摘要:
According to one embodiment, a nonvolatile memory device including a nonvolatile memory layer is provided. The nonvolatile memory layer is formed of a metal oxide film that includes an element with a higher electronegativity compared with a metal element forming the metal oxide film in the metal oxide film at a concentration of 25 at % or less.
摘要:
According to one embodiment, a nonvolatile memory device is provided, which includes a nonvolatile memory element in which an anode, a nonvolatile memory layer formed of a metal oxide film, and a cathode are stacked. The anode is formed of a metal nitride material and includes nitrogen more than a stoichiometric ratio of the metal nitride material. The cathode is formed of a metal material.
摘要:
A semiconductor device includes a semiconductor substrate, a first memory cell transistor, a first select gate transistor, a second memory cell transistor, a second select gate transistor, a contact plug, silicon oxide films, and plasma films which are formed as the same layer as the silicon oxide films and are provided above upper surfaces of the first and the third gate electrodes.
摘要:
A resistance change memory includes a first conductive line extending in a first direction, a second conductive line extending in a second direction which is crossed to the first direction, a cell unit including a memory element and a rectifying element connected in series between the first and second conductive lines, and a control circuit which is connected to both of the first and second conductive lines. The control circuit controls a voltage to change a resistance of the memory element between first and second values reversibly. The rectifying element is a diode including an anode layer, a cathode layer and an insulating layer therebetween.