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公开(公告)号：US08446736B2
公开(公告)日：2013-05-21
申请号：US12305046
申请日：2008-05-28
IPC分类号： H05K1/11
CPC分类号： H05K1/183 , H01L21/481 , H01L21/4857 , H01L23/13 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/19105 , H05K3/4614 , H05K3/4697 , H05K2201/10378 , H05K2203/061 , H05K2203/063 , Y10T29/49126 , Y10T29/49144 , Y10T29/49165 , Y10T156/1062 , Y10T428/24273 , Y10T428/24893 , Y10T428/24917 , H01L2224/0401
摘要： An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.
摘要翻译： 具有开口并在表面层上形成电路的上板，具有开口的板和在通孔中填充有导电膏的形成导电孔的连接片和在表面层上形成电路的下板被堆叠 ，加热按压。 特别地，板之间的连接片由与上板和下板不同的材料制成。 可以制造具有空腔结构的多层电路板和具有高层间连接可靠性的全层IVH结构。
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公开(公告)号：US20090175017A1
公开(公告)日：2009-07-09
申请号：US12305046
申请日：2008-05-28
CPC分类号： H05K1/183 , H01L21/481 , H01L21/4857 , H01L23/13 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/19105 , H05K3/4614 , H05K3/4697 , H05K2201/10378 , H05K2203/061 , H05K2203/063 , Y10T29/49126 , Y10T29/49144 , Y10T29/49165 , Y10T156/1062 , Y10T428/24273 , Y10T428/24893 , Y10T428/24917 , H01L2224/0401
摘要： An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.
摘要翻译： 具有开口并在表面层上形成电路的上板，具有开口的板和在通孔中填充有导电膏的形成导电孔的连接片和在表面层上形成电路的下板被堆叠 ，加热按压。 特别地，板之间的连接片由与上板和下板不同的材料制成。 可以制造具有空腔结构的多层电路板和具有高层间连接可靠性的全层IVH结构。
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