公开(公告)号：US11251064B2

公开(公告)日：2022-02-15

申请号：US16807026

申请日：2020-03-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  I-Lun Yang ,  Chih-Hung Huang ,  Jiun-Rong Pai ,  Chung-Hsin Chien ,  Yang-Ann Chu

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677

Abstract: A wafer sorting and stoking system provides automated storage and retrieval of wafer frames carrying semiconductor wafers. A wafer frame cassette is received at a transfer port from a transfer system. A robot arm retrieves the wafer frames from the cassette and stores each wafer frame in a respective storage slot in one of a plurality of storage towers. The storage location of each wafer frame is recorded. Each wafer frame can be selectively retrieved and loaded into a wafer frame cassette by the robot arm for further processing.

公开(公告)号：US12300532B2

公开(公告)日：2025-05-13

申请号：US17574302

申请日：2022-01-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  I-Lun Yang ,  Chih-Hung Huang ,  Jiun-Rong Pai ,  Chung-Hsin Chien ,  Yang-Ann Chu

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677

Abstract: A wafer sorting and stoking system provides automated storage and retrieval of wafer frames carrying semiconductor wafers. A wafer frame cassette is received at a transfer port from a transfer system. A robot arm retrieves the wafer frames from the cassette and stores each wafer frame in a respective storage slot in one of a plurality of storage towers. The storage location of each wafer frame is recorded. Each wafer frame can be selectively retrieved and loaded into a wafer frame cassette by the robot arm for further processing.

公开(公告)号：US20210272837A1

公开(公告)日：2021-09-02

申请号：US16807026

申请日：2020-03-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  I-Lun Yang ,  Chih-Hung Huang ,  Jiun-Rong Pai ,  Chung-Hsin Chien ,  Yang-Ann Chu

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677

Abstract: A wafer sorting and stoking system provides automated storage and retrieval of wafer frames carrying semiconductor wafers. A wafer frame cassette is received at a transfer port from a transfer system. A robot arm retrieves the wafer frames from the cassette and stores each wafer frame in a respective storage slot in one of a plurality of storage towers. The storage location of each wafer frame is recorded. Each wafer frame can be selectively retrieved and loaded into a wafer frame cassette by the robot arm for further processing.

公开(公告)号：US11004720B2

公开(公告)日：2021-05-11

申请号：US15987581

申请日：2018-05-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Jian-Hung Chen ,  Meng-Chen Lin ,  Chung-Hsin Chien ,  Hsuan Lee ,  Boris Huang

IPC: H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

Abstract: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.