公开(公告)号：US08178631B2

公开(公告)日：2012-05-15

申请号：US11992136

申请日：2006-09-21

申请人： Takashi Enoki ,  Atsushi Izumi ,  Hiromi Oki ,  Yukiharu Ono ,  Kazuyoshi Fujita

发明人： Takashi Enoki ,  Atsushi Izumi ,  Hiromi Oki ,  Yukiharu Ono ,  Kazuyoshi Fujita

IPC分类号： C08G73/06 ,  C08G73/22

CPC分类号： H01L21/02205 ,  C08G73/22 ,  C09D179/04 ,  H01L21/02118 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/31695 ,  Y10T428/269

摘要： Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

摘要翻译： 公开了一种树脂组合物，其包含具有通过使二氨基苯酚化合物和二羧酸化合物反应获得的第一重复单元的苯并恶唑树脂前体和交联剂，其中至少一种双氨基苯酚化合物和二羧酸化合物具有金刚石结构 。 苯并恶唑树脂前体还包含通过使不具有类金刚石结构的二氨基苯酚化合物与不具有金刚石结构的二羧酸化合物反应获得的第二重复单元。 还公开了包含树脂组合物的树脂膜。

公开(公告)号：US20090214860A1

公开(公告)日：2009-08-27

申请号：US11992136

申请日：2006-09-21

申请人： Takashi Enoki ,  Atsushi Izumi ,  Hiromi Oki ,  Yukiharu Ono ,  Kazuyoshi Fujita

发明人： Takashi Enoki ,  Atsushi Izumi ,  Hiromi Oki ,  Yukiharu Ono ,  Kazuyoshi Fujita

IPC分类号： C08L79/04 ,  C08L77/00 ,  C08L79/00 ,  B32B17/10

CPC分类号： H01L21/02205 ,  C08G73/22 ,  C09D179/04 ,  H01L21/02118 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/31695 ,  Y10T428/269

摘要： Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

摘要翻译： 公开了一种树脂组合物，其包含具有通过使二氨基苯酚化合物和二羧酸化合物反应获得的第一重复单元的苯并恶唑树脂前体和交联剂，其中至少一种双氨基苯酚化合物和二羧酸化合物具有金刚石结构 。 苯并恶唑树脂前体还包含通过使不具有类金刚石结构的二氨基苯酚化合物与不具有金刚石结构的二羧酸化合物反应获得的第二重复单元。 还公开了包含树脂组合物的树脂膜。

公开(公告)号：US07863347B2

公开(公告)日：2011-01-04

申请号：US12294592

申请日：2007-03-16

申请人： Kazuyoshi Fujita ,  Atsushi Izumi ,  Yumiko Yamanoi ,  Takahiro Harada ,  Hiromi Oki ,  Yukiharu Ono

发明人： Kazuyoshi Fujita ,  Atsushi Izumi ,  Yumiko Yamanoi ,  Takahiro Harada ,  Hiromi Oki ,  Yukiharu Ono

IPC分类号： C08G63/44 ,  C08G63/52 ,  C08G65/50 ,  C08G69/26 ,  C08G73/10 ,  C08G73/22 ,  C08L101/02

CPC分类号： H01L21/02118 ,  C08G63/19 ,  C08L65/00 ,  H01L21/02282 ,  H01L21/312

摘要： A resin composition is provided comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond, —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

摘要翻译： 提供一种树脂组合物，其包含具有由式（1）表示的结构的化合物和交联剂：其中在式（1）中，R 0为单键或具有由式（2）表示的结构; R1至R8分别是氢，具有脂环结构的基团，除具有脂环结构，羟基和羧基的基团以外的具有1〜10个碳原子的有机基团中的任一个。 “X”为-O-，-NHCO-，-CONH - ， - COO-和-OCO-; 此外，式（2）中，“Ar”为芳香族基团， “Y”为单键，-O - ， - S - ， - OCO-和-COO-; “q”为1以上的整数， 当“q”为2以上的整数时，R 9为氢或碳原子数为1以上的有机基团，可以相同或不同， 当R 0为单键时，R 1至R 8中的至少一个为具有脂环结构的基团; 当R 0具有由式（2）表示的结构时，R 1至R 9中的至少一个为具有脂环结构的基团。 “*”和“**”表示与不同化学结构键合的位置。

公开(公告)号：US20090118431A1

公开(公告)日：2009-05-07

申请号：US12294592

申请日：2007-03-16

申请人： Kazuyoshi Fujita ,  Atsushi Izumi ,  Yumiko Yamanoi ,  Takahiro Harada ,  Hiromi Oki ,  Yukiharu Ono

发明人： Kazuyoshi Fujita ,  Atsushi Izumi ,  Yumiko Yamanoi ,  Takahiro Harada ,  Hiromi Oki ,  Yukiharu Ono

IPC分类号： C08G69/48 ,  C08F283/00 ,  C08F16/00 ,  C08F126/06 ,  C08F8/32

CPC分类号： H01L21/02118 ,  C08G63/19 ,  C08L65/00 ,  H01L21/02282 ,  H01L21/312

摘要： A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same.In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

