公开(公告)号：US5007788A

公开(公告)日：1991-04-16

申请号：US342345

申请日：1989-04-24

申请人： Takanobu Asano ,  Kenichi Yamaga ,  Wataru Ohkase

发明人： Takanobu Asano ,  Kenichi Yamaga ,  Wataru Ohkase

IPC分类号： H01L21/677

CPC分类号： H01L21/67781

摘要： A pitch changing device of the present invention includes a lift mechanism for unloading a plurality of wafers arranged in a cassette at predetermined pitches from the cassette while the pitches are kept unchanged, and a chuck mechanism for holding the unloaded wafers while the pitches are kept unchanged. The chuck mechanism includes moving pieces mounted to be movable in an arrangement direction of the wafers, for respectively supporting the wafers, elastic members mounted in the movable pieces to be expandible/contractible in the arrangement direction of the wafers, and a driving mechanism for expanding/contracting the elastic members. When the elastic members expand/contract by the driving mechanism, the pitches of the wafers are changed while the wafers are held. The lift mechanism includes a handler for variably moving wafer stands in the arrangement direction of the wafers, and changes the pitches while the wafers are lifted.

摘要翻译： 本发明的变桨装置包括一个提升机构，用于在间距保持不变的情况下以预定间距从盒子中卸载设置在盒中的多个晶片;以及夹持机构，用于保持未加载的晶片，同时间距保持不变 。 卡盘机构包括安装成能够在晶片的布置方向上移动的移动件，用于分别支撑晶片，安装在可移动片中的弹性构件可在晶片的排列方向上可扩展/收缩;以及驱动机构，用于扩展 /收缩弹性构件。 当弹性构件通过驱动机构膨胀/收缩时，在保持晶片的同时改变晶片的间距。 升降机构包括用于在晶片的排列方向上可变地移动晶片架的处理器，并且在晶片被提升时改变间距。

公开(公告)号：US5616264A

公开(公告)日：1997-04-01

申请号：US259180

申请日：1994-06-13

申请人： Katsuo Nishi ,  Kazuo Terada ,  Wataru Ohkase ,  Kenichi Yamaga

发明人： Katsuo Nishi ,  Kazuo Terada ,  Wataru Ohkase ,  Kenichi Yamaga

IPC分类号： C23C16/46 ,  C30B25/10 ,  C30B31/12 ,  G05D23/19 ,  H05B1/02

CPC分类号： C30B31/12 ,  C23C16/46 ,  C30B25/10 ,  G05D23/1934

摘要： A temperature control method in a rapid heat treatment apparatus comprising simulatively heating dummy wafers in a process tube and previously detecting and grasping by temperature sensors a wafer temperature rising pattern, a heater temperature rising pattern and an internal atmosphere temperature rising pattern, arranging wafers to be processed in the process tube, detecting a temperature of each zone and that of each heater element by the temperature sensors, upon heating the wafers, and controlling each heater element on the basis of the detected temperatures and the wafer, heater and internal atmosphere temperature rising patterns by a controller to rapidly and uniformly raise the temperature of each wafer until the temperature of the wafers in each zone reaches the intended one and becomes stable.

摘要翻译： 一种快速热处理装置中的温度控制方法，包括在处理管中模拟加热虚拟晶片并预先通过温度传感器检测和掌握晶片温度升高图案，加热器温度升高图案和内部气氛升温图案，将晶片设置为 在处理管中处理，在加热晶片时，通过温度传感器检测每个区域和每个加热器元件的温度，并且基于检测到的温度和晶片，加热器和内部气氛温度升高来控制每个加热器元件 通过控制器快速均匀地提高每个晶片的温度直到每个区域中的晶片的温度达到预期的温度并变得稳定。

公开(公告)号：US5131799A

公开(公告)日：1992-07-21

申请号：US617872

申请日：1990-11-26

申请人： Hironobu Nishi ,  Kenichi Yamaga ,  Takanobu Asano

发明人： Hironobu Nishi ,  Kenichi Yamaga ,  Takanobu Asano

IPC分类号： H01L21/00 ,  H01L21/205 ,  H01L21/22 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67313 ,  H01L21/67294 ,  H01L21/67326 ,  H01L21/67781 ,  Y10S414/136 ,  Y10S414/138 ,  Y10S414/14

