公开(公告)号：US5799288A

公开(公告)日：1998-08-25

申请号：US672052

申请日：1996-06-26

申请人： Takao Tanaka ,  Masanori Mukai ,  Takeshi Nagaoka ,  Kazuo Nakamura ,  Takaaki Hirooka ,  Takuji Shiota ,  Yoshihiro Kakiuchi ,  Ryoichi Tabei ,  Kouichi Matsuo

发明人： Takao Tanaka ,  Masanori Mukai ,  Takeshi Nagaoka ,  Kazuo Nakamura ,  Takaaki Hirooka ,  Takuji Shiota ,  Yoshihiro Kakiuchi ,  Ryoichi Tabei ,  Kouichi Matsuo

IPC分类号： G07D9/00 ,  G06Q10/04 ,  G06Q20/18 ,  G06Q40/00 ,  G06Q40/02 ,  G06Q50/00 ,  G07D11/00 ,  G07F19/00

CPC分类号： G07F19/211 ,  G06Q20/108 ,  G06Q20/1085 ,  G07D11/0054 ,  G07D11/0072 ,  G07D11/0075

摘要： The invention provides a remaining money management system which can predict and manage a demanded cash amount for an ATM. The remaining money management system includes one or more automatic cash transaction apparatus, and a remaining money management apparatus which manages remaining money amounts based on transaction data from the automatic cash transaction apparatus. The remaining money management apparatus includes a storage section for cumulatively storing transaction data from the automatic cash transaction apparatus, and a prediction section for calculating and predicting demanded cash amounts within a designated time for the automatic cash transaction apparatus based on transaction data in the past accumulated in the storage section. The remaining money amount management system can be applied to an apparatus for managing ATMs installed in monetary facilities such as banks.

摘要翻译： 本发明提供了可以预测和管理ATM的所需现金金额的剩余货币管理系统。 剩余的货币管理系统包括一个或多个自动现金交易装置，以及基于来自自动现金交易装置的交易数据管理剩余货币金额的剩余货币管理装置。 剩余货币管理装置包括：用于累积存储来自自动现金交易装置的交易数据的存储部分;以及预测部分，用于根据过去累积的交易数据，计算和预测在自动现金交易装置的指定时间内的所需现金金额 在存储部分。 剩余的金额管理系统可以应用于用于管理银行等货币设施中安装的ATM的装置。

公开(公告)号：USD459254S1

公开(公告)日：2002-06-25

申请号：US29131294

申请日：2000-10-19

申请人： Jun Hirose ,  Eiji Hirose ,  Jun Ozawa ,  Takaaki Hirooka

设计人： Jun Hirose ,  Eiji Hirose ,  Jun Ozawa ,  Takaaki Hirooka

公开(公告)号：US20060207971A1

公开(公告)日：2006-09-21

申请号：US11376163

申请日：2006-03-16

申请人： Tsuyoshi Moriya ,  Takaaki Hirooka ,  Akitaka Shimizu ,  Satoshi Tanaka

发明人： Tsuyoshi Moriya ,  Takaaki Hirooka ,  Akitaka Shimizu ,  Satoshi Tanaka

IPC分类号： C23F1/00 ,  H01L21/306 ,  B44C1/22

CPC分类号： C23F1/12 ,  H01L21/02071 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67775

摘要： An atmospheric transfer chamber, connected to an object processing chamber for processing a target object by using a plasma of a halogen-based gas, for transferring the target object therein, the atmospheric transfer chamber includes a dehumidifying unit for dehumidifying air in the atmospheric transfer chamber. The dehumidifying unit includes a desiccant filter, a cooling unit for cooling the air introduced into the atmospheric transfer chamber, and an air conditioner. The atmospheric transfer chamber is connected to a reaction product removal chamber for removing reaction products of a halogen-based gas attached to the target object, wherein halogen in reaction products attached to the target object is reduced.

