公开(公告)号：US20210043443A1

公开(公告)日：2021-02-11

申请号：US16534310

申请日：2019-08-07

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Tung-He Chou ,  Sheng-Chau Chen ,  Ming-Tung Wu ,  Hsun-Chung Kuang

IPC分类号： H01L21/02 ,  B08B5/02 ,  B08B3/10 ,  H01L21/67 ,  H01L21/687

摘要： In some embodiments, the present disclosure relates to a wafer trimming and cleaning apparatus, which includes a blade that is configured to trim a damaged edge portion of a wafer, thereby defining a new sidewall of the wafer. The wafer trimming and cleaning apparatus further includes water nozzles and an air jet nozzle. The water nozzles are configured to apply deionized water to the new sidewall of the wafer to remove contaminant particles generated by the blade. The air jet nozzle is configured to apply pressurized gas to a first top surface area of the wafer to remove the contaminant particles generated by the blade. The first top surface area overlies the new sidewall of the wafer.

公开(公告)号：US20210193453A1

公开(公告)日：2021-06-24

申请号：US17088805

申请日：2020-11-04

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ming-Tung Wu ,  Hsun-Chung Kuang ,  Tung-He Chou

IPC分类号： H01L21/02 ,  B23K26/53 ,  B23K26/03 ,  H01L21/268 ,  H01L21/304 ,  H01L23/544 ,  H01L21/66

摘要： In some embodiments, the present disclosure relates to a method that includes aligning a stealth laser apparatus over a wafer using an infrared camera coupled to the stealth laser apparatus. The stealth laser apparatus is used to form a stealth damage region within the wafer that is continuously connected around the wafer and separates an inner region from an outer region of the wafer. The stealth damage region is also arranged at a first distance from an edge of the wafer and extends from a first depth to a second depth beneath a top surface of the wafer. Further, the method includes forming a groove in the wafer to separate the outer region from the inner region of the wafer. The outer region of the wafer is removed using a blade, and a top portion of the inner region of the wafer is removed using a grinding apparatus.

公开(公告)号：US09355882B2

公开(公告)日：2016-05-31

申请号：US14096217

申请日：2013-12-04

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ming-Tung Wu ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chia-Shiung Tsai

IPC分类号： H01L21/683 ,  B24B37/34 ,  H01L21/687 ,  B24B37/30 ,  B24B41/00 ,  H01L21/67

CPC分类号： H01L21/6838 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  H01L21/67288 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/68771

摘要： A wafer grinding system includes a robot arm having a suction board at one end and a table within reach of the robot arm. An upper surface of the table has a vacuum surface for sucking and holding wafers. A pusher coupled to the robot arm extends about the periphery of the suction board. The pusher flattens wafers against the upper surface of the table, allowing the table to hold by suction wafers that would otherwise be too bowed to be held in that way. Additionally, a table can have a vacuum area that is small in comparison to the wafers, which is another way of increasing the magnitude of wafer bow that can be tolerated. A grinding system can use the reduced vacuum area concept to allow the positioning table to hold bowed wafers and the pusher concept to allow the chuck tables to hold bowed wafers.

摘要翻译： 晶片研磨系统包括机器人臂，其在一端具有吸引板，在机器人手臂的范围内具有桌子。 桌子的上表面具有用于吸取和保持晶片的真空表面。 联接到机器人臂的推动器围绕吸板的周边延伸。 推动器使晶片抵靠桌子的上表面平坦化，从而允许桌子由吸着的晶片保持，否则将被太鞠躬不能以这种方式保持。 此外，桌子可以具有与晶片相比较小的真空区域，这是增加可以容忍的晶片弓的大小的另一种方式。 研磨系统可以使用减小的真空区域概念来允许定位台保持弓形晶片和推动器概念，以允许卡盘台保持弯曲的晶片。

公开(公告)号：US11901171B2

公开(公告)日：2024-02-13

申请号：US17088805

申请日：2020-11-04

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ming-Tung Wu ,  Hsun-Chung Kuang ,  Tung-He Chou

