公开(公告)号：US09812381B1

公开(公告)日：2017-11-07

申请号：US15201604

申请日：2016-07-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chi-Hsi Wu ,  Chun-Yi Liu ,  Der-Chyang Yeh ,  Hsien-Wei Chen ,  Shih-Peng Tai ,  Chuen-De Wang

IPC: H01L21/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L25/065

CPC classification number: H01L23/49527 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/4952 ,  H01L23/49589 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18162 ,  H01L2924/19011

Abstract: An integrated fan-out package is described. The integrated fan-out package comprises a first die and a second die arranged adjacent to each other. A molding compound encapsulates the first and second dies. A redistribution structure is disposed over the molding compound and on the first and second dies. The redistribution structure comprises a first connection structure electrically connected to the first die, a second connection structure electrically connected to the second die and an inter-dielectric layer located between the first and second connection structures and separating the first connection structure from the second connection structure. The ball pad is disposed on the redistribution structure and electrically connected with the first die or the second die. The bridge structure is disposed on the first connection structure and on the second connection structure and electrically connects the first die with the second die.

公开(公告)号：US20170345741A1

公开(公告)日：2017-11-30

申请号：US15201604

申请日：2016-07-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chi-Hsi Wu ,  Chun-Yi Liu ,  Der-Chyang Yeh ,  Hsien-Wei Chen ,  Shih-Peng Tai ,  Chuen-De Wang

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/49527 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/4952 ,  H01L23/49589 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18162 ,  H01L2924/19011

Abstract: An integrated fan-out package is described. The integrated fan-out package comprises a first die and a second die arranged adjacent to each other. A molding compound encapsulates the first and second dies. A redistribution structure is disposed over the molding compound and on the first and second dies. The redistribution structure comprises a first connection structure electrically connected to the first die, a second connection structure electrically connected to the second die and an inter-dielectric layer located between the first and second connection structures and separating the first connection structure from the second connection structure. The ball pad is disposed on the redistribution structure and electrically connected with the first die or the second die. The bridge structure is disposed on the first connection structure and on the second connection structure and electrically connects the first die with the second die.