摘要： A wafer transferring method for transferring wafers between a cassette and a boat having grooves to hold the wafers, comprises the steps of providing an identification mechanism for positional alignment on the boat in advance, detecting the identification mechanism, and aligning the boat to a predetermined position based on a detection result and transferring the wafers from the cassette to the boat. A wafer transferring apparatus comprises a loading device for extracting wafers from a cassette and transferring the wafers onto a boat, a detection device for detecting an identification section provided on the boat in order to identify a wafer transferring position on the boat, a control device for acquiring the wafer transferring position on the boat based on a detection result attained from the detection device and controlling a mutual position between the boat and the cassette to come to a predetermined position.

公开(公告)号：US5261935A

公开(公告)日：1993-11-16

申请号：US23394

申请日：1993-02-26

申请人： Katsumi Ishii ,  Takanobu Asano ,  Masaharu Abe ,  Kenichi Yamaga ,  Kazunari Sakata ,  Takashi Tanahashi ,  Syuji Moriya

发明人： Katsumi Ishii ,  Takanobu Asano ,  Masaharu Abe ,  Kenichi Yamaga ,  Kazunari Sakata ,  Takashi Tanahashi ,  Syuji Moriya

IPC分类号： C30B33/00 ,  H01L21/00 ,  H01L21/677 ,  B01D46/04

CPC分类号： H01L21/67757 ,  C30B33/00 ,  H01L21/67017 ,  H01L21/67769 ,  H01L21/67772 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A clean air apparatus includes a housing having an opening through which a carrier housing semiconductor wafers is supplied into the housing and an I/O port for supporting the carrier and a furnace for treating the wafer, provided in the upper portion of the housing. The carriers are at the same time supported by a first carrier stage provided in the upper portion of the housing and supported by a second carrier stage provided in the lower portion of the housing. The carrier or carriers are selectively moved between the I/O port and the first stage, between the I/O port and the second stage, and between the first stage and the second stage. A clean air is applied to the wafers in the carriers supported by the I/O port, the first stage and the second stage.

摘要翻译： 清洁空气装置包括壳体，壳体具有开口，载体壳体半导体晶片被供给到壳体中，以及用于支撑载体的I / O端口和设置在壳体的上部中的晶片处理炉。 载体同时由设置在壳体的上部中的第一载体台支撑并由设置在壳体的下部中的第二载体台支撑。 载体或载体选择性地在I / O端口和第一级之间，I / O端口和第二级之间以及在第一级和第二级之间移动。 将清洁空气施加到由I / O端口，第一级和第二级支撑的载体中的晶片。

公开(公告)号：US5030057A

公开(公告)日：1991-07-09

申请号：US266651

申请日：1988-11-03

申请人： Hironobu Nishi ,  Kenichi Yamaga ,  Takanobu Asano ,  Kazutoshi Sawado ,  Masashi Fumoto ,  Shozo Ito ,  Yoshinori Mochizuki

发明人： Hironobu Nishi ,  Kenichi Yamaga ,  Takanobu Asano ,  Kazutoshi Sawado ,  Masashi Fumoto ,  Shozo Ito ,  Yoshinori Mochizuki

IPC分类号： H01L21/00 ,  H01L21/205 ,  H01L21/22 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67313 ,  H01L21/67294 ,  H01L21/67326 ,  H01L21/67781 ,  Y10S414/136 ,  Y10S414/138 ,  Y10S414/14

摘要： A wafer transferring method for transferring wafers between a cassette and a boat having grooves to hold the wafers, comprises the steps of providing an identification mechanism for positional alignment on the boat in advance, detecting the identification mechanism, and aligning the boat to a predetermined position based on a detection result and transferring the wafers from the cassette to the boat. A wafer transferring apparatus comprises a loading device for extracting wafers from a cassette and transferring the wafers onto a boat, a detection device for detecting an identification section provided on the boat in order to identify a wafer transferring position on the boat, and a control device for acquiring the wafer transferring position on the boat based on a detection result attained from the detection device and controlling a mutual position between the boat and the cassette to come to a predetermined position.

