公开(公告)号：US08178631B2

公开(公告)日：2012-05-15

申请号：US11992136

申请日：2006-09-21

申请人： Takashi Enoki ,  Atsushi Izumi ,  Hiromi Oki ,  Yukiharu Ono ,  Kazuyoshi Fujita

发明人： Takashi Enoki ,  Atsushi Izumi ,  Hiromi Oki ,  Yukiharu Ono ,  Kazuyoshi Fujita

IPC分类号： C08G73/06 ,  C08G73/22

CPC分类号： H01L21/02205 ,  C08G73/22 ,  C09D179/04 ,  H01L21/02118 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/31695 ,  Y10T428/269

摘要： Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

摘要翻译： 公开了一种树脂组合物，其包含具有通过使二氨基苯酚化合物和二羧酸化合物反应获得的第一重复单元的苯并恶唑树脂前体和交联剂，其中至少一种双氨基苯酚化合物和二羧酸化合物具有金刚石结构 。 苯并恶唑树脂前体还包含通过使不具有类金刚石结构的二氨基苯酚化合物与不具有金刚石结构的二羧酸化合物反应获得的第二重复单元。 还公开了包含树脂组合物的树脂膜。

公开(公告)号：US20090214860A1

公开(公告)日：2009-08-27

申请号：US11992136

申请日：2006-09-21

申请人： Takashi Enoki ,  Atsushi Izumi ,  Hiromi Oki ,  Yukiharu Ono ,  Kazuyoshi Fujita

发明人： Takashi Enoki ,  Atsushi Izumi ,  Hiromi Oki ,  Yukiharu Ono ,  Kazuyoshi Fujita

IPC分类号： C08L79/04 ,  C08L77/00 ,  C08L79/00 ,  B32B17/10

CPC分类号： H01L21/02205 ,  C08G73/22 ,  C09D179/04 ,  H01L21/02118 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/31695 ,  Y10T428/269

摘要： Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

摘要翻译： 公开了一种树脂组合物，其包含具有通过使二氨基苯酚化合物和二羧酸化合物反应获得的第一重复单元的苯并恶唑树脂前体和交联剂，其中至少一种双氨基苯酚化合物和二羧酸化合物具有金刚石结构 。 苯并恶唑树脂前体还包含通过使不具有类金刚石结构的二氨基苯酚化合物与不具有金刚石结构的二羧酸化合物反应获得的第二重复单元。 还公开了包含树脂组合物的树脂膜。

公开(公告)号：US07863347B2

公开(公告)日：2011-01-04

申请号：US12294592

申请日：2007-03-16

申请人： Kazuyoshi Fujita ,  Atsushi Izumi ,  Yumiko Yamanoi ,  Takahiro Harada ,  Hiromi Oki ,  Yukiharu Ono

发明人： Kazuyoshi Fujita ,  Atsushi Izumi ,  Yumiko Yamanoi ,  Takahiro Harada ,  Hiromi Oki ,  Yukiharu Ono

IPC分类号： C08G63/44 ,  C08G63/52 ,  C08G65/50 ,  C08G69/26 ,  C08G73/10 ,  C08G73/22 ,  C08L101/02

CPC分类号： H01L21/02118 ,  C08G63/19 ,  C08L65/00 ,  H01L21/02282 ,  H01L21/312

摘要： A resin composition is provided comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond, —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

摘要翻译： 提供一种树脂组合物，其包含具有由式（1）表示的结构的化合物和交联剂：其中在式（1）中，R 0为单键或具有由式（2）表示的结构; R1至R8分别是氢，具有脂环结构的基团，除具有脂环结构，羟基和羧基的基团以外的具有1〜10个碳原子的有机基团中的任一个。 “X”为-O-，-NHCO-，-CONH - ， - COO-和-OCO-; 此外，式（2）中，“Ar”为芳香族基团， “Y”为单键，-O - ， - S - ， - OCO-和-COO-; “q”为1以上的整数， 当“q”为2以上的整数时，R 9为氢或碳原子数为1以上的有机基团，可以相同或不同， 当R 0为单键时，R 1至R 8中的至少一个为具有脂环结构的基团; 当R 0具有由式（2）表示的结构时，R 1至R 9中的至少一个为具有脂环结构的基团。 “*”和“**”表示与不同化学结构键合的位置。

