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Patent Agency Ranking
1.发明申请METHOD FOR MONITORING USAGE OF A PHYSICAL VAPOR DEPOSITION (PVD) TARGET WITH AN ULTRASONIC TRANSDUCER 有权用超声波传感器监测物理气相沉积（PVD）目标的使用方法公开(公告)号：US20160376695A1
公开(公告)日：2016-12-29
申请号：US14750148
申请日：2015-06-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Tsung-Jen Yang , Cheng-Chieh Chen , Hong-Hsing Chou
CPC classification number: G01N29/07 , C23C14/3407 , C23C14/54 , C23C16/52 , G01B17/02 , G01N29/032 , G01N29/11 , G01N2291/011 , G01N2291/015 , G01N2291/0237 , G01N2291/02854 , G01N2291/103 , G01N2291/2697 , H01J37/32935 , H01J37/345 , H01J37/3479
Abstract: A system for semiconductor manufacturing that uses ultrasonic waves for estimating and monitoring a remaining service lifetime of a consumable element is provided. A consumable element comprises a front side arranged inside a process chamber and a back side, opposite the front side, arranged outside the process chamber. An ultrasonic transducer is arranged on the back side of the consumable element, and directed towards the front side of the consumable element. A monitoring unit is configured to estimate and monitor a remaining service lifetime of the consumable element using the ultrasonic transducer. A method for estimating and monitoring the remaining service lifetime of the consumable element using ultrasonic waves is also provided.
Abstract translation: 提供了一种使用超声波估计和监测可消耗元件的剩余使用寿命的半导体制造系统。 消耗元件包括布置在处理室内的前侧和设置在处理室外部的与前侧相对的后侧。 超声波换能器设置在可消耗元件的背面，朝向可消耗元件的前侧。 监视单元被配置为使用超声波换能器来估计和监视可消耗元件的剩余使用寿命。 还提供了一种使用超声波估计和监测消耗元件的剩余使用寿命的方法。
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公开(公告)号：US11488814B2
公开(公告)日：2022-11-01
申请号：US16596109
申请日：2019-10-08
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Tsung-Jen Yang , Yi-Zhen Chen , Chih-Pin Wang , Chao-Li Shih , Ching-Hou Su , Cheng-Yi Huang
Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.
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公开(公告)号：US12198910B2
公开(公告)日：2025-01-14
申请号：US18513313
申请日：2023-11-17
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Tsung-Jen Yang , Yi-Zhen Chen , Chih-Pin Wang , Chao-Li Shih , Ching-Hou Su , Cheng-Yi Huang
Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.
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公开(公告)号：US11854776B2
公开(公告)日：2023-12-26
申请号：US17876422
申请日：2022-07-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Tsung-Jen Yang , Yi-Zhen Chen , Chih-Pin Wang , Chao-Li Shih , Ching-Hou Su , Cheng-Yi Huang
CPC classification number: H01J37/3408 , C23C14/35 , H01J37/3458 , H01J2237/152
Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.
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公开(公告)号：US09791415B2
公开(公告)日：2017-10-17
申请号：US14750148
申请日：2015-06-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Tsung-Jen Yang , Cheng-Chieh Chen , Hong-Hsing Chou
IPC: C23C14/00 , G01N29/07 , C23C14/54 , G01B17/02 , G01N29/032 , G01N29/11 , C23C14/34 , C23C16/52 , H01J37/32 , H01J37/34
CPC classification number: G01N29/07 , C23C14/3407 , C23C14/54 , C23C16/52 , G01B17/02 , G01N29/032 , G01N29/11 , G01N2291/011 , G01N2291/015 , G01N2291/0237 , G01N2291/02854 , G01N2291/103 , G01N2291/2697 , H01J37/32935 , H01J37/345 , H01J37/3479
Abstract: A system for semiconductor manufacturing that uses ultrasonic waves for estimating and monitoring a remaining service lifetime of a consumable element is provided. A consumable element comprises a front side arranged inside a process chamber and a back side, opposite the front side, arranged outside the process chamber. An ultrasonic transducer is arranged on the back side of the consumable element, and directed towards the front side of the consumable element. A monitoring unit is configured to estimate and monitor a remaining service lifetime of the consumable element using the ultrasonic transducer. A method for estimating and monitoring the remaining service lifetime of the consumable element using ultrasonic waves is also provided.
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