Thin film silicon semiconductor device and process for producing thereof
    1.
    发明授权
    Thin film silicon semiconductor device and process for producing thereof 失效
    薄膜硅半导体器件及其制造方法

    公开(公告)号:US5248630A

    公开(公告)日:1993-09-28

    申请号:US857944

    申请日:1992-03-26

    摘要: A thin film silicon semiconductor device provided on a substrate according to the present invention comprises a thin polycrystalline silicon film having a lattice constant smaller than that of a silicon single crystal and a small crystal grain size. This thin polycrystalline silicon film can be obtained by depositing a thin amorphous silicon film in an inert gas having a pressure of 3.5 Pa or lower by a sputtering deposition method and annealing the thin amorphous silicon film for a short time of 10 seconds or less to effect polycrystallization thereof. A thin film silicon semiconductor device comprising such a thin polycrystalline silicon film having a small lattice constant has excellent characteristics including a carrier mobility of 100 cm.sup.2 /V.multidot.s or higher.

    摘要翻译: 根据本发明的设置在基板上的薄膜硅半导体器件包括晶格常数小于单晶晶格和小晶粒尺寸的薄多晶硅薄膜。 该薄多晶硅膜可以通过溅射沉积法将薄的非晶硅膜沉积在具有3.5Pa或更低的压力的惰性气体中并在10秒或更短的时间内退火薄的非晶硅膜来获得, 多结晶。 包括这种具有小晶格常数的薄多晶硅膜的薄膜硅半导体器件具有包括100cm 2 / Vxs或更高的载流子迁移率的优异特性。