摘要翻译： 大气传送室，通过使用卤素系气体的等离子体连接到对象处理室，用于将目标物体转印到其中，大气传送室包括用于对大气传送室中的空气进行除湿的除湿单元 。 除湿单元包括干燥剂过滤器，用于冷却引入大气传送室的空气的冷却单元和空调。 大气转移室连接到反应产物去除室，用于除去附着到目标物体上的卤素系气体的反应产物，其中附着在目标物体上的反应产物中的卤素被还原。

公开(公告)号：US06579056B2

公开(公告)日：2003-06-17

申请号：US09870728

申请日：2001-06-01

申请人： Yoshiaki Sasaki ,  Takaaki Hirooka ,  Shuji Hagihara

发明人： Yoshiaki Sasaki ,  Takaaki Hirooka ,  Shuji Hagihara

IPC分类号： B65G2900

CPC分类号： H01L21/67724 ,  H01L21/67736

摘要： An object of the present invention is to provide a wafer transfer robot mount/demount cart for simply mounting and demounting a wafer transfer robot which is linearly, substantially horizontally reciprocated in a wafer transfer apparatus to transfer wafers. A pair of mount/demount cart-side rails 9 which can be connected to a pair of wafer transfer apparatus-side guide rails mounted inside a wafer transfer apparatus D is mounted on a raised portion 5 of the mount/demount cart A. A joint rail S is mounted in a gap between the pair of wafer transfer apparatus-side rails and the pair of mount/demount cart-side rails 9 so as to slide a wafer transfer robot R onto the pair of mount/demount cart-side rails 9 via the joint rail S.

摘要翻译： 本发明的目的是提供一种用于简单地安装和拆卸晶片传送机器人的晶片传送机器人安装/拆卸车，其在晶片传送装置中线性地基本上水平往复运动以转移晶片。 可安装在晶片传送装置D内的一对晶片传送装置侧导轨上的一对安装/拆卸车侧导轨9安装在安装/卸载车A的凸起部5上。 轨道S安装在一对晶片转印装置侧轨道和一对安装/拆卸车侧导轨9之间的间隙中，以将晶片传送机器人R滑动到一对安装/拆卸车侧导轨9上 通过联合轨道S.

公开(公告)号：US06993919B2

公开(公告)日：2006-02-07

申请号：US11075884

申请日：2005-03-10

申请人： Takaaki Hirooka ,  Masao Furuya ,  Shohei Tsutsumi

发明人： Takaaki Hirooka ,  Masao Furuya ,  Shohei Tsutsumi

IPC分类号： F25B1/00

CPC分类号： H01L21/67109 ,  F25B9/008 ,  F25B39/02 ,  F25B2309/06 ,  F28D7/04 ,  H01J37/32724 ,  H01J2237/2001

摘要： The electrode temperature control device in a processing apparatus 100 includes a freezing circuit 110 comprising a compressor 148, a condenser 142, an expansion valve 150 and an evaporator 108 with the evaporator disposed inside a lower electrode 106. This electrode temperature control device does not require components such as a coolant tank for storing the coolant, a pump for supplying the coolant to the processing apparatus, a heater for adjusting the temperature of the coolant and a heat exchanger for exchanging heat between a primary coolant and a secondary coolant. Thus, the production cost can be lowered, a reduction in installation area through miniaturization of the apparatus is achieved and more efficient use of energy is achieved as well. In addition, by using CO2 as the coolant, the GWP value can be reduced to approximately 1/8000 to 1/7000 that of Freon.

摘要翻译： 处理装置100中的电极温度控制装置包括冷冻回路110，其包括压缩机148，冷凝器142，膨胀阀150和蒸发器108，蒸发器设置在下部电极106的内部。 该电极温度控制装置不需要诸如用于存储冷却剂的冷却剂罐，用于将冷却剂供应到处理装置的泵，用于调节冷却剂的温度的加热器和用于在主冷却剂之间进行热交换的热交换器 和二次冷却液。 因此，可以降低生产成本，实现通过设备的小型化减少安装面积，并且还实现更有效的能量利用。 另外，通过使用CO <2>作为冷却剂，GWP值可以降低到氟利昂的1/8000到1/7000。