摘要翻译： 一种晶片转印方法，用于在具有用于保持晶片的槽的盒和舟皿之间转移晶片，包括以下步骤：提供用于在船上进行位置对准的识别机构，检测识别机构，以及将船对准到预定位置 基于检测结果并将晶片从盒转移到船。 晶片转印装置包括用于从盒中提取晶片并将晶片转移到船上的装载装置，用于检测设置在船上的识别部分以识别船上的晶片转移位置的检测装置，以及控制装置 用于基于从检测装置获得的检测结果获取船上的晶片转移位置，并控制船和盒之间的相互位置到达预定位置。

公开(公告)号：US07974525B2

公开(公告)日：2011-07-05

申请号：US12071909

申请日：2008-02-27

申请人： Makoto Kobayashi ,  Takashi Ichikawa ,  Kenichi Yamaga

发明人： Makoto Kobayashi ,  Takashi Ichikawa ,  Kenichi Yamaga

IPC分类号： A21B2/00 ,  F26B19/00

CPC分类号： F26B23/06 ,  F27B17/0025 ,  H01L21/67109

摘要： The present invention is a heat processing furnace comprising: a processing vessel for accommodating an object to be processed and performing thereto a heat process; and a cylindrical heater disposed to surround a circumference of the processing vessel, for heating the object to be processed; wherein: the heater includes a cylindrical heat insulating member, ribbed shelf sections that are axially formed in a tier-like manner on an inner circumference of the heat insulating member, and heating resistance wires of a helical pattern that are placed along the respective shelf sections; and pin members are arranged in the heat insulating member at suitable intervals therebetween, the pin members holding the heating resistance wires such that the heating resistance wires are movable in a radial direction of the heater, while preventing dropout of the heating resistance wires from the shelf sections.

摘要翻译： 本发明是一种热处理炉，包括：处理容器，用于容纳待加工物体并进行加热处理; 以及设置成围绕处理容器的圆周的圆柱形加热器，用于加热被处理物体; 其特征在于，所述加热器包括圆筒形绝热构件，在所述隔热构件的内周上以层状的方式轴向形成的肋状搁板部，以及沿着各个搁板部放置的螺旋图案的耐热电线 ; 并且销构件以适当的间隔布置在绝热构件中，销构件保持加热电阻线，使得加热电阻线可在加热器的径向方向上移动，同时防止加热电阻丝从搁板 部分。

公开(公告)号：US20110076632A1

公开(公告)日：2011-03-31

申请号：US12881556

申请日：2010-09-14

申请人： Yoshinori KUSAKABE ,  Kenichi Yamaga

发明人： Yoshinori KUSAKABE ,  Kenichi Yamaga

IPC分类号： F27D15/02 ,  F28D15/00

CPC分类号： H01L21/67109 ,  C30B25/10 ,  C30B35/00

摘要： A thermal processing apparatus including: a cylindrical processing vessel; a support unit to be loaded into and unloaded from the vessel; and a heating furnace surrounding an outer periphery of the vessel, with a cooling space therebetween. The furnace is connected to a cooling-gas introduction unit, including a gas introduction passage to which a blowing fan is connected, for introducing a cooling gas into the cooling space during a temperature lowering operation after a thermal process. The furnace is connected to a cooling-gas discharge unit, including a heat exchanger, a suction fan, and a gas discharge passage, for discharging the cooling gas of a raised temperature from the cooling space. Connected to the gas discharge passage at a position upstream of the heat exchanger is a temperature-lowering gas introduction unit for introducing a temperature-lowering gas to the cooling gas of a raised temperature so as to lower its temperature.

摘要翻译： 一种热处理设备，包括：圆柱形处理容器; 支撑单元，其被装载和卸载; 以及围绕容器的外周的加热炉，其间具有冷却空间。 炉子连接到冷却气体引入单元，该冷却气体引入单元包括连接有吹风扇的气体引入通道，用于在热处理之后的降温操作期间将冷却气体引入冷却空间。 炉子连接到冷却气体排出单元，该冷却气体排出单元包括热交换器，抽吸风扇和气体排出通道，用于将升温的冷却气体从冷却空间排出。 在该热交换器上游的位置与气体排出通路连接的是降温气体引入单元，用于将降温气体导入升温温度降低的气体，降低其温度。

