公开(公告)号：US10109618B2

公开(公告)日：2018-10-23

申请号：US15628745

申请日：2017-06-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： James Hu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/76 ,  H01L25/10 ,  H01L29/00 ,  H01L29/18 ,  H01L29/12 ,  H01L25/00

Abstract: A semiconductor device package is provided. The semiconductor device package includes a first substrate and a conductive element fared on the first substrate. The conductive element has a recess away from the first substrate, and the recess has a first depth greater than a second depth from a top surface of the conductive element to a center of the conductive element semiconductor device package includes a conductive connector bonded to the conductive element, and a melting point of the conductive element is higher than a melting point of the conductive connector, and the conductive connector is filled into the recess of the conductive element.

公开(公告)号：US09691745B2

公开(公告)日：2017-06-27

申请号：US13927568

申请日：2013-06-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： James Hu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L29/24 ,  H01L21/76 ,  H01L25/04 ,  H01L25/00 ,  H01L25/10

CPC classification number: H01L25/50 ,  H01L25/105 ,  H01L2224/11 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0001

Abstract: Embodiments of mechanisms of a semiconductor device package and package on package (PoP) structure are provided. The semiconductor device package includes a substrate and a metal pad formed on the substrate. The semiconductor device package further includes a conductive element formed on the metal pad, and the metal pad electrically contacts the conductive element, and at least a portion of the conductive element is embedded in a molding compound, and the conductive element has a recess configured to provide an additional bonding interfacial area.