Method of manufacturing a substrate for liquid ejection head
    1.
    发明授权
    Method of manufacturing a substrate for liquid ejection head 有权
    液体喷射头用基板的制造方法

    公开(公告)号:US08435805B2

    公开(公告)日:2013-05-07

    申请号:US13215492

    申请日:2011-08-23

    IPC分类号: H01L21/00

    摘要: Provided is a method of manufacturing a substrate for liquid ejection head, including: forming a groove portion by etching on one surface side of a silicon substrate, the groove portion being formed so as to surround a portion at which a liquid supply port is to be formed on an inner side of the groove portion; forming a protective layer on the one surface side of the silicon substrate, the protective layer being formed inside the groove portion and on an outer side of the groove portion; and forming the liquid supply port by subjecting the silicon substrate to crystal anisotropic etching treatment with use of the protective layer as a mask.

    摘要翻译: 本发明提供一种液体喷射头用基材的制造方法,其特征在于,包括:通过在硅基板的一个表面侧进行蚀刻来形成槽部,所述槽部形成为包围供给口的部分 形成在所述槽部的内侧; 在所述硅基板的一个表面侧上形成保护层,所述保护层形成在所述槽部内部和所述槽部的外侧; 以及通过使用保护层作为掩模对硅衬底进行结晶各向异性蚀刻处理来形成液体供给口。

    PROCESSING METHOD OF SILICON SUBSTRATE AND PROCESS FOR PRODUCING LIQUID EJECTION HEAD
    2.
    发明申请
    PROCESSING METHOD OF SILICON SUBSTRATE AND PROCESS FOR PRODUCING LIQUID EJECTION HEAD 审中-公开
    硅基板的加工方法和生产液体喷射头的方法

    公开(公告)号:US20120088317A1

    公开(公告)日:2012-04-12

    申请号:US13226113

    申请日:2011-09-06

    IPC分类号: H01L21/308

    摘要: A processing method of a silicon substrate, including forming on a back surface of a silicon substrate an etching mask layer having an opening portion, measuring a thickness of the silicon substrate, irradiating the opening portion in the etching mask layer with laser from the back surface of the silicon substrate to form in the silicon substrate a modified layer with a thickness that is varied according to the measured thickness of the silicon substrate, carrying out anisotropic etching with regard to the silicon substrate having the modified layer formed therein to form in the back surface a depressed portion which does not pass through the silicon substrate and which has a bottom surface in the silicon substrate, and carrying out dry etching in the depressed portion to form a through-hole passing from the bottom surface of the depressed portion to a front surface of the silicon substrate.

    摘要翻译: 一种硅衬底的处理方法,包括在硅衬底的背表面上形成具有开口部分的蚀刻掩模层,测量硅衬底的厚度,用激光从背面照射蚀刻掩模层中的开口部分 的硅衬底,以在硅衬底中形成具有根据测量的硅衬底的厚度而变化的厚度的改性层,相对于其中形成有改性层的硅衬底进行各向异性蚀刻以在背面形成 表面没有通过硅衬底并且在硅衬底中具有底表面的凹陷部分,并且在凹陷部分中进行干蚀刻以形成从凹陷部分的底表面到前面的通孔 硅衬底的表面。

    METHOD OF MANUFACTURING A SUBSTRATE FOR LIQUID EJECTION HEAD
    5.
    发明申请
    METHOD OF MANUFACTURING A SUBSTRATE FOR LIQUID EJECTION HEAD 有权
    液体喷射头基板的制造方法

    公开(公告)号:US20120058578A1

    公开(公告)日:2012-03-08

    申请号:US13215492

    申请日:2011-08-23

    IPC分类号: H01L21/306

    摘要: Provided is a method of manufacturing a substrate for liquid ejection head, including: forming a groove portion by etching on one surface side of a silicon substrate, the groove portion being formed so as to surround a portion at which a liquid supply port is to be formed on an inner side of the groove portion; forming a protective layer on the one surface side of the silicon substrate, the protective layer being formed inside the groove portion and on an outer side of the groove portion; and forming the liquid supply port by subjecting the silicon substrate to crystal anisotropic etching treatment with use of the protective layer as a mask.

    摘要翻译: 本发明提供一种液体喷射头用基材的制造方法,其特征在于,包括:通过在硅基板的一个表面侧进行蚀刻来形成槽部,所述槽部形成为包围供给口的部分 形成在所述槽部的内侧; 在所述硅基板的一个表面侧上形成保护层,所述保护层形成在所述槽部内部和所述槽部的外侧; 以及通过使用保护层作为掩模对硅衬底进行结晶各向异性蚀刻处理来形成液体供给口。

    METHOD OF PRODUCING SUBSTRATE FOR LIQUID EJECTION HEAD
    9.
    发明申请
    METHOD OF PRODUCING SUBSTRATE FOR LIQUID EJECTION HEAD 有权
    生产用于液体喷射头的基材的方法

    公开(公告)号:US20120267342A1

    公开(公告)日:2012-10-25

    申请号:US13433806

    申请日:2012-03-29

    IPC分类号: B44C1/22

    摘要: A substrate for a liquid ejection head, including: forming a sacrifice layer on a first surface of a silicon substrate in a region in which a liquid supply port is to open, the sacrifice layer containing aluminum which is selectively etched with respect to the silicon substrate; forming an etching mask on a second surface which is a rear surface of the first surface of the silicon substrate, the etching mask having an opening corresponding to the sacrifice layer; a first etching step of etching the silicon substrate by using the etching mask as a mask and by using a first etchant containing 8 mass % or more and less than 15 mass % of tetramethylammonium hydroxide; and after the first etching step, a second etching step of removing the sacrifice layer by using a second etchant containing 15 mass % or more and 25 mass % or less of tetramethylammonium hydroxide.

    摘要翻译: 一种液体喷射头用基材,其特征在于,包括:在液体供给口打开的区域的硅基板的第一面上形成牺牲层,所述牺牲层含有相对于所述硅基板有选择地蚀刻的铝 ; 在作为硅衬底的第一表面的后表面的第二表面上形成蚀刻掩模,所述蚀刻掩模具有对应于所述牺牲层的开口; 通过使用蚀刻掩模作为掩模蚀刻硅衬底并使用含有8质量%以上且小于15质量%的四甲基氢氧化铵的第一蚀刻剂的第一蚀刻步骤; 并且在第一蚀刻步骤之后,通过使用含有15质量%以上且25质量%以下的四甲基氢氧化铵的第二蚀刻剂除去牺牲层的第二蚀刻工序。