公开(公告)号：US06700089B1

公开(公告)日：2004-03-02

申请号：US09937669

申请日：2001-09-28

申请人： Takaaki Hirooka

发明人： Takaaki Hirooka

IPC分类号： B23K1000

CPC分类号： H01L21/67069 ,  H01J37/32568

摘要： An upper electrode unit constituting the upper wall of a processing chamber of an etching device includes a first assembly that includes an upper electrode, a second assembly that supports the first assembly and a third assembly that includes power supply routes. After releasing a second locking mechanism and disengaging the third assembly alone with a removing mechanism, the first assembly is disengaged to perform maintenance on the upper electrode. After locking the second locking mechanism and releasing a first locking mechanism, the removing mechanism is utilized to disengage the second and third assemblies and, as a result, the processing chamber is opened to enable maintenance. By adopting the structure described above, a plasma processing device and a maintenance method thereof, that facilitate maintenance and reduce the workload imposed on the operator, are provided.

摘要翻译： 构成蚀刻装置的处理室的上壁的上电极单元包括：第一组件，其包括上电极，支撑第一组件的第二组件和包括供电路径的第三组件。 在释放第二锁定机构并且用移除机构单独脱离第三组件之后，第一组件被分离以对上电极执行维护。 在锁定第二锁定机构并释放第一锁定机构之后，使用移除机构来使第二和第三组件脱离接合，结果打开处理室以实现维护。 通过采用上述结构，提供了一种等离子体处理装置及其维护方法，其方便维护并减少施加于操作者的工作量。

公开(公告)号：US07000416B2

公开(公告)日：2006-02-21

申请号：US10432888

申请日：2001-11-29

申请人： Takaaki Hirooka ,  Masao Furuya

发明人： Takaaki Hirooka ,  Masao Furuya

IPC分类号： F25D23/12 ,  F25B5/00 ,  F25B21/02 ,  H05K7/20 ,  F28D15/00

CPC分类号： H01J37/32009 ,  F25B25/005 ,  F25B45/00 ,  F25B2345/002 ,  F25B2345/003 ,  F25B2700/21173 ,  F25D17/02 ,  H01J37/32724 ,  H01L21/67109

摘要： a cooling apparatus 110 comprises a primary refrigerant circulating circuit which allows a primary refrigerant CW1 whose temperature is adjusted by a heat exchanger 138 to circulate through an electrode to adjust a temperature of the electrode, a secondary refrigerant circulating circuit which supplies a secondary refrigerant CW2 to the heat exchanger to adjust the temperature of the primary refrigerant, and a freezing circuit 140 which has a first heat exchanger 141 interposed in the secondary refrigerant circulating circuit and which adjust a temperature of the secondary refrigerant by a tertiary refrigerant. The temperature of the primary refrigerant is adjusted by the secondary refrigerant without adjusting the temperature using the freezing circuit. When a temperature of the primary refrigerant is set higher than that of the secondary refrigerant, the temperature of the primary refrigerant can be adjusted only by the secondary refrigerant. Only when the temperature of the primary refrigerant is set lower than that of the secondary refrigerant, the temperature of the secondary refrigerant is adjusted by the freezing circuit and thus, it is possible to save energy.

摘要翻译： 冷却装置110包括主制冷剂循环回路，其允许温度由热交换器138调节的一次制冷剂CW 1通过电极循环以调节电极的温度;二次制冷剂循环回路，其供给二次制冷剂CW 2连接到热交换器以调节初级制冷剂的温度;以及冷冻回路140，其具有插入在二级制冷剂循环回路中的第一热交换器141，并且通过三级制冷剂来调节二级制冷剂的温度。 一次制冷剂的温度通过二次制冷剂调节，而不使用冷冻回路来调节温度。 当初级制冷剂的温度被设定为高于二次制冷剂的温度时，一次制冷剂的温度只能通过二次制冷剂进行调节。 只有当初级制冷剂的温度低于二次制冷剂的温度时，通过冷冻回路调节二次制冷剂的温度，因此能够节约能源。

