摘要:
In forming a P.sup.- body diffused layer in a portion on the source side of an N.sup.- drain diffused layer of a DMOSFET, P-type impurity ions are implanted at a large tilt angle to reach a part of a region underlying an N.sup.+ gate electrode by using, as a mask, a resist film having an opening corresponding to a region in which the body diffused layer of the DMOSFET is to be formed and the N.sup.+ gate electrode so as to be activated. Thereafter, an N.sup.+ source diffused layer and an N.sup.+ drain diffused layer are formed in the P.sup.- body diffused layer and in the N.sup.- drain diffused layer, respectively. Since a high-temperature drive-in process need not be performed to introduce the P-type impurity ions into the region underlying the N.sup.+ gate electrode, a reduction or variations in threshold voltage and the degradation of a gate oxide film each caused by the impurity diffused from the N.sup.+ gate electrode can be prevented. Consequently, there is provided a semiconductor device having a DMOSFET mounted thereon which has a reduced on-resistance and suppresses the activation of a parasitic bipolar transistor due to reduced variations in threshold voltage and a high-quality gate oxide film.
摘要:
In forming a P.sup.- body diffused layer in a portion on the source side of an N.sup.- drain diffused layer of a DMOSFET, P-type impurity ions are implanted at a large tilt angle to reach a part of a region underlying an N.sup.+ gate electrode by using, as a mask, a resist film having an opening corresponding to a region in which the body diffused layer of the DMOSFET is to be formed and the N.sup.+ gate electrode so as to be activated. Thereafter, an N.sup.+ source diffused layer and an N.sup.+ drain diffused layer are formed in the P.sup.- body diffused layer and in the N.sup.- drain diffused layer, respectively. Since a high-temperature drive-in process need not be performed to introduce the P-type impurity ions into the region underlying the N.sup.+ gate electrode, a reduction or variations in threshold voltage and the degradation of a gate oxide film each caused by the impurity diffused from the N.sup.+ gate electrode can be prevented. Consequently, there is provided a semiconductor device having a DMOSFET mounted thereon which has a reduced on-resistance and suppresses the activation of a parasitic bipolar transistor due to reduced variations in threshold voltage and a high-quality gate oxide film.
摘要:
An n-type buried layer and an n-type epitaxial layer that becomes a collector layer of a pnp transistor are formed on a semiconductor substrate. A well and the collector layer are formed. Ions of an n-type impurity are implanted through a photoresist mask, to form an intrinsic base layer of the pnp transistor and a PT-VT diffusion layer with punchthrough stopper and threshold control functions of a pMOSFET. Ions of a p-type impurity are implanted through a photoresist mask at a shallow implantation depth than the previous step, to form an intrinsic base layer of an npn transistor and a channel dope layer of the pMOSFET. A buried channel is formed under the gate of the pMOSFET. Therefore pMOSFETs with good characteristics can be obtained. In this way, the present invention achieves bipolar transistors and MOSFETs with good characteristics, without having to increase the number of fabrication steps and the number of photoresist masks.
摘要:
A method for reviewing defect, comprising the steps of: as an image acquisition step, imaging a surface of a sample using arbitrary image acquisition condition selected from a plurality of image acquisition conditions and obtaining a defect image; as a defect position calculation step, proceeding the defect image obtained by the image acquisition step and calculating a defect position on the surface of the sample; as a defect detection accuracy calculation step, obtaining a defect detection accuracy of the defect position calculated by the defect position calculation step; and as a conclusion determination step, determinating whether the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined requirement or not; wherein until it is determined that the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined in the conclusion determination step, the image acquisition condition is selected from the plurality of image acquisition conditions once again and the image acquisition step, the defect position calculation step, the defect detection accuracy calculation step and the conclusion determination step are repeated.
摘要:
For inspection of a pattern such as a semiconductor device, it is useful to selectively detect a defect on the specific pattern in order to estimate the cause of the occurrence of the defect. An object of the invention is to provide a charged particle beam apparatus capable of setting, on the basis of the shape of the pattern on a sample, a region to be inspected. The invention is characterized in that the contour of the pattern on the sample is extracted using a template image obtained on the basis of an image of the sample, the region to be inspected is set on the basis of the contour of the pattern, a defect candidate is detected by comparing the image to be inspected with a comparative image, and the sample is inspected using a positional relationship between the region to be inspected and the defect candidate included in the region to be inspected.
摘要:
A surface observation apparatus is achieved, which enables even a beginner to easily select an optimal evaluation indicator for each of various patterns to be evaluated without a trial and error approach. A plurality of images to be evaluated are input from an image processing unit (114) to an evaluation image input unit (113a) (in step 901). The input images to be evaluated are displayed on a display (115). A user rearranges the images in accordance with an evaluation criterion of the user while referencing the display (115), and defines an evaluation criterion (in step 902). Evaluation values are calculated for the input images (to be evaluated) using a plurality of evaluation indicators (in step 903). The evaluation values for each of the evaluation indicators are compared with the evaluation criterion defined by the user, and correlation coefficients are then calculated (in step 904). An evaluation indicator having the maximum absolute value of a correlation coefficient is automatically selected as an evaluation criterion that is closest to the evaluation criterion defined by the user (in step 905). The images are rearranged in order of correlation coefficient and a list of the images is displayed on the display (115) so that the images are arranged in order of evaluation value (in step 906).
摘要:
A defect observation device including an input-output unit supplied with information of a taught defect, and information of an ideal output of the taught defect, and configured to display a processing result based upon a determined image processing parameter set; and an automatic determination unit configured to: select image processing parameter sets which are less in number than the total number of all image processing parameter sets, out of all image processing parameter sets, calculate image processing results on an input defect image, by using the selected image processing parameter sets, calculate a coincidence degree for each of the selected image processing parameter sets, estimate distribution of an index value in all image processing parameter sets from distribution of the coincidence degree for the selected image processing parameter sets, and determine an image processing parameter set to have a high coincidence degree out of all image processing parameter sets.
摘要:
A defect observation device supplied with a taught defect and an ideal output obtained by conducting image processing on the taught defect as its input and capable of conducting work of setting image processing parameters required to classify defect kinds easily and fast is provided.The defect observation device includes an input-output unit 123 which is supplied with information of a taught defect and information of an ideal output of the taught defect and which displays a processing result based upon a determined image processing parameter set, and an automatic determination unit 124 for selecting image processing parameter sets which are less in number than the total number of all image processing parameter sets, out of all image processing parameter sets, calculating image processing results on an input defect image, by using the selected image processing parameter sets, calculating a coincidence degree for each of the selected image processing parameter sets, estimating distribution of an index value in all image processing parameter sets from distribution of the coincidence degree for the selected image processing parameter sets, and determining an image processing parameter set having a high coincidence degree out of all image processing parameter sets.
摘要:
An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction.
摘要:
A review apparatus for reviewing a specimen by moving the specimen to pre-calculated coordinate includes: a function to measure a deviation amount between the pre-calculated coordinates and coordinates of an actual position of the specimen; a function to optimize a coordinate correcting expression to minimize the measured deviation amount; and a function to determine that the deviation amounts have converged. When the deviation amounts have converged, the measurement for the coordinate-correcting-expression optimization is terminated, and a field of view necessary for the specimen to be within the field of view is set according to a convergence value of the calculated deviation amount.