摘要翻译： 本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物，其清漆，其树脂膜和使用其的半导体器件。 在本发明中，通过包含具有式（1）所示结构的化合物和交联剂的树脂组合物实现目的：其中在式（1）中，R 0为单键或具有由式 2）; R1至R8分别是氢，具有脂环结构的基团，除具有脂环结构，羟基和羧基的基团以外的具有1〜10个碳原子的有机基团中的任一个。 “X”为-O-，-NHCO-，-CONH - ， - COO-和-OCO-; 此外，式（2）中，“Ar”为芳香族基团， “Y”是单键-O - ， - S - ， - OCO-和-COO-; “q”为1以上的整数， 当“q”为2以上的整数时，R 9为氢或碳原子数为1以上的有机基团，可以相同或不同， 当R 0为单键时，R 1至R 8中的至少一个为具有脂环结构的基团; 当R 0具有由式（2）表示的结构时，R 1至R 9中的至少一个为具有脂环结构的基团。 “*”和“**”表示与不同化学结构键合的位置。

公开(公告)号：US20080255335A1

公开(公告)日：2008-10-16

申请号：US11663854

申请日：2005-09-29

申请人： Takashi Enoki ,  Atsushi Izumi ,  Yumiko Yamamoto ,  Takahiro Harada

发明人： Takashi Enoki ,  Atsushi Izumi ,  Yumiko Yamamoto ,  Takahiro Harada

IPC分类号： C08G65/40

CPC分类号： C08L79/08 ,  C08L79/04 ,  C09D179/04 ,  C09D179/08 ,  H01L51/052

摘要： A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.

摘要翻译： 通过具有由通式（1）表示的结构的化合物的树脂组合物提供热处理后的耐热性和介电常数低的树脂组合物，其清漆和使用该树脂组合物的半导体装置：其中“Ar “是一个芳香族群; “a”为0或1; R 11是具有一个或多个碳原子的有机基团，并且至少一个是具有脂环结构的基团; 当“q”为2以上的整数时，R 11彼此可以相同也可以不同， R 1至R 5中的至少一个和相应苯上的R 6至R 10中的至少一个 环是Ar结合位点或R 11-11结合位点，其它R 1至R 5和R 6结合位点， R 1至R 10各自为氢，具有脂环结构的基团，具有1-10个碳原子的有机基团，羟基或羧基; 当“a”为0时，R 1至R 5和R 6至R 10中的至少一个为至少一个， 是具有脂环结构的基团; “q”为1以上的整数， “X”是-O-，-NHCO-，-COHN-，-COO-和-OCO-中的任何一个。

公开(公告)号：US08337982B2

公开(公告)日：2012-12-25

申请号：US11722625

申请日：2005-06-20

申请人： Takashi Enoki ,  Atsushi Izumi

发明人： Takashi Enoki ,  Atsushi Izumi

IPC分类号： C08G73/22

CPC分类号： H01L21/02205 ,  C08G73/22 ,  H01L21/02118 ,  H01L21/312 ,  Y10T428/249991

摘要： A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

摘要翻译： 一种苯并恶唑树脂前体，其包含通过双氨基苯酚化合物和二羧酸化合物的反应获得的第一重复单元，其中至少一个具有金刚石结构; 进一步包含通过不具有金刚石结构的二氨基苯酚化合物与不具有类金刚石结构的二羧酸化合物的反应获得的第二重复单元的苯并恶唑树脂前体; 通过脱水上述苯并恶唑树脂前体进行闭环反应得到的聚苯并恶唑树脂; 由苯并恶唑树脂前体或聚苯并恶唑树脂构成的树脂膜。 可以从苯并恶唑树脂前体获得聚苯并恶唑树脂和具有优异的耐热性和小介电常数的树脂膜和使用树脂膜的半导体器件。

公开(公告)号：US07652125B2

公开(公告)日：2010-01-26

申请号：US11663854

申请日：2005-09-29

申请人： Takashi Enoki ,  Atsushi Izumi ,  Yumiko Yamamoto ,  Takahiro Harada

发明人： Takashi Enoki ,  Atsushi Izumi ,  Yumiko Yamamoto ,  Takahiro Harada

IPC分类号： C08G65/40 ,  C08G65/38

CPC分类号： C08L79/08 ,  C08L79/04 ,  C09D179/04 ,  C09D179/08 ,  H01L51/052

摘要： A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.