公开(公告)号：US20050155373A1

公开(公告)日：2005-07-21

申请号：US11075884

申请日：2005-03-10

申请人： Takaaki Hirooka ,  Masao Furuya ,  Shohei Tsutsumi

发明人： Takaaki Hirooka ,  Masao Furuya ,  Shohei Tsutsumi

IPC分类号： F25B9/00 ,  F25B39/02 ,  F28D7/04 ,  H01J37/32 ,  H01L21/00 ,  F25D25/00 ,  F24F3/16 ,  F25B1/00

CPC分类号： H01L21/67109 ,  F25B9/008 ,  F25B39/02 ,  F25B2309/06 ,  F28D7/04 ,  H01J37/32724 ,  H01J2237/2001

摘要： The electrode temperature control device in a processing apparatus 100 includes a freezing circuit 110 comprising a compressor 148, a condenser 142, an expansion valve 150 and an evaporator 108 with the evaporator disposed inside a lower electrode 106. This electrode temperature control device does not require components such as a coolant tank for storing the coolant, a pump for supplying the coolant to the processing apparatus, a heater for adjusting the temperature of the coolant and a heat exchanger for exchanging heat between a primary coolant and a secondary coolant. Thus, the production cost can be lowered, a reduction in installation area through miniaturization of the apparatus is achieved and more efficient use of energy is achieved as well. In addition, by using CO2 as the coolant, the GWP value can be reduced to approximately {fraction (1/8000)} to {fraction (1/7000)} that of Freon.

摘要翻译： 处理装置100中的电极温度控制装置包括冷冻回路110，其包括压缩机148，冷凝器142，膨胀阀150和蒸发器108，蒸发器设置在下部电极106的内部。 该电极温度控制装置不需要诸如用于存储冷却剂的冷却剂罐，用于将冷却剂供应到处理装置的泵，用于调节冷却剂的温度的加热器和用于在主冷却剂之间进行热交换的热交换器 和二次冷却液。 因此，可以降低生产成本，实现通过设备的小型化减少安装面积，并且还实现更有效的能量利用。 此外，通过使用CO 2 2作为冷却剂，GWP值可以降低到大约{分数（1/8000至{分数（氟利昂的1/7000）。

公开(公告)号：US06629423B1

公开(公告)日：2003-10-07

申请号：US10048068

申请日：2002-01-28

申请人： Takaaki Hirooka ,  Masao Furuya

发明人： Takaaki Hirooka ,  Masao Furuya

IPC分类号： F25B4100

CPC分类号： H01L21/67248 ,  H01J2237/2001 ,  H01J2237/32 ,  H01L21/67109

摘要： A refrigerant circulating passage is provided in a bottom electrode in a processing chamber of an etching system. A refrigerant CW1 is fed from a refrigerant tank to the passage via a refrigerant supply pipe. The refrigerant is cooled in a cooler via a refrigerant pipe and is returned to the refrigerant tank. Temperature sensors provided in the refrigerant supply pipe and refrigerant discharge pipe, detect a feed temperature, an inlet temperature, an outlet temperature and a return temperature, respectively. A target differential value is derived from the heat quantity of a wafer. During processing, the temperature of the refrigerant CW1 is controlled, permitting an actual differential value between the inlet and outlet temperatures follow the target differential value which in turn permits the return temperature to follow a target return temperature which is obtained by subtracting the target differential value from a set temperature of the wafer W.

摘要翻译： 制冷剂循环通道设置在蚀刻系统的处理室中的底部电极中。 制冷剂CW1经由制冷剂供给管从制冷剂罐供给到通路。 制冷剂通过制冷剂管在冷却器中冷却并返回到制冷剂罐。 设置在制冷剂供给管和制冷剂排出管内的温度传感器分别检测进料温度，入口温度，出口温度和回流温度。 从晶片的热量导出目标微分值。 在处理过程中，控制制冷剂CW1的温度，允许入口和出口温度之间的实际差值跟随目标差值，这进而允许返回温度跟随目标返回温度，该目标返回温度通过减去目标差值 从晶片W的设定温度