公开(公告)号：US08493765B2

公开(公告)日：2013-07-23

申请号：US13365358

申请日：2012-02-03

申请人： Takayuki Yoshida ,  Mitsumi Itou ,  Shinya Tokunaga

发明人： Takayuki Yoshida ,  Mitsumi Itou ,  Shinya Tokunaga

IPC分类号： G11C5/06

CPC分类号： H05K1/0243 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/141 ,  H05K2201/09227 ,  H05K2201/10159 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： All interface pins for transmitting and receiving a signal having a predetermined function of a semiconductor integrated circuit element are formed on an outer periphery of the semiconductor integrated circuit element along one side of the semiconductor integrated circuit element. The one side of the semiconductor integrated circuit element is adjacent to two of sides of a BGA substrate, the two sides being not parallel to the one side. Of balls provided on the BGA substrate, balls electrically connected to the interface pins for transmitting and receiving a signal having a predetermined function are provided between the one side of the semiconductor integrated circuit element and the two sides of the BGA substrate.

摘要翻译： 用于发送和接收具有半导体集成电路元件的预定功能的信号的所有接口引脚沿半导体集成电路元件的一侧形成在半导体集成电路元件的外周上。 半导体集成电路元件的一侧与BGA基板的两侧相邻，两侧不平行于一侧。 设置在BGA基板上的球体，在半导体集成电路元件的一侧和BGA基板的两侧之间设置电连接到用于发送和接收具有预定功能的信号的接口引脚的滚珠。

公开(公告)号：US20050204327A1

公开(公告)日：2005-09-15

申请号：US11076939

申请日：2005-03-11

申请人： Kiyohito Mukai ,  Mitsumi Itou ,  Ritsuko Ozoe ,  Tatsuo Ohashi ,  Hiroyuki Tsujikawa

发明人： Kiyohito Mukai ,  Mitsumi Itou ,  Ritsuko Ozoe ,  Tatsuo Ohashi ,  Hiroyuki Tsujikawa

IPC分类号： G03F1/36 ,  G03F1/68 ,  G03F1/70 ,  G03F7/20 ,  G06F17/50 ,  H01L21/027 ,  H01L21/82

CPC分类号： G03F1/70 ,  G03F7/705

摘要： In the verification method of the present invention, a defect that is to cause a problem in fabrication is extracted from a mask pattern. The mask pattern is one obtained by deforming a mask pattern of a photomask used in a photolithography process so as to provide a transferred image close to a desired design pattern. The verification method includes the steps of: determining the exposure dose in the photolithography process; simulating the photolithography process on a computer based on the determined exposure dose; checking whether or not the desired design pattern has been obtained; and locating a fault point and outputting the result.

摘要翻译： 在本发明的验证方法中，从掩模图案中提取出导致制造中的问题的缺陷。 掩模图案是通过使用于光刻工艺中的光掩模的掩模图案变形而获得的，以便提供接近所需设计图案的转印图像。 验证方法包括以下步骤：确定光刻工艺中的曝光剂量; 基于所确定的曝光剂量在计算机上模拟光刻工艺; 检查是否获得了所需的设计图案; 并定位故障点并输出结果。