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公开(公告)号:US10802406B2
公开(公告)日:2020-10-13
申请号:US16535003
申请日:2019-08-07
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chieh Hsieh , Kuan-Hung Chen , Chun-Chia Hsu , Shang-Chieh Chien , Liu Bo-Tsun , Li-Jui Chen , Po-Chung Cheng
Abstract: An apparatus for generating extreme ultraviolet (EUV) radiation includes a droplet generator configured to generate target droplets. An excitation laser is configured to heat the target droplets using excitation pulses to convert the target droplets to plasma. An energy detector is configured to measure a variation in EUV energy generated when the target droplets are converted to plasma. A feedback controller is configured to adjust parameters of the droplet generator and/or the excitation laser based on the variation in EUV energy.
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公开(公告)号:US20230066360A1
公开(公告)日:2023-03-02
申请号:US17659048
申请日:2022-04-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Kuan-Hung Chen , Hong-Seng Shue , Po-Hao Tsai , Mirng-Ji Lii
IPC: H01L23/10 , H01L21/50 , H01L21/762 , H01L23/522
Abstract: A method includes forming a plurality of dielectric layers, forming a lower portion of a seal ring including a plurality of metal layers, each extending into one of the plurality of dielectric layers, depositing a first passivation layer over the plurality of dielectric layers, forming an opening in the first passivation layer, forming a via ring in the opening and physically contacting the lower portion of the seal ring, and forming a metal ring over the first passivation layer and joined to the via ring. The via ring and the metal ring form an upper portion of the seal ring. The metal ring includes an edge portion having a zigzag pattern. The method further includes forming a second passivation layer on the metal ring, and performing a singulation process to form a device die, with the seal ring being proximate edges of the device die.
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公开(公告)号:US11269257B2
公开(公告)日:2022-03-08
申请号:US17068197
申请日:2020-10-12
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chieh Hsieh , Kuan-Hung Chen , Chun-Chia Hsu , Shang-Chieh Chien , Bo-Tsun Liu , Li-Jui Chen , Po-Chung Cheng
Abstract: An apparatus for generating extreme ultraviolet (EUV) radiation includes a droplet generator configured to generate target droplets. An excitation laser is configured to heat the target droplets using excitation pulses to convert the target droplets to plasma. An energy detector is configured to measure a variation in EUV energy generated when the target droplets are converted to plasma. A feedback controller is configured to adjust parameters of the droplet generator and/or the excitation laser based on the variation in EUV energy.
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公开(公告)号:US20240363457A1
公开(公告)日:2024-10-31
申请号:US18767481
申请日:2024-07-09
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Kuan-Hung Chen , Hong-Seng Shue , Po-Hao Tsai , Mirng-Ji Lii
IPC: H01L23/10 , H01L21/50 , H01L21/762 , H01L23/522
CPC classification number: H01L23/10 , H01L21/50 , H01L21/76297 , H01L23/5226
Abstract: A method includes forming a plurality of dielectric layers, forming a lower portion of a seal ring including a plurality of metal layers, each extending into one of the plurality of dielectric layers, depositing a first passivation layer over the plurality of dielectric layers, forming an opening in the first passivation layer, forming a via ring in the opening and physically contacting the lower portion of the seal ring, and forming a metal ring over the first passivation layer and joined to the via ring. The via ring and the metal ring form an upper portion of the seal ring. The metal ring includes an edge portion having a zigzag pattern. The method further includes forming a second passivation layer on the metal ring, and performing a singulation process to form a device die, with the seal ring being proximate edges of the device die.
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公开(公告)号:US12087648B2
公开(公告)日:2024-09-10
申请号:US17659048
申请日:2022-04-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Kuan-Hung Chen , Hong-Seng Shue , Po-Hao Tsai , Mirng-Ji Lii
IPC: H01L23/10 , H01L21/50 , H01L21/762 , H01L23/522
CPC classification number: H01L23/10 , H01L21/50 , H01L21/76297 , H01L23/5226
Abstract: A method includes forming a plurality of dielectric layers, forming a lower portion of a seal ring including a plurality of metal layers, each extending into one of the plurality of dielectric layers, depositing a first passivation layer over the plurality of dielectric layers, forming an opening in the first passivation layer, forming a via ring in the opening and physically contacting the lower portion of the seal ring, and forming a metal ring over the first passivation layer and joined to the via ring. The via ring and the metal ring form an upper portion of the seal ring. The metal ring includes an edge portion having a zigzag pattern. The method further includes forming a second passivation layer on the metal ring, and performing a singulation process to form a device die, with the seal ring being proximate edges of the device die.
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公开(公告)号:US11166361B2
公开(公告)日:2021-11-02
申请号:US16697149
申请日:2019-11-26
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Kuan-Hung Chen , Shang-Chieh Chien , Li-Jui Chen , Po-Chung Cheng
Abstract: A lithography apparatus includes an extreme ultraviolet (EUV) scanner, an EUV source coupled to the EUV scanner, a quartz crystal microbalance and a feedback controller. The quartz crystal microbalance is disposed on an internal surface of at least one of the EUV source and the EUV scanner. The feedback controller is coupled to the quartz crystal microbalance and one or more of a radiation source, a droplet generator, and optical guide elements controlling the trajectory of the radiation source associated with the EUV source.
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公开(公告)号:US10859918B2
公开(公告)日:2020-12-08
申请号:US16261695
申请日:2019-01-30
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Kuan-Hung Chen , Chieh Hsieh , Shang-Chieh Chien , Li-Jui Chen , Po-Chung Cheng
IPC: G03F7/20
Abstract: A method for operating a semiconductor apparatus includes generating a plurality of target droplets, deforming the target droplets into a plurality of target plumes respectively, changing an orientation of at least one of the target plumes, and generating a plurality of EUV radiations from the target plumes respectively. At least one of the EUV radiations irradiates an area on the light collector different from other EUV radiations in response to the orientation of the at least one of the target plumes.
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公开(公告)号:US10925142B2
公开(公告)日:2021-02-16
申请号:US16149643
申请日:2018-10-02
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chun-Chia Hsu , Kuan-Hung Chen , Shang-Chieh Chien , Li-Jui Chen , Po-Chung Cheng
Abstract: An extreme ultraviolet (EUV) lithography system is provided. The EUV lithography system includes the above-mentioned extreme ultraviolet (EUV) radiation source. The EUV lithography system further includes a collector configured to collect and reflect the EUV radiation and a mask stage configured to secure an EUV mask. The EUV lithography system also includes a wafer stage configured to secure a semiconductor wafer. In addition, the EUV lithography system includes one or more optical modules configured to direct the EUV radiation from the radiation source to image an integrated circuit (IC) pattern defined on the EUV mask onto the semiconductor wafer.
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