公开(公告)号：US20050116327A1

公开(公告)日：2005-06-02

申请号：US10983706

申请日：2004-11-09

申请人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

发明人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC分类号： H01L23/50 ,  H01L21/44 ,  H01L21/48 ,  H01L21/56 ,  H01L23/02 ,  H01L23/28 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).

摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。

公开(公告)号：US07282396B2

公开(公告)日：2007-10-16

申请号：US10983706

申请日：2004-11-09

申请人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

发明人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).

摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。

公开(公告)号：US08592961B2

公开(公告)日：2013-11-26

申请号：US13562639

申请日：2012-07-31

申请人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

发明人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC分类号： H01L23/495

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.

摘要翻译： 非铅半导体器件包括用于密封半导体芯片的密封体，密封体内部的凸片，用于支撑凸片的悬挂引线，具有暴露于密封体的后表面的外边缘部分的各个表面的引线 以及形成在半导体芯片和引线上的焊盘连接焊盘。 位于密封体的外周部的悬架引线的端部未被暴露在密封体的背面，而被密封体覆盖。 悬挂引线的分离部分不会在树脂模制中形成。 当切割悬挂引线时，密封体的后表面的角部由具有比悬挂引线的切割余量宽的区域的切割模具中的保持器部分的平坦部分支撑，从而防止了树脂的碎裂 。

公开(公告)号：US20110204502A1

公开(公告)日：2011-08-25

申请号：US13101199

申请日：2011-05-05

申请人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

发明人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC分类号： H01L23/495

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).

摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体的内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。

公开(公告)号：US20080006916A1

公开(公告)日：2008-01-10

申请号：US11853798

申请日：2007-09-11

申请人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

发明人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/83 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).

摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。

公开(公告)号：US07691677B2

公开(公告)日：2010-04-06

申请号：US12277144

申请日：2008-11-24

申请人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

发明人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC分类号： H01L21/44

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).

摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。

公开(公告)号：US08513785B2

公开(公告)日：2013-08-20

申请号：US13101199

申请日：2011-05-05

申请人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

发明人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC分类号： H01L23/495

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).

摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。

公开(公告)号：US20130020691A1

公开(公告)日：2013-01-24

申请号：US13562639

申请日：2012-07-31

申请人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

发明人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC分类号： H01L23/495

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.

摘要翻译： 非铅半导体器件包括用于密封半导体芯片的密封体，密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于密封体的后表面的外边缘部分的各个表面的引线 以及形成在半导体芯片和引线上的焊盘连接焊盘。 位于密封体的外周部的悬架引线的端部未被暴露在密封体的背面，而被密封体覆盖。 悬挂引线的分离部分不会在树脂模制中形成。 当切割悬挂引线时，密封体的后表面的角部由具有比悬挂引线的切割余量宽的区域的切割模具中的保持器部分的平坦部分支撑，从而防止了树脂的碎裂 。

公开(公告)号：US08053875B2

公开(公告)日：2011-11-08

申请号：US12624309

申请日：2009-11-23

申请人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

发明人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC分类号： H01L23/495

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).

摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。

公开(公告)号：US07833833B2

公开(公告)日：2010-11-16

申请号：US12624342

申请日：2009-11-23

申请人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

发明人： Tadatoshi Danno ,  Hiroyoshi Taya ,  Yoshiharu Shimizu

IPC分类号： H01L21/44

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).