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    INFRARED SENSOR
    1.
    发明申请
    INFRARED SENSOR 有权
    红外传感器

    公开(公告)号：US20120228503A1

    公开(公告)日：2012-09-13

    申请号：US13390805

    申请日：2010-08-06

    申请人： Takayuki Nishikawa ,  Sukoya Tawaratsumida ,  Sadayuki Sumi

    发明人： Takayuki Nishikawa ,  Sukoya Tawaratsumida ,  Sadayuki Sumi

    IPC分类号： G01J5/10

    CPC分类号： G01J5/34 ,  G01J5/04 ,  G01J5/045 ,  G01J5/048 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0875 ,  G01J5/0881 ,  G01J5/0893 ,  H01L2224/16225

    摘要： The infrared sensor in accordance with the present invention includes a pyroelectric element, an IC device, and a surface-mounted package. The IC device is configured to process an output signal of the pyroelectric element. The package houses the pyroelectric element and the IC device. The package includes a package body and a package lid configured to transmit infrared rays to be detected by the pyroelectric element, and has electrical conductivity. The package body is provided on its surface with plural recessed parts arranged in tiers. The IC device is mounted on a bottom of the lower recessed part. The package body includes an output wiring configured to electrically connect an output terminal of the IC device to an external connection terminal and a shielding member interposed between the pyroelectric element and the output wiring.

    摘要翻译： 根据本发明的红外线传感器包括热电元件，IC器件和表面安装封装。 IC器件被配置为处理热电元件的输出信号。 该封装容纳热电元件和IC器件。 该封装包括一个封装体和一个封装盖，其被配置成透射由热电元件检测的红外线，并具有导电性。 包装体在其表面上设置有多个排列成多个凹陷部分。 IC器件安装在下凹部的底部。 封装体包括：输出布线，其被配置为将IC器件的输出端子与外部连接端子和插入在热电元件和输出布线之间的屏蔽构件电连接。

    Infrared sensor
    2.
    发明授权
    Infrared sensor 有权
    红外传感器

    公开(公告)号：US09074935B2

    公开(公告)日：2015-07-07

    申请号：US13390805

    申请日：2010-08-06

    申请人： Takayuki Nishikawa ,  Sukoya Tawaratsumida ,  Sadayuki Sumi

    发明人： Takayuki Nishikawa ,  Sukoya Tawaratsumida ,  Sadayuki Sumi

    IPC分类号： G01J5/10 ,  G01J5/34 ,  G01J5/04 ,  G01J5/06 ,  G01J5/08

    CPC分类号： G01J5/34 ,  G01J5/04 ,  G01J5/045 ,  G01J5/048 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0875 ,  G01J5/0881 ,  G01J5/0893 ,  H01L2224/16225

    摘要： The infrared sensor in accordance with the present invention includes a pyroelectric element, an IC device, and a surface-mounted package. The IC device is configured to process an output signal of the pyroelectric element. The package houses the pyroelectric element and the IC device. The package includes a package body and a package lid configured to transmit infrared rays to be detected by the pyroelectric element, and has electrical conductivity. The package body is provided on its surface with plural recessed parts arranged in tiers. The IC device is mounted on a bottom of the lower recessed part. The package body includes an output wiring configured to electrically connect an output terminal of the IC device to an external connection terminal and a shielding member interposed between the pyroelectric element and the output wiring.

    摘要翻译： 根据本发明的红外线传感器包括热电元件，IC器件和表面安装封装。 IC器件被配置为处理热电元件的输出信号。 该封装容纳热电元件和IC器件。 该封装包括一个封装体和一个封装盖，其被配置成透射由热电元件检测的红外线，并具有导电性。 包装体在其表面上设置有多个排列成多个凹陷部分。 IC器件安装在下凹部的底部。 封装体包括：输出布线，其被配置为将IC器件的输出端子与外部连接端子和插入在热电元件和输出布线之间的屏蔽构件电连接。

    Infrared detector and process for fabricating the same
    6.
    发明授权
    Infrared detector and process for fabricating the same 失效
    红外探测器及其制造方法

    公开(公告)号：US07671335B2

    公开(公告)日：2010-03-02

    申请号：US11883361

    申请日：2006-11-08

    申请人： Takayuki Nishikawa ,  Sadayuki Sumi ,  Tomohiro Kamitsu ,  Ryo Taniguchi ,  Masaya Hirata ,  Shin Sato

    发明人： Takayuki Nishikawa ,  Sadayuki Sumi ,  Tomohiro Kamitsu ,  Ryo Taniguchi ,  Masaya Hirata ,  Shin Sato

    IPC分类号： G01J5/20

    CPC分类号： H01L31/0203 ,  G01J1/02 ,  G01J1/0204 ,  G01J2001/0276 ,  H05K1/0218 ,  H05K1/185

    摘要： An infrared detector includes a circuit block carrying an infrared sensor element and electronic components. The circuit block is composed of a dielectric resin layer and a first substrate formed with a circuit pattern and mounting the electronic components. The dielectric resin layer is formed in its top with a recess which defines around its periphery with a shoulder for supporting opposite ends of the infrared sensor. The first substrate is integrated to the lower end of the dielectric resin layer with at least one of the electronic components being molded into the dielectric resin layer to make the circuit block of a unified mold structure. Thus, a part or all of the electronic components are molded into the dielectric layer to realize the circuit block of a simple and low profile structure, while retaining an advantage of keeping the infrared sensor element sufficiently away from the electronic components and an associated electronic circuit, thereby assuring to give the infrared detector which is simple in construction, economical in cost, and reliable in the infrared detection.

