公开(公告)号：US09899982B2

公开(公告)日：2018-02-20

申请号：US14948477

申请日：2015-11-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming Hsien Tsai ,  Chien-Min Lin ,  Fu-Lung Hsueh ,  Han-Ping Pu ,  Sa-Lly Liu ,  Sen-Kuei Hsu

IPC: H01L29/93 ,  H01L23/528 ,  H01L23/522 ,  H03H1/00 ,  H03H7/01

CPC classification number: H03H1/0007 ,  H01L23/5223 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/5286 ,  H01L29/93 ,  H03H7/0115

Abstract: An integrated circuit (IC) die for electromagnetic band gap (EBG) noise suppression is provided. A power mesh and a ground mesh are stacked within a back end of line (BEOL) region overlying a semiconductor substrate, and an inductor is arranged over the power and ground meshes. The inductor comprises a plurality of inductor segments stacked upon one another and connected end to end to define a length of the inductor. A capacitor underlies the power and ground meshes, and is connected in series with the inductor. Respective terminals of the capacitor and the inductor are respectively coupled to the power and ground meshes. A method for manufacturing the IC die is also provided.

公开(公告)号：US20170149404A1

公开(公告)日：2017-05-25

申请号：US14948477

申请日：2015-11-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming Hsien Tsai ,  Chien-Min Lin ,  Fu-Lung Hsueh ,  Han-Ping Pu ,  Sa-Lly Liu ,  Sen-Kuei Hsu

IPC: H03H1/00 ,  H03H7/01 ,  H01L29/93 ,  H01L23/528 ,  H01L23/522

CPC classification number: H03H1/0007 ,  H01L23/5223 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/5286 ,  H01L29/93 ,  H03H7/0115

Abstract: An integrated circuit (IC) die for electromagnetic band gap (EBG) noise suppression is provided. A power mesh and a ground mesh are stacked within a back end of line (BEOL) region overlying a semiconductor substrate, and an inductor is arranged over the power and ground meshes. The inductor comprises a plurality of inductor segments stacked upon one another and connected end to end to define a length of the inductor. A capacitor underlies the power and ground meshes, and is connected in series with the inductor. Respective terminals of the capacitor and the inductor are respectively coupled to the power and ground meshes. A method for manufacturing the IC die is also provided.

公开(公告)号：US08921160B2

公开(公告)日：2014-12-30

申请号：US13945169

申请日：2013-07-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ping-Lin Yang ,  Sa-Lly Liu ,  Chien-Min Lin

IPC: H01L21/00 ,  H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L23/522

CPC classification number: H01L24/82 ,  H01L23/3677 ,  H01L23/48 ,  H01L23/5227 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/05647 ,  H01L2924/00014

Abstract: A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.

Abstract translation: 封装包括具有至少两个堆叠管芯的管芯堆叠，用于彼此进行非接触式通信。 堆叠的模具中的至少一个具有连接到其主面的衬底。 衬底在衬底中或衬底上具有多个导电迹线，用于向裸片传导功率并且用于从模具传导热量。 至少一个导电柱与基板的至少第一边缘上的导电迹线中的至少一个接合，用于将功率传导到至少一个管芯并且用于从至少一个管芯传导热量。