公开(公告)号：US08829355B2

公开(公告)日：2014-09-09

申请号：US12609447

申请日：2009-10-30

申请人： Takashi Kariya ,  Kazuhiro Yoshikawa ,  Daiki Komatsu ,  Ramesh Bhandari

发明人： Takashi Kariya ,  Kazuhiro Yoshikawa ,  Daiki Komatsu ,  Ramesh Bhandari

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H01L23/538 ,  H01L23/13 ,  H01L21/48 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K3/429 ,  H01L21/486 ,  H01L23/13 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/068 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer.

摘要翻译： 多层印刷布线板包括具有穿透部分的芯基材，容纳在芯基材的穿透部分内的低热膨胀基板，并且具有用于安装半导体元件的第一表面和在相对侧上的第二表面 所述第一通孔导体设置在所述低热膨胀基板内部并且设置用于在所述低热膨胀基板的第一表面和所述第二表面之间的电连接，填充在所述低热膨胀基板之间的间隙中的填料 低热膨胀基板和芯基材的内壁，以及形成在低热膨胀基板的第一表面和第二表面中的至少一个上的布线层，并且具有树脂绝缘层和导电 层。 布线层具有连接第一通孔导体和导电层的通孔导体。

公开(公告)号：US20100243299A1

公开(公告)日：2010-09-30

申请号：US12609447

申请日：2009-10-30

申请人： Takashi Kariya ,  Kazuhiro Yoshikawa ,  Daiki Komatsu ,  Ramesh Bhandari

发明人： Takashi Kariya ,  Kazuhiro Yoshikawa ,  Daiki Komatsu ,  Ramesh Bhandari

IPC分类号： H05K1/02 ,  B32B38/10

CPC分类号： H05K3/429 ,  H01L21/486 ,  H01L23/13 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/068 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer.

摘要翻译： 多层印刷布线板包括具有穿透部分的芯基材，容纳在芯基材的穿透部分内的低热膨胀基板，并且具有用于安装半导体元件的第一表面和在相对侧上的第二表面 所述第一通孔导体设置在所述低热膨胀基板内部并且设置用于在所述低热膨胀基板的第一表面和所述第二表面之间的电连接，填充在所述低热膨胀基板之间的间隙中的填料 低热膨胀基板和芯基材的内壁，以及形成在低热膨胀基板的第一表面和第二表面中的至少一个上的布线层，并且具有树脂绝缘层和导电 层。 布线层具有连接第一通孔导体和导电层的通孔导体。

公开(公告)号：US08233397B1

公开(公告)日：2012-07-31

申请号：US12803045

申请日：2011-02-28

申请人： Ramesh Bhandari

发明人： Ramesh Bhandari

IPC分类号： G01R31/08

CPC分类号： H04L45/12

摘要： A device and method of minimally incrementing and decrementing the weights of a minimal number of links in a network to cause a link/node that is not in the shortest path in the network to be in the shortest path by determining the shortest path with link/node, identifying links in this path that are not in the shortest path without link/node, decrementing identified links to make the path the shortest path, identifying a link in the shortest path without link/node not in the path with link/node, incrementing the link, redoing these steps to determine a number of links and modifications to links that would cause the link/node to appear in the shortest path, identifying the set of links and modifications with the fewest links, and modifying the network in accordance with the identified set.

摘要翻译： 一种将网络中最小数量的链路的权重最小化递减递减的装置和方法，通过确定具有链路/链路的最短路径，使网络中不在最短路径中的链路/节点处于最短路径， 节点，识别不在没有链路/节点的最短路径中的路径中的链路，递减所识别的链路以使路径成为最短路径，在没有链路/节点的情况下识别链路不具有链路/节点的路径， 增加链接，重新执行这些步骤以确定链接的多个链接和修改，这些链接和链接将导致链路/节点出现在最短路径中，用最少链路识别链路和修改集合，并根据 识别集。