公开(公告)号：US20050028738A1

公开(公告)日：2005-02-10

申请号：US10494970

申请日：2002-09-27

申请人： Takanori Saito ,  Toshiyuki Makiya ,  Hisaei Osanai ,  Tsuyoshi Takizawa ,  Tomohisa Shimazu ,  Kazuhide Hasebe ,  Hiroyuki Yamamoto ,  Yukimasa Saito ,  Kenichi Yamaga

发明人： Takanori Saito ,  Toshiyuki Makiya ,  Hisaei Osanai ,  Tsuyoshi Takizawa ,  Tomohisa Shimazu ,  Kazuhide Hasebe ,  Hiroyuki Yamamoto ,  Yukimasa Saito ,  Kenichi Yamaga

IPC分类号： C23C16/44 ,  C23C16/455 ,  H01L21/00 ,  H01L21/205 ,  H01L21/22 ,  C23C16/00

CPC分类号： H01L21/67109 ,  H01L21/67098

摘要： The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.

摘要翻译： 本发明是一种热处理单元，包括：上端具有开口的加热炉体; 设置在所述加热炉体的内壁上的加热单元; 由包含在加热炉体内的单个管构成的反应容器; 形成在反应容器的上部的气体排出管连接部; 以及设置在气体排出管连接部周围的第一温度控制单元。

公开(公告)号：US06390754B1

公开(公告)日：2002-05-21

申请号：US09080254

申请日：1998-05-18

申请人： Kenichi Yamaga ,  Yuji Ono ,  Masahiro Miyashita ,  Osamu Tanigawa

发明人： Kenichi Yamaga ,  Yuji Ono ,  Masahiro Miyashita ,  Osamu Tanigawa

IPC分类号： B65G4907

摘要： A closed-type cassette is mounted on a cassette stand disposed in a working region at a position corresponding to an opening formed in a wall separating the working region from a loading region. When the cassette is mounted on the cassette stand, a detecting device gives a signal to that effect to a controller. Then, the controller closes a valve to interrupt nitrogen gas supply into the loading region. A lid of the cassette is opened 20 to 30 sec after the interruption of nitrogen gas supply into the loading region and, then, nitrogen gas supply is resumed. The pressure difference between the loading region and the interior of the cassette is decreased by interrupting nitrogen gas supply into the loading region, so that the lid can be easily opened.

公开(公告)号：US5362229A

公开(公告)日：1994-11-08

申请号：US79386

申请日：1993-06-21

申请人： Kenichi Yamaga

发明人： Kenichi Yamaga

IPC分类号： H01L21/31 ,  F16L27/04 ,  F16L27/06 ,  F16L49/00 ,  F27D7/02 ,  H01L21/22 ,  F27B9/04

CPC分类号： F27D7/02 ,  F16L27/04 ,  F27D2007/023

摘要： In a semiconductor wafer heat-treating apparatus, there is provided a piping connection device on a gas inlet pipe leading to the heat-treating apparatus and a gas outlet pipe derived from the heat-treating apparatus. The piping connection device has a spherical convex connecting element, and a concave connecting element having a concave spherical surface into which the spherical element is snugly fitted. A pair of presser plates are placed on the outer surfaces of the two connecting elements and clamped by bolts so as to press confronting sealing surfaces of the convex and concave connecting elements against each other. Because the outer surfaces of the two connecting elements to be engaged with the pair of presser plates are spherically fashioned, the connection surfaces can present a satisfactory sealing condition without subjecting the pair of the pipes connected by the piping connection device to excessive biasing forces even though the two pipes are angled to each other.

摘要翻译： 在半导体晶片热处理装置中，在通向热处理装置的气体导入管和从该热处理装置得到的气体出口管上设置配管连接装置。 管道连接装置具有球形凸形连接元件和具有凹形球形表面的凹形连接元件，球形元件紧密配合到该凹形连接元件中。 一对压板放置在两个连接元件的外表面上，并被螺栓夹紧，以将相互凸起的和凹形的连接元件的相对的密封表面压在一起。 由于与一对压板接合的两个连接元件的外表面是球形的，所以连接表面可以呈现令人满意的密封条件，而不会使由配管连接装置连接的一对管子经受过大的偏压力，即使 两个管道彼此成角度。