摘要翻译： 通过具有由通式（1）表示的结构的化合物的树脂组合物提供热处理后的耐热性和介电常数低的树脂组合物，其清漆和使用该树脂组合物的半导体装置：其中“Ar “是一个芳香族群; “a”为0或1; R11是具有一个或多个碳原子的有机基团，并且至少一个是具有脂环结构的基团; 当“q”为2以上的整数时，R 11可以相同也可以不同， R 1〜R 5中的至少一个和各苯环上的R 6〜R 10中的至少一个为Ar结合位点或R 11结合位点，其中R 1〜R 5，R 6〜R 10为氢，具有脂环结构 具有1-10个碳原子的有机基团，羟基或羧基; 当“a”为0时，R 1至R 5和R 6至R 10中的至少一个为具有脂环结构的基团; “q”为1以上的整数， “X”是-O-，-NHCO-，-COHN-，-COO-和-OCO-中的任何一个。

公开(公告)号：US20080206548A1

公开(公告)日：2008-08-28

申请号：US11722625

申请日：2005-06-20

申请人： Takashi Enoki ,  Atsushi Izumi

发明人： Takashi Enoki ,  Atsushi Izumi

IPC分类号： B32B27/00 ,  C08G73/22

CPC分类号： H01L21/02205 ,  C08G73/22 ,  H01L21/02118 ,  H01L21/312 ,  Y10T428/249991

摘要： A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

摘要翻译： 一种苯并恶唑树脂前体，其包含通过双氨基苯酚化合物和二羧酸化合物的反应获得的第一重复单元，其中至少一个具有金刚石结构; 进一步包含通过不具有金刚石结构的二氨基苯酚化合物与不具有类金刚石结构的二羧酸化合物的反应获得的第二重复单元的苯并恶唑树脂前体; 通过脱水上述苯并恶唑树脂前体进行闭环反应得到的聚苯并恶唑树脂; 由苯并恶唑树脂前体或聚苯并恶唑树脂构成的树脂膜。 可以从苯并恶唑树脂前体获得聚苯并恶唑树脂和具有优异的耐热性和小介电常数的树脂膜和使用树脂膜的半导体器件。

公开(公告)号：US20090318610A1

公开(公告)日：2009-12-24

申请号：US12546632

申请日：2009-08-24

申请人： Mihoko MATSUTANI ,  Atsushi Izumi ,  Yohko Sano ,  Kazuyoshi Fujita

发明人： Mihoko MATSUTANI ,  Atsushi Izumi ,  Yohko Sano ,  Kazuyoshi Fujita

IPC分类号： C08L55/00 ,  C08G65/34 ,  C08G65/38 ,  C08G61/00 ,  C08F10/14 ,  C08L71/10 ,  C08L71/00

CPC分类号： H01L21/02118 ,  C07C13/615 ,  C07C13/64 ,  C07C2603/74 ,  C07C2603/90 ,  C08G61/04 ,  C08G2261/3328 ,  H01B3/30 ,  H01L21/02282 ,  H01L21/312

摘要： There are provided organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as organic insulating films with low permittivity, high heat resistance and high mechanical strength that employ the same, and semiconductor devices comprising the foregoing. An organic insulating material comprising a compound represented by general formula (1), or a polymer obtained by polymerizing a compound represented by general formula (1), or a mixture of a compound represented by general formula (1) and the polymer. X-VWnY  (1) (In formula (1), X and Y each independently represent one or more groups with polymerizable functional groups. V and W each represent a group having an adamantane or polyamantane structure, and they may be the same or different. The letter n represents an integer of 0 or greater).

摘要翻译： 提供具有低介电常数，高耐热性和高机械强度的有机绝缘材料，以及具有低介电常数，高耐热性和高机械强度的有机绝缘膜，以及包含上述的半导体器件。 包含由通式（1）表示的化合物或由通式（1）表示的化合物聚合而得到的聚合物或由通式（1）表示的化合物与聚合物的混合物的有机绝缘材料。 （1）（式（1）中，X和Y各自独立地表示一个以上具有聚合性官能团的基团，V和W各自表示具有金刚烷或聚金刚烷结构的基团，它们可以相同 或不同，字母n表示0以上的整数）。

公开(公告)号：US20080041841A1

公开(公告)日：2008-02-21

申请号：US11498126

申请日：2006-08-03

申请人： Yasuhiro Tanaka ,  Atsushi Izumi ,  Akinobu Tsuda

发明人： Yasuhiro Tanaka ,  Atsushi Izumi ,  Akinobu Tsuda

IPC分类号： H05B3/58

CPC分类号： H05B3/58

摘要： A heater-attached piping having, a cord-like heater disposed along substantially entire length of a nylon tube forming a pipe for transferring a fluid, and at least a heat-retaining layer disposed around the nylon tube and the cord-like heater. The cord-like heater located at the end of the nylon tube may be, for example, folded back and formed in a duplex arrangement. With this arrangement, heat generating at the end of the heater-attached piping increases and is duplicated to result in suppression of power consumption of the cord-like heater to a possible lowest limit, and the heat-retaining ability and defrosting ability in the end of the heater-attached piping can be enhanced.

摘要翻译： 一种加热器连接的管道，具有沿着形成用于传送流体的管的尼龙管的大致整个长度设置的绳状加热器，以及至少设置在尼龙管和绳状加热器周围的保温层。 位于尼龙管端部的线状加热器可以例如折叠并形成为双面布置。 通过这种布置，在加热器附接管道的端部产生的热量增加并重复，从而将线状加热器的功率消耗抑制到可能的最低限度，并且最终的保温能力和除霜能力 的加热器附接管道可以增强。