    摘要翻译： 红外线检测器包括一个载有红外传感器元件和电子部件的电路块。 电路块由介电树脂层和形成有电路图案的第一基板和安装电子部件组成。 电介质树脂层在其顶部形成有凹部，凹部围绕其周边限定有用于支撑红外传感器的相对端的肩部。 将第一衬底集成到电介质树脂层的下端，其中至少一个电子部件被模制到电介质树脂层中，以使电路块具有统一的模具结构。 因此，将一部分或全部电子部件模制到电介质层中以实现简单和低轮廓结构的电路块，同时保持将红外传感器元件充分远离电子部件和相关电子电路的优点 从而确保得到结构简单，成本经济，红外检测可靠的红外检测器。

    Infrared Detector and Process for Fabricating the Same
    7.
    发明申请
    Infrared Detector and Process for Fabricating the Same 失效
    红外探测器及其制造方法

    公开(公告)号：US20080111087A1

    公开(公告)日：2008-05-15

    申请号：US11883361

    申请日：2006-11-08

    申请人： Takayuki Nishikawa ,  Sadayuki Sumi ,  Tomohiro Kamitsu ,  Ryo Taniguchi ,  Masaya Hirata ,  Shin Sato

    发明人： Takayuki Nishikawa ,  Sadayuki Sumi ,  Tomohiro Kamitsu ,  Ryo Taniguchi ,  Masaya Hirata ,  Shin Sato

    IPC分类号： G21G5/00

    CPC分类号： H01L31/0203 ,  G01J1/02 ,  G01J1/0204 ,  G01J2001/0276 ,  H05K1/0218 ,  H05K1/185

    摘要： An infrared detector includes a circuit block carrying an infrared sensor element and electronic components. The circuit block is composed of a dielectric resin layer and a first substrate formed with a circuit pattern and mounting the electronic components. The dielectric resin layer is formed in its top with a recess which defines around its periphery with a shoulder for supporting opposite ends of the infrared sensor. The first substrate is integrated to the lower end of the dielectric resin layer with at least one of the electronic components being molded into the dielectric resin layer to make the circuit block of a unified mold structure. Thus, a part or all of the electronic components are molded into the dielectric layer to realize the circuit block of a simple and low profile structure, while retaining an advantage of keeping the infrared sensor element sufficiently away from the electronic components and an associated electronic circuit, thereby assuring to give the infrared detector which is simple in construction, economical in cost, and reliable in the infrared detection.

    摘要翻译： 红外线检测器包括一个载有红外传感器元件和电子部件的电路块。 电路块由介电树脂层和形成有电路图案的第一基板和安装电子部件组成。 电介质树脂层在其顶部形成有凹部，凹部围绕其周边限定有用于支撑红外传感器的相对端的肩部。 将第一衬底集成到电介质树脂层的下端，其中至少一个电子部件被模制到电介质树脂层中，以使电路块具有统一的模具结构。 因此，将一部分或全部电子部件模制到电介质层中以实现简单和低轮廓结构的电路块，同时保持将红外传感器元件充分远离电子部件和相关电子电路的优点 从而确保得到结构简单，成本经济，红外检测可靠的红外检测器。

    Pyroelectric-type IR receiving element and IR sensor using the same
    10.
    发明授权
    Pyroelectric-type IR receiving element and IR sensor using the same 失效
    热电型IR接收元件和使用其的IR传感器

    公开(公告)号：US6121614A

    公开(公告)日：2000-09-19

    申请号：US837105

    申请日：1997-04-14

    申请人： Ryo Taniguchi ,  Motoo Ikari ,  Tomoaki Matsushima ,  Hiroyuki Yagyu ,  Yoshihiro Matsumura ,  Kyosuke Iribe ,  Toshiyuki Suzuki ,  Sadayuki Sumi ,  Kazuhiro Horiuchi ,  Hideki Ohashi

    发明人： Ryo Taniguchi ,  Motoo Ikari ,  Tomoaki Matsushima ,  Hiroyuki Yagyu ,  Yoshihiro Matsumura ,  Kyosuke Iribe ,  Toshiyuki Suzuki ,  Sadayuki Sumi ,  Kazuhiro Horiuchi ,  Hideki Ohashi

    IPC分类号： G01J5/34 ,  G01J5/02 ,  H01L37/02

    CPC分类号： G01J5/34

    摘要： A pyroelectric-type IR receiving element comprises a pyroelectric substrate which is fixed to a supporting body at its support ends and at least one rectangular patch formed in the substrate. The patch is formed on its opposite surfaces with first and second electrodes which are overlapped to each other. The substrate has a U-shaped slit composed of a pair of side slits and a base slit connecting the side slits. The U-shaped slit surrounds continuously three sides of the patch, so that the patch is supported by the substrate in a cantilever fashion at a cantilever end which is opposed to one of the support ends of the substrate. Since a thermal stress applied to the substrate when the substrate is exposed to a temperature change is absorbed by the U-shaped slit, a stress concentration to be considered is not developed in the patch. As a result, it is possible to reduce the occurrence of popcorn noise, while maintaining good IR sensitivity.

    摘要翻译： 热电式IR接收元件包括热电衬底，其在其支撑端处固定到支撑体，并且在衬底中形成至少一个矩形贴片。 贴片在其相对表面上形成有彼此重叠的第一和第二电极。 基板具有由一对侧缝隙构成的U形狭缝和连接侧缝的基部狭缝。 U形狭缝连续地包围贴片的三个侧面，使得贴片以悬臂的方式由基底支撑在与基底的一个支撑端相对的悬臂端。 由于当基板暴露于温度变化时施加到基板的热应力被U形狭缝吸收，所以在贴片中不会产生要考虑的应力集中。 结果，可以在保持良好的红外线灵敏度的同时减少爆米花噪声的发生。