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    Substrate processing apparatus and method
    5.
    发明申请
    Substrate processing apparatus and method 审中-公开
    基板加工装置及方法

    公开(公告)号：US20070187259A1

    公开(公告)日：2007-08-16

    申请号：US11715971

    申请日：2007-03-09

    申请人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda

    发明人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda

    IPC分类号： B23H5/00

    CPC分类号： H01L21/6708 ,  C25F3/00 ,  C25F7/00

    摘要： A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.

    摘要翻译： 基板处理装置可以执行与普通的常规蚀刻不同的电解处理，以去除（清除）形成在或附着于基板的斜面部分等上的导电材料（膜）或处理 通过电化学作用的衬底的周边部分。 基板处理装置包括：具有多个电极的电极部，该多个电极层叠有绝缘体，并且具有与基板的周边部相对的保持部; 设置在电极部的保持部中的离子交换部; 液体供应部分，用于将液体供应到电极部分的保持位置; 以及用于向电极部分的电极施加电压使得电极交替具有不同极性的电源。

    Electrolytic processing device and substrate processing apparatus
    7.
    发明授权
    Electrolytic processing device and substrate processing apparatus 有权
    电解处理装置及基板处理装置

    公开(公告)号：US07101465B2

    公开(公告)日：2006-09-05

    申请号：US10337357

    申请日：2003-01-07

    申请人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda

    发明人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda

    IPC分类号： C25D17/00

    CPC分类号： B23H5/08

    摘要： There is provided an electrolytic processing device including: a processing electrode to be brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.

    摘要翻译： 提供了一种电解处理装置，包括：与工件接触或接近工件的处理电极; 用于向工件供电的供电电极; 离子交换器，其设置在所述工件和所述处理电极之间的至少一个空间中，以及所述工件与所述馈电电极之间; 用于在处理电极和馈电电极之间施加电压的电源; 以及液体供给部，用于将液体供给到工件与存在有离子交换器的处理电极和供电电极中的至少一个之间的空间。 还提供了具有该电解处理装置的基板处理装置。

    Electrochemical machining device and electrochemical machining method
    8.
    发明申请
    Electrochemical machining device and electrochemical machining method 审中-公开
    电化学加工装置和电化学加工方法

    公开(公告)号：US20060144711A1

    公开(公告)日：2006-07-06

    申请号：US10534232

    申请日：2003-07-18

    申请人： Itsuki Kobata ,  Masayuki Kumekawa ,  Osamu Nabeya ,  Roberto Serikawa ,  Takayuki Saito ,  Tsukuru Suzuki ,  Akira Kodera ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Mitsuhiko Shirakashi

    发明人： Itsuki Kobata ,  Masayuki Kumekawa ,  Osamu Nabeya ,  Roberto Serikawa ,  Takayuki Saito ,  Tsukuru Suzuki ,  Akira Kodera ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Mitsuhiko Shirakashi

    IPC分类号： B23H7/20

    CPC分类号： B23H3/02 ,  B23H5/08 ,  B23H9/00

    摘要： A object of this invention is to provide an electrolytic processing method and apparatus that can suppress a change in the electric conductivity of a fluid due to contaminants, such as processing products produced in electrolytic processing, so that the fluid can maintain good flattening properties. The electrolytic processing apparatus of this invention includes: a processing electrode (42) that can come into contact with a workpiece (W); a feeding electrode (44) for feeding electricity to the workpiece (W); a holder (22) for holding the workpiece (W); a power source (26) for applying a voltage between the processing electrode (42) and the feeding electrode (44); a fluid supply section (50) for supplying a fluid between the workpiece (W) and at least one of the processing electrode (42) and the feeding electrode (44); a sensor (80) for measuring the electric conductivity of the fluid; and a control section (84) for changing the processing conditions based on the electric conductivity measured by the sensor (80).

    摘要翻译： 本发明的目的是提供一种电解处理方法和装置，其可以抑制由电解处理中产生的加工产品等污染物引起的流体的导电性变化，使得流体能够保持良好的平坦化性能。 本发明的电解处理装置包括：可与工件（W）接触的处理电极（42）; 用于向工件（W）供电的供电电极（44）; 用于保持工件（W）的保持器（22）; 用于在处理电极（42）和馈电电极（44）之间施加电压的电源（26）; 用于在工件（W）和处理电极（42）和馈电电极（44）中的至少一个之间供应流体的流体供应部分（50）; 用于测量流体的电导率的传感器（80）; 以及用于根据由传感器（80）测量的电导率来改变处理条件的控制部分（84）。

    Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus
    10.
    发明申请
    Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus 审中-公开
    电化学机械抛光方法和电化学机械抛光装置

    公开(公告)号：US20090078583A1

    公开(公告)日：2009-03-26

    申请号：US12007956

    申请日：2008-01-17

    申请人： Itsuki Kobata ,  Akira Kodera ,  Yasushi Toma ,  Tsukuru Suzuki ,  Takayuki Saito ,  Yuji Makita ,  Hirokuni Hiyama

    发明人： Itsuki Kobata ,  Akira Kodera ,  Yasushi Toma ,  Tsukuru Suzuki ,  Takayuki Saito ,  Yuji Makita ,  Hirokuni Hiyama

    IPC分类号： B23H5/06 ,  B23H11/00 ,  C25F3/16 ,  C25F7/00

    CPC分类号： C25F3/00 ,  B23H5/08 ,  B24B37/013 ,  B24B49/105 ,  H01L21/32125

    摘要： A composite electrolytic processing method makes it possible to remove a conductive film without leaving it in an electrically-insulated state on an underlying barrier film, thereby exposing the barrier film. The electrochemical mechanical polishing method includes: applying a voltage between a first electrode connected to one pole of a power source and a second electrode, connected to the other pole of the power source, for feeding electricity to a conductive film of a polishing object; filling an electrolytic liquid into a space between the first electrode and the conductive film of the polishing object; and pressing and rubbing the conductive film against a polishing surface of a polishing pad to polish the conductive film in such a manner that a barrier film underlying the conductive film becomes gradually exposed from the center toward the periphery of the polishing object.

    摘要翻译： 复合电解处理方法使得可以在导电膜上去除导电膜而不会使其在下面的阻挡膜上处于电绝缘状态，从而暴露阻挡膜。 电化学机械抛光方法包括：在连接到电源的一个极的第一电极和连接到电源的另一个极的第二电极之间施加电压，用于向抛光对象的导电膜供电; 将电解液体填充到研磨对象物的第一电极和导电膜之间的空间内; 并且将导电膜按压并摩擦抛光垫的抛光表面以使导电膜抛光，使得导电膜下面的阻挡膜从研磨对象的中心逐渐露出。