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公开(公告)号:US11264088B2
公开(公告)日:2022-03-01
申请号:US16997857
申请日:2020-08-19
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Wei-Cheng Wu , Chih-Yu Lin , Kao-Cheng Lin , Wei-Min Chan , Yen-Huei Chen
IPC: G11C11/419 , G11C11/413 , H01L27/11 , G11C11/412
Abstract: A device is disclosed that includes a plurality of first memory cells, a plurality of second memory cells, a power circuit, and a header circuit. The power circuit is configured to provide a first power voltage via a conductive line for the plurality of first memory cells, and to provide a second power voltage, that is independent from the first power voltage, for the plurality of second memory cells. The header circuit is configured to provide, during the write operation, the first voltage smaller than the first power voltage, the second power voltage, or smaller than the first power voltage and the second power voltage, for corresponding memory cells of the plurality of first memory cells via the conductive line and for corresponding memory cells of the plurality of second memory cells. A circuit structure of the power circuit is different from a circuit structure of the header circuit.
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公开(公告)号:US10411019B2
公开(公告)日:2019-09-10
申请号:US15186446
申请日:2016-06-18
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Hidehiro Fujiwara , Wei-Min Chan , Chih-Yu Lin , Yen-Huei Chen , Hung-Jen Liao
IPC: H01L27/11 , H01L21/321 , H01L21/768 , H01L23/528
Abstract: A device is disclosed that includes a memory bit cell, a first word line, a pair of metal islands and a pair of connection metal lines. The first word line is disposed in a first metal layer and is electrically coupled to the memory bit cell. The pair of metal islands are disposed in the first metal layer at opposite sides of the word line and are electrically coupled to a power supply. The pair of connection metal lines are disposed in a second metal layer and are configured to electrically couple the metal islands to the memory bit cell respectively.
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公开(公告)号:US09997235B2
公开(公告)日:2018-06-12
申请号:US15336633
申请日:2016-10-27
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Wei-Cheng Wu , Chih-Yu Lin , Kao-Cheng Lin , Wei-Min Chan , Yen-Huei Chen
IPC: G11C5/14 , G11C7/00 , G11C11/419
CPC classification number: G11C11/419
Abstract: A device is disclosed that includes first memory cells, second memory cells, a first conductive line and a second conductive line. The first conductive line is electrically disconnected from the second conductive line. The first conductive line receives a first power voltage for the plurality of first memory cells. The second conductive line receives a second power voltage that is independent from the first power voltage, for the plurality of second memory cells.
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公开(公告)号:US11024633B2
公开(公告)日:2021-06-01
申请号:US16562299
申请日:2019-09-05
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Hidehiro Fujiwara , Wei-Min Chan , Chih-Yu Lin , Yen-Huei Chen , Hung-Jen Liao
IPC: H01L27/11 , H01L23/528 , H01L27/02 , H01L21/321 , H01L21/768
Abstract: A device is disclosed that includes a memory bit cell coupled to a bit line, a word line, a pair of metal islands and a pair of connection metal lines. The word line is electrically coupled to the memory bit cell and is elongated in a first direction. The pair of metal islands are disposed at opposite sides of the word line and are electrically coupled to a power supply. The pair of connection metal lines are elongated in a second direction, and are configured to electrically couple the pair of metal islands to the memory bit cell, respectively. The pair of connection metal lines are separated from the bit line in a layout view. A method of fabricating the device is also provided.
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公开(公告)号:US10770134B2
公开(公告)日:2020-09-08
申请号:US16202584
申请日:2018-11-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Chen Lin , Wei-Min Chan , Chih-Yu Lin , Shih-Lien Linus Lu , Yen-Huei Chen
IPC: G06F21/00 , G11C11/419 , G11C11/418 , H04L9/32 , G11C7/20 , G11C7/24 , G11C11/413 , G09C1/00 , G11C29/44
Abstract: A memory device includes a memory cell array comprising a plurality of memory cells wherein each of the plurality of memory cells is configured to be in a data state, and a physically unclonable function (PUF) generator. The PUF generator further includes a first sense amplifier, coupled to the plurality of memory cells, wherein while the plurality of memory cells are being accessed, the first sense amplifier is configured to compare accessing speeds of first and second memory cells of the plurality of memory cells, and based on the comparison, provide a first output signal for generating a first PUF signature.
