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    MANUFACTURING METHOD FOR CIRCUIT BOARD, AND CIRCUIT BOARD
    2.
    发明申请
    MANUFACTURING METHOD FOR CIRCUIT BOARD, AND CIRCUIT BOARD 审中-公开
    电路板和电路板的制造方法

    公开(公告)号：US20120012371A1

    公开(公告)日：2012-01-19

    申请号：US13258092

    申请日：2010-03-26

    申请人： Takayuki Kita

    发明人： Takayuki Kita

    IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K3/36

    CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L23/5389 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H05K3/462 ,  H05K3/4697 ,  H05K2201/0133 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49126 ,  H01L2924/00

    摘要： A method of manufacturing circuit boards includes the steps of forming an upper board having an opening, and provided with a circuit and an insulating film layer formed on a surface thereof, forming a lower board provided with a circuit and an insulating film layer formed on a surface thereof, forming an inter-board connecting sheet having a through-hole filled with a conductive paste, and layering the lower board, the inter-board connecting sheet and the upper board together, and applying heat and pressure. The step of forming the lower board includes a step of forming the insulating film layer into a shape leaving a clearance provided between an end of the film layer and any of an end of the opening of the upper board and an end of an opening of the inter-board connecting sheet when these three items are layered together, and the step of applying heat and pressure includes a step of inserting a cushion member into the openings of the inter-board connecting sheet and the upper board and into the clearance.

    摘要翻译： 制造电路板的方法包括以下步骤：形成具有开口的上板，并且在其表面上形成有电路和绝缘膜层，形成设置有电路的下板和形成在绝缘膜层上的绝缘膜层 形成具有填充有导电浆料的通孔的板间连接片，并且将下板，板间连接片和上板层叠在一起，并施加热和压力。 形成下板的步骤包括以下步骤：将绝缘膜层形成为在膜层的端部与上板的开口的任一端部之间留有间隙的形状，以及 这些三个物品层叠在一起的板间连接片，并且施加热和压力的步骤包括将缓冲构件插入到板间连接片和上板的开口中并进入间隙的步骤。

    CIRCUIT BOARD
    3.
    发明申请
    CIRCUIT BOARD 失效
    电路板

    公开(公告)号：US20100051337A1

    公开(公告)日：2010-03-04

    申请号：US12514383

    申请日：2008-07-15

    申请人： Tadashi Nakamura ,  Takayuki Kita ,  Kota Fukasawa

    发明人： Tadashi Nakamura ,  Takayuki Kita ,  Kota Fukasawa

    IPC分类号： H05K1/00 ,  H05K1/11

    CPC分类号： H05K1/141 ,  H05K3/368 ,  H05K3/4069 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/10378

    摘要： A lower sub-board of a circuit board includes a first base layer having an upper surface, and a first wiring pattern provided on the upper surface of the first base layer. An upper sub-board of a circuit board includes a second base layer having a lower surface, and a second wiring pattern provided on the lower surface of the second base layer. A connection layer between lower and upper sub-boards includes an insulating layer having a lower surface and an upper surface, the lower surface of connection layer being situated on the upper surface of the first base layer, the upper surface of connection layer being situated on the lower surface of the second base layer, and a via-conductor passing through the insulating layer and connected to the first and second wiring patterns. This circuit board connects the sub-boards to each other via a via-conductor densely.

    摘要翻译： 电路板的下部子板包括具有上表面的第一基底层和设置在第一基底层的上表面上的第一布线图案。 电路板的上部子板包括具有下表面的第二基底层和设置在第二基底层的下表面上的第二布线图案。 下层和上层之间的连接层包括具有下表面和上表面的绝缘层，连接层的下表面位于第一基层的上表面上，连接层的上表面位于 第二基底层的下表面和穿过绝缘层并连接到第一和第二布线图案的通孔导体。 该电路板通过通孔导体密集地将子板彼此连接。

    Circuit board with connection layer with fillet
    5.
    发明授权
    Circuit board with connection layer with fillet 失效
    电路板带有圆角的连接层

    公开(公告)号：US08253033B2

    公开(公告)日：2012-08-28

    申请号：US12514383

    申请日：2008-07-15

    申请人： Tadashi Nakamura ,  Takayuki Kita ,  Kota Fukasawa

    发明人： Tadashi Nakamura ,  Takayuki Kita ,  Kota Fukasawa

    IPC分类号： H05K1/11

    CPC分类号： H05K1/141 ,  H05K3/368 ,  H05K3/4069 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/10378

    摘要： A lower sub-board of a circuit board includes a first base layer having an upper surface, and a first wiring pattern provided on the upper surface of the first base layer. An upper sub-board of a circuit board includes a second base layer having a lower surface, and a second wiring pattern provided on the lower surface of the second base layer. A connection layer between lower and upper sub-boards includes an insulating layer having a lower surface and an upper surface, the lower surface of connection layer being situated on the upper surface of the first base layer, the upper surface of connection layer being situated on the lower surface of the second base layer, and a via-conductor passing through the insulating layer and connected to the first and second wiring patterns. This circuit board connects the sub-boards to each other via a via-conductor densely.

    摘要翻译： 电路板的下部子板包括具有上表面的第一基底层和设置在第一基底层的上表面上的第一布线图案。 电路板的上部子板包括具有下表面的第二基底层和设置在第二基底层的下表面上的第二布线图案。 下层和上层之间的连接层包括具有下表面和上表面的绝缘层，连接层的下表面位于第一基层的上表面上，连接层的上表面位于 第二基底层的下表面和穿过绝缘层并连接到第一和第二布线图案的通孔导体。 该电路板通过通孔导体密集地将子板彼此连接。