IPC分类号： H01L21/02 ,  B23K26/53 ,  B23K26/03 ,  H01L21/268 ,  H01L23/544 ,  H01L21/66 ,  H01L21/304 ,  B23K103/00

CPC分类号： H01L21/02021 ,  B23K26/032 ,  B23K26/53 ,  H01L21/268 ,  H01L21/3043 ,  H01L22/20 ,  H01L23/544 ,  B23K2103/56 ,  H01L2223/54426 ,  H01L2223/54493

摘要： In some embodiments, the present disclosure relates to a method that includes aligning a stealth laser apparatus over a wafer using an infrared camera coupled to the stealth laser apparatus. The stealth laser apparatus is used to form a stealth damage region within the wafer that is continuously connected around the wafer and separates an inner region from an outer region of the wafer. The stealth damage region is also arranged at a first distance from an edge of the wafer and extends from a first depth to a second depth beneath a top surface of the wafer. Further, the method includes forming a groove in the wafer to separate the outer region from the inner region of the wafer. The outer region of the wafer is removed using a blade, and a top portion of the inner region of the wafer is removed using a grinding apparatus.

公开(公告)号：US11081334B2

公开(公告)日：2021-08-03

申请号：US16534310

申请日：2019-08-07

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Tung-He Chou ,  Sheng-Chau Chen ,  Ming-Tung Wu ,  Hsun-Chung Kuang

IPC分类号： H01L21/02 ,  B08B5/02 ,  H01L21/687 ,  H01L21/67 ,  B08B3/10

摘要： In some embodiments, the present disclosure relates to a wafer trimming and cleaning apparatus, which includes a blade that is configured to trim a damaged edge portion of a wafer, thereby defining a new sidewall of the wafer. The wafer trimming and cleaning apparatus further includes water nozzles and an air jet nozzle. The water nozzles are configured to apply deionized water to the new sidewall of the wafer to remove contaminant particles generated by the blade. The air jet nozzle is configured to apply pressurized gas to a first top surface area of the wafer to remove the contaminant particles generated by the blade. The first top surface area overlies the new sidewall of the wafer.

公开(公告)号：US20150155196A1

公开(公告)日：2015-06-04

申请号：US14096217

申请日：2013-12-04

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ming-Tung Wu ,  Yuan- Chih Hsieh ,  Lan-Lin Chao ,  Chia-Shiung Tsai

IPC分类号： H01L21/683 ,  H01L21/687 ,  B24B37/34

CPC分类号： H01L21/6838 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  H01L21/67288 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/68771

摘要： A wafer grinding system includes a robot arm having a suction board at one end and a table within reach of the robot arm. An upper surface of the table has a vacuum surface for sucking and holding wafers. A pusher coupled to the robot arm extends about the periphery of the suction board. The pusher flattens wafers against the upper surface of the table, allowing the table to hold by suction wafers that would otherwise be too bowed to be held in that way. Additionally, a table can have a vacuum area that is small in comparison to the wafers, which is another way of increasing the magnitude of wafer bow that can be tolerated. A grinding system can use the reduced vacuum area concept to allow the positioning table to hold bowed wafers and the pusher concept to allow the chuck tables to hold bowed wafers.

摘要翻译： 晶片研磨系统包括机器人臂，其在一端具有吸引板，在机器人手臂的范围内具有桌子。 桌子的上表面具有用于吸取和保持晶片的真空表面。 联接到机器人臂的推动器围绕吸板的周边延伸。 推动器将晶片压平在桌子的上表面上，允许桌子由吸着的晶片保持，否则将被过度弯曲而不能以这种方式保持。 此外，桌子可以具有与晶片相比较小的真空区域，这是增加可以容忍的晶片弓的大小的另一种方式。 研磨系统可以使用减小的真空区域概念来允许定位台保持弓形晶片和推动器概念，以允许卡盘台保持弯曲的晶片。