公开(公告)号：US20090118431A1

公开(公告)日：2009-05-07

申请号：US12294592

申请日：2007-03-16

申请人： Kazuyoshi Fujita ,  Atsushi Izumi ,  Yumiko Yamanoi ,  Takahiro Harada ,  Hiromi Oki ,  Yukiharu Ono

发明人： Kazuyoshi Fujita ,  Atsushi Izumi ,  Yumiko Yamanoi ,  Takahiro Harada ,  Hiromi Oki ,  Yukiharu Ono

IPC分类号： C08G69/48 ,  C08F283/00 ,  C08F16/00 ,  C08F126/06 ,  C08F8/32

CPC分类号： H01L21/02118 ,  C08G63/19 ,  C08L65/00 ,  H01L21/02282 ,  H01L21/312

摘要： A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same.In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

摘要翻译： 本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物，其清漆，其树脂膜和使用其的半导体器件。 在本发明中，通过包含具有式（1）所示结构的化合物和交联剂的树脂组合物实现目的：其中在式（1）中，R 0为单键或具有由式 2）; R1至R8分别是氢，具有脂环结构的基团，除具有脂环结构，羟基和羧基的基团以外的具有1〜10个碳原子的有机基团中的任一个。 “X”为-O-，-NHCO-，-CONH - ， - COO-和-OCO-; 此外，式（2）中，“Ar”为芳香族基团， “Y”是单键-O - ， - S - ， - OCO-和-COO-; “q”为1以上的整数， 当“q”为2以上的整数时，R 9为氢或碳原子数为1以上的有机基团，可以相同或不同， 当R 0为单键时，R 1至R 8中的至少一个为具有脂环结构的基团; 当R 0具有由式（2）表示的结构时，R 1至R 9中的至少一个为具有脂环结构的基团。 “*”和“**”表示与不同化学结构键合的位置。

公开(公告)号：US06664344B1

公开(公告)日：2003-12-16

申请号：US09762950

申请日：2001-02-15

申请人： Hiromi Oki ,  Yoshiyuki Go ,  Sumiya Miyake ,  Yoshihito Akiyama

发明人： Hiromi Oki ,  Yoshiyuki Go ,  Sumiya Miyake ,  Yoshihito Akiyama

IPC分类号： C08L6300

CPC分类号： H01L23/293 ,  C08G59/621 ,  C08G59/688 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition comprising a compound (A) having two or more epoxy groups in the molecule, a co-condensation product (B) having two or more phenolic hydroxyl groups in the molecule, and a molecular association product (C) of a tetra-substituted phosphonium (X), a compound (Y) having two or more phenolic hydroxyl groups in the molecule, and a conjugate base of the compound (Y) having two or more phenolic hydroxyl groups in the molecule, said conjugate base being a phenoxide type compound obtained by removing a hydrogen atom from the aforesaid compound (Y) having two or more phenolic hydroxyl groups in the molecule.

摘要翻译： 本发明提供了具有快速固化性和优异的储存稳定性的环氧树脂组合物，并且在电子和电气材料领域中是有用的。 也就是说，本发明是一种环氧树脂组合物，其包含分子中具有两个以上环氧基的化合物（A），分子中具有两个以上酚羟基的共缩合产物（B）和分子缔合 四取代鏻（X）的产物（C），分子中具有两个或多个酚羟基的化合物（Y）和分子中具有两个或多个酚羟基的化合物（Y）的共轭碱 所述共轭碱是通过从分子中具有两个或多个酚羟基的上述化合物（Y）除去氢原子得到的酚盐型化合物。