公开(公告)号：US20230408393A1

公开(公告)日：2023-12-21

申请号：US17749056

申请日：2022-05-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： En Tian LIN ,  Chih-Chiang TSENG ,  Chwen YU ,  Chiao-Ling WENG

IPC: G01N15/08 ,  H01L21/67 ,  B01D65/02 ,  B01D65/10 ,  B01D63/06

CPC classification number: G01N15/08 ,  H01L21/67017 ,  B01D65/02 ,  B01D65/10 ,  B01D63/067 ,  B01D2321/2058 ,  B01D2313/44 ,  B01D2313/18 ,  B01D2313/50 ,  B01D2321/04 ,  B01D2321/40 ,  G01N2015/084

Abstract: The present disclosure is directed to various methods and systems for monitoring real time efficiency of filters as well as testing the filters with tests that are similar to real world use of the filters to update technical specifications of the filters. The methods and systems monitoring the real time efficiency of the filters may utilize one or more particle counters to monitor their efficiency in real time. The data collected by the particle counters may be utilized to determine whether respective ones of the filters need to be replaced or regenerated by a backwash regeneration process. The updated technical specifications from the real world testing of the filters may be utilized in determining whether respective ones of the filters need to be replaced or regenerated. These real world testing and real time monitoring reduces the likelihood that workpieces are exposed to contaminant particles reducing scrap costs.

公开(公告)号：US20160089765A1

公开(公告)日：2016-03-31

申请号：US14502917

申请日：2014-09-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： I-Chen CHIANG ,  Hwai-Te CHIU ,  Yi-Tsang CHEN ,  Chih-Chiang TSENG ,  Yung-Long CHEN

IPC: B24B57/04

Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.

Abstract translation: 提供了浆料分散系统，包括浆料源系统，在线分析仪和控制器。 浆料源系统提供用于化学机械抛光（CMP）工艺的浆料。 在线分析仪测量从浆料分散系统取样的采样浆料的至少一个参数，并且基于参数产生指示信号，其中指示信号至少表示浆料的一个特征。 控制器接收指示信号，并根据指示信号产生一个控制信号，用于对泥浆分散系统进行实时控制，以控制浆料的质量。

公开(公告)号：US20200298371A1

公开(公告)日：2020-09-24

申请号：US16894649

申请日：2020-06-05

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： I-Chen CHIANG ,  Hwai-Te CHIU ,  Yi-Tsang CHEN ,  Chih-Chiang TSENG ,  Yung-Long CHEN

IPC: B24B57/04

Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.

公开(公告)号：US20240009803A1

公开(公告)日：2024-01-11

申请号：US18474165

申请日：2023-09-25

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： I-Chen CHIANG ,  Hwai-Te CHIU ,  Yi-Tsang CHEN ,  Chih-Chiang TSENG ,  Yung-Long CHEN

IPC: B24B57/04

CPC classification number: B24B57/04 ,  Y02P70/10

Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least large particle count (LPC) value of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the LPC value, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.

公开(公告)号：US20210362291A1

公开(公告)日：2021-11-25

申请号：US16952730

申请日：2020-11-19

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chwen YU ,  Chih-Chiang TSENG ,  Yi-Chung LAI ,  Tzu-Sou CHUANG ,  Yun-Ju CHIA

IPC: B24B37/04 ,  C04B38/00 ,  C04B41/00 ,  C04B41/48 ,  C04B41/83 ,  B01D63/08 ,  B01D63/06 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01D65/02 ,  H01L21/67

Abstract: A filter device includes one or more filter membranes, and a filter housing enclosing the one or more filter membranes. Each of the filter membranes includes a base membrane made of a ceramic material, and a plurality of through holes. The base membrane is coated with a coating material.

公开(公告)号：US20130019954A1

公开(公告)日：2013-01-24

申请号：US13628134

申请日：2012-09-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chiang TSENG ,  Yung-Long CHEN ,  Liang-Chieh HUANG ,  Yi-Wen HUANG

IPC: F17D1/00

CPC classification number: B24B37/04 ,  B24B57/02 ,  G01F11/28 ,  Y10T137/0318 ,  Y10T137/0324 ,  Y10T137/0363 ,  Y10T137/8593 ,  Y10T137/86131

Abstract: A slurry feed system suitable for chemical mechanical planarization (CMP) processes in a semiconductor fabrication facility and related method. The slurry feed system includes a valve manifold box having a discharge piping header fluidly connected to at least one CMP station and a first slurry supply train. The first slurry supply train may include a slurry mixing tank, day tank, and at least two slurry feed pumps arranged in series pumping relationship. The first slurry supply train defines a first slurry piping loop. In one embodiment, a second slurry supply train defining a second slurry piping loop is provided. The valve manifold box is operable to supply slurry from either or both of the first and second slurry piping loops to the CMP station.

Abstract translation: 一种适用于半导体制造设备中化学机械平面化（CMP）工艺的浆料进料系统及相关方法。 浆料进料系统包括具有流体连接到至少一个CMP站和第一浆料供应列的排放管道集管的阀歧管箱。 第一浆料供应系统可以包括浆料混合罐，日间罐和串联泵送关系中布置的至少两个浆料进料泵。 第一浆料供应列车定义了第一浆料管道回路。 在一个实施例中，提供了限定第二浆料管道回路的第二浆料供给列。 阀歧管箱可操作以从第一和第二浆料管道回路中的一个或两个供应浆料到CMP站。