiH基反应的碳 - 碳双键的硅氧烷化合物和（E）无机填料。

公开(公告)号：US20130082369A1

公开(公告)日：2013-04-04

申请号：US13638992

申请日：2011-03-30

申请人： Tadashi Kokubo ,  Katsuya Ouchi ,  Takahisa Iwahara ,  Kazuhiko Hirabayashi ,  Hiroshi Okoshi ,  Tomokazu Tozawa ,  Shuhei Ozaki

发明人： Tadashi Kokubo ,  Katsuya Ouchi ,  Takahisa Iwahara ,  Kazuhiko Hirabayashi ,  Hiroshi Okoshi ,  Tomokazu Tozawa ,  Shuhei Ozaki

IPC分类号： H01L23/29

CPC分类号： H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C08K5/098 ,  C08K2003/2241 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3171 ,  H01L23/49586 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.