公开(公告)号：US08897019B1

公开(公告)日：2014-11-25

申请号：US14103620

申请日：2013-12-11

申请人： Taiyo Yuden Co., Ltd.

发明人： Masaya Shimamura ,  Kenzo Kitazaki ,  Eiji Mugiya ,  Tetsuo Saji ,  Atsushi Tsunoda ,  Hiroshi Nakamura

IPC分类号： H05K7/00 ,  H05K9/00

CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K9/003 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00

摘要： There is provided a circuit module, including: a circuit substrate including a mount surface; a mounting component mounted on the mount surface; a sealing body that is formed on the mount surface, covers the mounting component, and includes a trench formed from a main surface of the sealing body toward the mount surface, the trench including a first trench portion extending in one of a parallel direction and an orthogonal direction with respect to a direction parallel to the main surface and a second trench portion that is connected to the first trench portion, is parallel to the main surface, and extends in a direction that is not parallel nor orthogonal to the first trench portion; and a shield that covers the sealing body and includes an inner shield portion formed inside the trench and an outer shield portion provided on the main surface and the inner shield portion.

摘要翻译： 提供了一种电路模块，包括：包括安装表面的电路基板; 安装在安装表面上的安装部件; 形成在安装面上的密封体覆盖安装部件，并且包括由密封体的主表面朝向安装面形成的沟槽，该沟槽包括沿平行方向延伸的第一沟槽部分和 相对于与主表面平行的方向的正交方向和与第一沟槽部分连接的第二沟槽部分平行于主表面，并且在不平行或不垂直于第一沟槽部分的方向上延伸; 以及覆盖所述密封体并且包括形成在所述沟槽内的内屏蔽部和设置在所述主表面和所述内屏蔽部上的外屏蔽部的屏蔽。