公开(公告)号：US20120306075A1

公开(公告)日：2012-12-06

申请号：US13440817

申请日：2012-04-05

申请人： TAE-HUN KIM ,  Dae-young Choi ,  Yang-hoon Ahn ,  Sun-hye Lee

发明人： TAE-HUN KIM ,  Dae-young Choi ,  Yang-hoon Ahn ,  Sun-hye Lee

IPC分类号： H01L23/498

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.

摘要翻译： 半导体封装装置包括：第一半导体封装，包括第一半导体芯片，第一基板，第一端子和第一信号传输介质;以及第二半导体封装，包括第二半导体芯片，第二基板，第二端子和 第二信号传送介质。 至少一个连接焊球的封装位于第一端子和第二端子之间。 第一焊球引导构件围绕第一基板的第一端子定位，并且包括用于引导封装连接焊球的形状的第一引导表面。

公开(公告)号：US08653640B2

公开(公告)日：2014-02-18

申请号：US13440817

申请日：2012-04-05

申请人： Tae-hun Kim ,  Dae-young Choi ,  Yang-hoon Ahn ,  Sun-hye Lee

发明人： Tae-hun Kim ,  Dae-young Choi ,  Yang-hoon Ahn ,  Sun-hye Lee

IPC分类号： H01L23/488

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.

摘要翻译： 半导体封装装置包括：第一半导体封装，包括第一半导体芯片，第一基板，第一端子和第一信号传输介质;以及第二半导体封装，包括第二半导体芯片，第二基板，第二端子和 第二信号传送介质。 至少一个连接焊球的封装位于第一端子和第二端子之间。 第一焊球引导构件围绕第一基板的第一端子定位，并且包括用于引导封装连接焊球的形状的第一引导表面。