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公开(公告)号:US09899537B2
公开(公告)日:2018-02-20
申请号:US15169451
申请日:2016-05-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Yen Lin , Chi-Wen Liu , Chong-Rong Wu , Xian-Rui Chang
IPC: H01L29/76 , H01L29/786 , H01L29/24 , H01L21/02 , H01L29/66
CPC classification number: H01L29/78696 , H01L21/02568 , H01L21/0262 , H01L29/1606 , H01L29/24 , H01L29/267 , H01L29/41766 , H01L29/66969 , H01L29/778 , H01L29/78618 , H01L29/78648 , H01L29/78681 , H01L29/78684 , H01L29/78687
Abstract: The present disclosure provides a semiconductor device in accordance with some embodiments. The semiconductor device includes a first transition metal dichalcogenide film on a substrate; a second transition metal dichalcogenide film on the first transition metal dichalcogenide film; source and drain features formed over the second transition metal dichalcogenide film; and a first gate stack formed over the second transition metal dichalcogenide film and interposed between the source and drain feature.
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公开(公告)号:US20170345944A1
公开(公告)日:2017-11-30
申请号:US15169451
申请日:2016-05-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Yen Lin , Chi-Wen Liu , Chong-Rong Wu , Xian-Rui Chang
IPC: H01L29/786 , H01L29/24 , H01L29/66 , H01L21/02
CPC classification number: H01L29/78696 , H01L21/02568 , H01L21/0262 , H01L29/1606 , H01L29/24 , H01L29/267 , H01L29/41766 , H01L29/66969 , H01L29/778 , H01L29/78618 , H01L29/78648 , H01L29/78681 , H01L29/78684 , H01L29/78687
Abstract: The present disclosure provides a semiconductor device in accordance with some embodiments. The semiconductor device includes a first transition metal dichalcogenide film on a substrate; a second transition metal dichalcogenide film on the first transition metal dichalcogenide film; source and drain features formed over the second transition metal dichalcogenide film; and a first gate stack formed over the second transition metal dichalcogenide film and interposed between the source and drain feature.
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