公开(公告)号：US20240395571A1

公开(公告)日：2024-11-28

申请号：US18790969

申请日：2024-07-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chien-Lung Chen ,  Chien-Chi Tzeng ,  Meng-Fu Shih ,  Hu-Wei Lin

IPC: H01L21/67 ,  H01L21/677

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

公开(公告)号：US20230377910A1

公开(公告)日：2023-11-23

申请号：US17751185

申请日：2022-05-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chien-Lung Chen ,  Chien-Chi Tzeng ,  Meng-Fu Shih ,  Hu-Wei Lin

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67051 ,  H01L21/67121 ,  H01L21/67706 ,  H01L21/67742

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

公开(公告)号：US20230351577A1

公开(公告)日：2023-11-02

申请号：US17730585

申请日：2022-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： I-Hsuan Chen ,  Ying-Hao Wang ,  Chien-Lung Chen ,  Chien-Chi Tzeng ,  Hu-Wei Lin

IPC: G01N21/95 ,  G01N1/44 ,  G01N35/00 ,  H04N5/372 ,  H01L21/66 ,  G06T7/00 ,  G06T7/70

CPC classification number: G06T7/0004 ,  G01N1/44 ,  G01N21/9501 ,  G01N35/00 ,  G06T7/70 ,  H01L22/12 ,  H04N5/372 ,  G01N2035/00346 ,  G06T2207/30148

Abstract: A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.