公开(公告)号：US08252616B2

公开(公告)日：2012-08-28

申请号：US12905002

申请日：2010-10-14

申请人： Tai-Hui Liu

发明人： Tai-Hui Liu

IPC分类号： H01L21/00

CPC分类号： H01L31/0203 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

摘要： A package structure of photodiode and a forming method of the same are provided. The method includes providing a heat-dissipation plate; placing a circuit board on the heat-dissipation plate, the circuit board having an opening exposing a top surface of the heat-dissipation plate and a first contact pad located on a peripheral area of the opening; placing a carrier with a metal cladding surface into the opening, the carrier connecting the top surface of the heat-dissipation plate; placing a photodiode chip on the carrier wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed; and electrically connecting the exposed metal cladding surface to the first contact pad.

摘要翻译： 提供光电二极管的封装结构及其形成方法。 该方法包括提供散热板; 将电路板放置在所述散热板上，所述电路板具有暴露所述散热板的顶面的开口和位于所述开口的周边区域上的第一接触垫; 将具有金属包覆表面的载体放置在开口中，所述载体连接散热板的顶表面; 将光电二极管芯片放置在载体上，其中光电二极管芯片的底部区域小于金属包层表面，使得金属包层表面的一部分露出; 以及将暴露的金属包层表面电连接到第一接触垫。

公开(公告)号：US20110018081A1

公开(公告)日：2011-01-27

申请号：US12842792

申请日：2010-07-23

申请人： Chan Shin Wu ,  Tai-Hui Liu

发明人： Chan Shin Wu ,  Tai-Hui Liu

IPC分类号： H01L31/0232

CPC分类号： H01L31/022408 ,  H01L31/1035 ,  H01L31/1892 ,  Y02E10/50

摘要： A photodiode device and methods of manufacturing the same are provided. The photodiode device comprises a light adsorption layer defining a light-facing side and a back-light side; a via passing through the adsorption layer, the via defining a side wall and a bottom surface; a conformal isolation layer covering the side wall and the bottom surface; a first patterned conductive layer disposed on the back-light side, the first patterned conductive layer having a first portion covering a first portion of the conformation isolation layer; a second patterned conductive layer disposed on the light-facing side of the adsorption layer; and an opening through the conformal isolation layer, wherein the opening is filled with the second patterned conductive layer such that the second patterned conductive layer is connected with the first portion of the first patterned conductive layer.

摘要翻译： 提供光电二极管装置及其制造方法。 光电二极管装置包括限定面向光的侧面和背光侧的光吸收层; 穿过吸附层的通孔，通孔限定侧壁和底表面; 覆盖侧壁和底面的保形隔离层; 设置在背光侧的第一图案化导电层，第一图案化导电层具有覆盖构象隔离层的第一部分的第一部分; 布置在吸附层的面向光侧的第二图案化导电层; 以及通过共形隔离层的开口，其中开口填充有第二图案化导电层，使得第二图案化导电层与第一图案化导电层的第一部分连接。

公开(公告)号：US08253176B2

公开(公告)日：2012-08-28

申请号：US12842792

申请日：2010-07-23

申请人： Chan Shin Wu ,  Tai-Hui Liu

发明人： Chan Shin Wu ,  Tai-Hui Liu

IPC分类号： H01L27/148

CPC分类号： H01L31/022408 ,  H01L31/1035 ,  H01L31/1892 ,  Y02E10/50

摘要： A photodiode device and methods of manufacturing the same are provided. The photodiode device comprises a light absorption layer defining a light-facing side and a back-light side; a via passing through the absorption layer, the via defining a side wall and a bottom surface; a conformal isolation layer covering the side wall and the bottom surface; a first patterned conductive layer disposed on the back-light side, the first patterned conductive layer having a first portion covering a first portion of the conformation isolation layer; a second patterned conductive layer disposed on the light-facing side of the absorption layer; and an opening through the conformal isolation layer, wherein the opening is filled with the second patterned conductive layer such that the second patterned conductive layer is connected with the first portion of the first patterned conductive layer.

摘要翻译： 提供光电二极管装置及其制造方法。 光电二极管装置包括限定面向光的侧面和背光侧的光吸收层; 穿过吸收层的通孔，通孔限定侧壁和底表面; 覆盖侧壁和底面的保形隔离层; 设置在背光侧的第一图案化导电层，第一图案化导电层具有覆盖构象隔离层的第一部分的第一部分; 设置在所述吸收层的面向光侧的第二图案化导电层; 以及通过共形隔离层的开口，其中开口填充有第二图案化导电层，使得第二图案化导电层与第一图案化导电层的第一部分连接。