公开(公告)号：US20200185304A1

公开(公告)日：2020-06-11

申请号：US16375228

申请日：2019-04-04

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yuan Sheng Chiu ,  Chih-Kai Cheng ,  Tsung-Shu Lin

IPC分类号： H01L23/40 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/528 ,  H01L23/522

摘要： In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.

公开(公告)号：US11011451B2

公开(公告)日：2021-05-18

申请号：US16375228

申请日：2019-04-04

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yuan Sheng Chiu ,  Chih-Kai Cheng ,  Tsung-Shu Lin

IPC分类号： H01L23/40 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/522 ,  H01L23/528 ,  H01L21/48

摘要： In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.

公开(公告)号：US20240363486A1

公开(公告)日：2024-10-31

申请号：US18771548

申请日：2024-07-12

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yuan Sheng Chiu ,  Chih-Kai Cheng ,  Tsung-Shu Lin

IPC分类号： H01L23/40 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528

CPC分类号： H01L23/4006 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/5226 ,  H01L23/5283 ,  H01L24/09 ,  H01L24/17 ,  H01L24/94 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2224/0231 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/26155 ,  H01L2224/83897

摘要： In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.

公开(公告)号：US12080623B2

公开(公告)日：2024-09-03

申请号：US17322191

申请日：2021-05-17

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yuan Sheng Chiu ,  Chih-Kai Cheng ,  Tsung-Shu Lin

IPC分类号： H01L23/40 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528

CPC分类号： H01L23/4006 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/5226 ,  H01L23/5283 ,  H01L24/09 ,  H01L24/17 ,  H01L24/94 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2224/0231 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/26155 ,  H01L2224/83897

摘要： In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.

公开(公告)号：US20210272875A1

公开(公告)日：2021-09-02

申请号：US17322191

申请日：2021-05-17

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yuan Sheng Chiu ,  Chih-Kai Cheng ,  Tsung-Shu Lin

IPC分类号： H01L23/40 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/522 ,  H01L23/528 ,  H01L21/48

摘要： In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.