摘要:
A thermo-curable resin composition which contains (a) an aromatic polyamide oligomer having polymerizable unsaturated group(s) at both terminals or within side chain(s), (b) a maleimide compound and (c) an epoxy resin; and a copper foil laminate which comprises impregnating said composition into substrates, followed by bonding by co-pressing copper foils is provided. The copper-clad laminate of the present invention has excellent adhesiveness to copper foil, heat resistance and electrical properties.
摘要:
A method for producing a high molecular weight aliphatic polyester, wherein:(A) 100 parts by weight of polyester (a) with a number average molecular weight of at least 10,000, and a weight average molecular weight of at least 30,000, and with end-groups that are substantially hydroxyl groups, and with a melting point of at least 60.degree. C., the polyester (a) having been obtained by reacting the following three ingredients: (i) a glycol ingredient; (ii) an aliphatic dicarboxylic acid ingredient; and (iii) a trifunctional or tetrafunctional ingredient reacts with(B) 0.1-3 parts by weight of a poly-isocyanate in a melted state of the polyester (a).The method provides a high molecular weight aliphatic polyester which has good properties and a melt viscosity required for molding and forming and has a wide molecular weight distribution. The high molecular weight aliphatic polyester is applicable to a variety of fields, such as films, moldings and formings, fibers, etc.
摘要:
Aromatic polyamide oligomers containing polymerizable unsaturated groups are prepared by heating and reacting together an aromatic diisocyanate, an aromatic dicarboxylic acid and an unsaturated compound capable of reacting with the aromatic diisocyanate. The aromatic polyamide oligomers thus obtained have excellent molding processability and are useful as raw materials for thermosetting polyamides with enhanced mechanical strength and chemical stability at higher temperatures. The compositions comprising the aromatic polyamide oligomers and maleimide derivatives, further produce cured molded bodies with excellent heat resistance.