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公开(公告)号:US20220139903A1
公开(公告)日:2022-05-05
申请号:US17086076
申请日:2020-10-30
发明人: Tao-Yi HUNG , Wun-Jie LIN , Jam-Wem LEE , Kuo-Ji CHEN , Chia-En HUANG
IPC分类号: H01L27/02 , H01L27/092 , H01L21/8238
摘要: A method for fabricating an integrated circuit is provided. The method includes etching a first recess in a semiconductor structure; forming a first doped epitaxial feature in the first recess; and forming a second doped epitaxial feature over the first doped epitaxial feature, wherein the second doped epitaxial feature has a conductive type opposite to a conductive type of the first doped epitaxial feature.
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公开(公告)号:US20210272984A1
公开(公告)日:2021-09-02
申请号:US17024351
申请日:2020-09-17
发明人: Chien Yao HUANG , Wun-Jie LIN , Kuo-Ji CHEN
IPC分类号: H01L27/118 , H01L27/02 , H01L27/092 , G06F30/392
摘要: An integrated circuit (IC) device includes a plurality of first TAP cells of a first semiconductor type, and a plurality of second TAP cells of a second semiconductor type different from the first semiconductor type. The plurality of first TAP cells is arranged in at least two columns, the at least two columns adjacent each other in a first direction and extending in a second direction transverse to the first direction. Each of the plurality of first TAP cells has a first length in the first direction. The plurality of second TAP cells includes at least one second TAP cell extending in the first direction between the at least two columns over a second length greater than the first length of each of the plurality of first TAP cells in the first direction.
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公开(公告)号:US20200035681A1
公开(公告)日:2020-01-30
申请号:US16591064
申请日:2019-10-02
发明人: Chien-Yao HUANG , Wun-Jie LIN , Chia-Wei HSU , Yu-Ti SU
IPC分类号: H01L27/092 , H01L29/94 , H01L27/02 , H01L29/06 , H01L29/08
摘要: A capacitor cell is provided. A first PMOS transistor is coupled between a power supply and a first node, and has a gate connected to a second node. A first NMOS transistor is coupled between a ground and the second node, and has a gate connected to the first node. A second PMOS transistor is coupled between the second node and the first node, and has a gate connected to the second node. A second NMOS transistor has a drain connected to the first node, a gate connected to the first node, and a source connected to the ground or the second node. The first and second PMOS transistors and the first and second NMOS transistors are arranged in the same row. The second PMOS transistor is disposed between the first PMOS transistor and the first and second NMOS transistors.
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公开(公告)号:US20240321781A1
公开(公告)日:2024-09-26
申请号:US18731021
申请日:2024-05-31
发明人: Tao-Yi HUNG , Wun-Jie LIN , Jam-Wem LEE , Kuo-Ji CHEN
CPC分类号: H01L23/60 , H01L27/0266 , H01L27/0292 , H02H9/046
摘要: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus comprises: an internal circuit formed in a first wafer; an array of electrostatic discharge (ESD) circuits formed in a second wafer, wherein the ESD circuits include a plurality of ESD protection devices each coupled to a corresponding switch and configured to protect the internal circuit from a transient ESD event; and a switch controller in the second wafer, wherein the switch controller is configured to control, based on a control signal from the first wafer, each of the plurality of ESD protection devices to be activated or deactivated by the corresponding switch, and wherein the first wafer is bonded to the second wafer.
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5.
公开(公告)号:US20230326920A1
公开(公告)日:2023-10-12
申请号:US18210472
申请日:2023-06-15
发明人: Yu-Hung YEH , Wun-Jie LIN , Jam-Wem LEE
IPC分类号: H01L27/02 , H01L23/522 , H01L23/535
CPC分类号: H01L27/0288 , H01L23/5223 , H01L23/5228 , H02H9/046 , H01L23/535 , H01L27/0285 , H01L27/0292
摘要: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: a plurality of transistors patterned on a semiconductor substrate during a front-end-of-line (FEOL) process, metal interconnects formed on top of the plurality of transistors during a back-end-of-line (BEOL) process and configured to interconnect the plurality of transistors, and a plurality of passive components formed under the semiconductor substrate in a backside layer during a backside a back-end-of-line (B-BEOL) process, wherein the plurality of passive components are connected to the plurality of transistors through a plurality of vias.
