公开(公告)号：US11508596B2

公开(公告)日：2022-11-22

申请号：US16886115

申请日：2020-05-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Cheng-Lung Wu ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: G03F1/66 ,  H01L21/677

Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

公开(公告)号：US11295973B2

公开(公告)日：2022-04-05

申请号：US16787028

申请日：2020-02-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau Wu ,  Cheng-Lung Wu ,  Jiun-Rong Pai ,  Cheng-Kang Hu

IPC: H01L21/677 ,  H01L21/67

Abstract: An apparatus and an operating method for automated wafer carrier handling are provided. The apparatus includes a base frame and an engaging mechanism disposed on the base frame. The engaging mechanism includes a controller and an active expansion component moveably coupled to the base frame and controlled by the controller to perform a reciprocating movement relative to the base frame. The active expansion component is driven by the controller to pass through the base frame to be engaged with a top flange mounted on the wafer carrier.

公开(公告)号：US20210375653A1

公开(公告)日：2021-12-02

申请号：US16886115

申请日：2020-05-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Cheng-Lung Wu ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: H01L21/677

Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

公开(公告)号：US20230063707A1

公开(公告)日：2023-03-02

申请号：US17984096

申请日：2022-11-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Cheng-Lung Wu ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: H01L21/677

Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

公开(公告)号：US09899441B1

公开(公告)日：2018-02-20

申请号：US15337224

申请日：2016-10-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Hung Cheng ,  Cheng-Lung Wu ,  Tung-I Lin ,  Yeur-Luen Tu

IPC: H01L31/0232 ,  H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14645 ,  H01L27/14689 ,  H01L27/14698

Abstract: A method for manufacturing a deep trench isolation (DTI) structure with a tri-layer passivation layer is provided. An etch is performed into a semiconductor substrate to form a trench. A first undoped semiconductor layer is formed by epitaxy lining surfaces of the semiconductor substrate that define the trench. A doped semiconductor layer is formed by epitaxy over and lining the first undoped semiconductor layer in the trench. A second undoped semiconductor layer is formed by epitaxy over and lining the doped semiconductor layer in the trench. A structure resulting from the method is also provided.

公开(公告)号：US20210249282A1

公开(公告)日：2021-08-12

申请号：US16787028

申请日：2020-02-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau Wu ,  Cheng-Lung Wu ,  Jiun-Rong Pai ,  Cheng-Kang Hu

IPC: H01L21/677 ,  H01L21/67

Abstract: An apparatus and an operating method for automated wafer carrier handling are provided. The apparatus includes a base frame and an engaging mechanism disposed on the base frame. The engaging mechanism includes a controller and an active expansion component moveably coupled to the base frame and controlled by the controller to perform a reciprocating movement relative to the base frame. The active expansion component is driven by the controller to pass through the base frame to be engaged with a top flange mounted on the wafer carrier.