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公开(公告)号:US20190096478A1
公开(公告)日:2019-03-28
申请号:US16202584
申请日:2018-11-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Chen LIN , Wei-Min Chan , Chih-Yu Lin , Shih-Lien Linus Lu , Yen-Huei Chen
IPC: G11C11/419 , H04L9/32 , G11C11/418 , G09C1/00 , G11C11/413 , G11C7/24 , G11C7/20 , G11C29/44
CPC classification number: G11C11/419 , G09C1/00 , G11C7/20 , G11C7/24 , G11C11/413 , G11C11/418 , G11C2029/4402 , H04L9/3278
Abstract: A memory device includes a memory cell array comprising a plurality of memory cells wherein each of the plurality of memory cells is configured to be in a data state, and a physically unclonable function (PUF) generator. The PUF generator further includes a first sense amplifier, coupled to the plurality of memory cells, wherein while the plurality of memory cells are being accessed, the first sense amplifier is configured to compare accessing speeds of first and second memory cells of the plurality of memory cells, and based on the comparison, provide a first output signal for generating a first PUF signature.
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公开(公告)号:US11012246B2
公开(公告)日:2021-05-18
申请号:US15259948
申请日:2016-09-08
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Lien Linus Lu , Wei-Min Chan , Chien-Chen Lin
IPC: H04L9/32 , G11C7/20 , G11C8/12 , H04L9/08 , G06F12/14 , G11C11/417 , G11C29/14 , G11C16/34 , G11C29/44
Abstract: A memory device includes a memory block comprises a plurality of bits, wherein at least a first bit of the plurality of bits presents an initial logic state each time it is powered on; a start-up circuit configured to power on and off the memory block N times, where N is an odd integer greater than 1, and wherein the at least first bit presents an initial state after each respective power cycle of the memory block; and an authentication circuit, coupled to the memory block, and comprising an election engine that is configured to elect an initial state that occurs (N+1)/2 or more times after N power cycles that are performed by the start-up circuit, as a majority initial logic state for the first bit.
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公开(公告)号:US10439827B2
公开(公告)日:2019-10-08
申请号:US15288382
申请日:2016-10-07
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Chen Lin , Shih-Lien Linus Lu , Wei-Min Chan
IPC: G11C11/419 , H04L9/32 , G06F12/14 , G06F21/44 , G06F21/73
Abstract: A memory device includes a memory block that includes a plurality of memory bits, wherein each bit is configured to present a first logical state; and an authentication circuit, coupled to the plurality of memory bits, wherein the authentication circuit is configured to access a first bit under either a reduced read margin or a reduced write margin condition to determine a stability of the first bit by detecting whether the first logical state flips to a second logical state, and based on the determined stability of at least the first bit, to generate a physically unclonable function (PUF) signature.
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公开(公告)号:US12245412B2
公开(公告)日:2025-03-04
申请号:US18362786
申请日:2023-07-31
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Hidehiro Fujiwara , Wei-Min Chan , Chih-Yu Lin , Yen-Huei Chen , Hung-Jen Liao
IPC: H10B10/00 , H01L21/321 , H01L21/768 , H01L23/528 , H01L27/02
Abstract: A device includes first and second gate electrodes, a word line and a first metal island. The first gate electrode corresponds to transistors of a memory cell. The second gate electrode is separated from the first gate electrode and corresponds to the transistors. The word line is coupled to the memory cell and located between the first and the second gate electrodes. The first metal island is configured to couple a first power supply to the memory cell. A first boundary of the first metal island is located between first and second boundaries of the first gate electrode and is located between first and second boundaries of the word line, and each of the first boundary of the first gate electrode and the first boundary of the word line is located between first and second boundaries of the first metal island.
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公开(公告)号:US11778802B2
公开(公告)日:2023-10-03
申请号:US17320091
申请日:2021-05-13
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Hidehiro Fujiwara , Wei-Min Chan , Chih-Yu Lin , Yen-Huei Chen , Hung-Jen Liao
IPC: H10B10/00 , H01L27/02 , H01L21/321 , H01L21/768 , H01L23/528
CPC classification number: H10B10/12 , H01L21/321 , H01L21/76838 , H01L23/5283 , H01L27/0207
Abstract: A device is disclosed that includes a fin structure disposed below a first metal layer, extending along a column direction, and corresponding to at least one transistor of a memory bit cell, a word line disposed in the first metal layer and extending along a row direction, a first metal island disposed in the first metal layer separated from the word line, and a first connection metal line disposed in a second metal layer above the first metal layer, extending along the column direction, and configured to couple a power supply through the first metal island to the fin structure. In a layout view, the first connection metal line is separated from the fin structure, and the fin structure crosses over the word line and the first metal island. A method is also disclosed herein.
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