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6.
公开(公告)号:US20220231010A1
公开(公告)日:2022-07-21
申请号:US17150782
申请日:2021-01-15
发明人: Tao-Yi HUNG , Wun-Jie LIN , Jam-Wem LEE , Kuo-Ji CHEN
摘要: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: an internal circuit patterned in a device wafer and electrically coupled between a first node and a second node, an array of electrostatic discharge (ESD) circuits patterned in a carrier wafer, where the ESD circuits are electrically coupled between a first node and a second node and configured to protect the internal circuit from transient ESD events, and where the device wafer is bonded to the carrier wafer.
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公开(公告)号:US20180308846A1
公开(公告)日:2018-10-25
申请号:US15495106
申请日:2017-04-24
发明人: Chien-Yao HUANG , Wun-Jie LIN , Chia-Wei HSU , Yu-Ti SU
IPC分类号: H01L27/092 , H01L27/02 , H01L29/06 , H01L29/08
摘要: A capacitor cell is provided. A first PMOS transistor is coupled between a power supply and a first node, having a gate coupled to a second node. A first NMOS transistor coupled between a ground and the second node, having a gate coupled to the first node. A second PMOS transistor, having a drain coupled to the second node, a gate coupled to the second node, and a source coupled to the power supply or the first node. A second NMOS transistor, having a drain coupled to the first node, a gate coupled to the first node, and a source coupled to the ground or the second node.
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8.
公开(公告)号:US20240363621A1
公开(公告)日:2024-10-31
申请号:US18770552
申请日:2024-07-11
发明人: Yu-Hung YEH , Wun-Jie LIN , Jam-Wem LEE
IPC分类号: H01L27/02 , H01L23/522 , H01L23/535 , H02H9/04
CPC分类号: H01L27/0288 , H01L23/5223 , H01L23/5228 , H01L23/535 , H01L27/0285 , H01L27/0292 , H02H9/046
摘要: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: a plurality of transistors patterned on a semiconductor substrate during a front-end-of-line (FEOL) process, metal interconnects formed on top of the plurality of transistors during a back-end-of-line (BEOL) process and configured to interconnect the plurality of transistors, and a plurality of passive components formed under the semiconductor substrate in a backside layer during a backside a back-end-of-line (B-BEOL) process, wherein the plurality of passive components are connected to the plurality of transistors through a plurality of vias.
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9.
公开(公告)号:US20220320075A1
公开(公告)日:2022-10-06
申请号:US17219495
申请日:2021-03-31
发明人: Yu-Hung YEH , Wun-Jie LIN , Jam-Wern LEE
IPC分类号: H01L27/02 , H01L23/522 , H01L23/535
摘要: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: a plurality of transistors patterned on a semiconductor substrate during a front-end-of-line (FEOL) process, metal interconnects formed on top of the plurality of transistors during a back-end-of-line (BEOL) process and configured to interconnect the plurality of transistors, and a plurality of passive components formed under the semiconductor substrate in a backside layer during a backside a back-end-of-line (B-BEOL) process, wherein the plurality of passive components are connected to the plurality of transistors through a plurality of vias.
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公开(公告)号:US20220037365A1
公开(公告)日:2022-02-03
申请号:US16940930
申请日:2020-07-28
发明人: Chien Yao HUANG , Wun-Jie LIN , Kuo-Ji CHEN
IPC分类号: H01L27/118 , G06F30/392 , H01L21/8238 , H01L27/02
摘要: An integrated circuit (IC) device includes a plurality of TAP cells arranged at intervals in a first direction and a second direction transverse to the first direction. The plurality of TAP cells includes at least one first TAP cell. The first TAP cell includes two first end areas and a first middle area arranged consecutively in the second direction. The first middle area includes a first dopant of a first type implanted in a first well region of the first type. The first end areas are arranged on opposite sides of the first middle area in the second direction. Each of the first end areas includes a second dopant of a second type implanted in the first well region, the second type different from the first type.
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