摘要:
A magnetic head apparatus including a magnetic head slider having at least one thin film magnetic head element, a suspension mounting the magnetic head slider on one face thereof, an IC chip mounted with a circuit for the thin film magnetic head element and a support arm fixedly supporting the suspension in which the IC chip is mounted on the one face of the suspension and is thermally coupled to the support arm.
摘要:
A HGA includes a magnetic head slider having at least one thin-film magnetic head element, an IC chip having a circuit for the at least one thin-film magnetic head element, and a suspension for supporting the magnetic head slider and the IC chip. All surfaces of the IC chip are coated by additional insulation layers.
摘要:
A method of mounting an IC chip on a suspension having connection pads. The IC chip has a circuit for a thin-film magnetic head element and connection terminals connected to the circuit. The method includes a step of increasing a load applied to the IC chip so that metal bumps formed on the connection terminals press the connection pads formed on the suspension, respectively, and a step of starting application of the ultrasonic vibration to the IC chip during the increasing of the load applied to the IC chip.
摘要:
There is disclosed a magnetic head device in which a head IC chip may be located relatively closer to a magnetic head and a thermal effect may be controlled to be within a range of acceptable degree. Said magnetic head device comprises a head slider having a magnetic head, a suspension member which is made of thin resilient material and supports the head slider at one end thereof, and a head IC chip, wherein the suspension member is attached to other member at the other end thereof. The IC chip is mounted on the suspension member. When the IC chip is selected to have appropriate disc side area and is mounted on the suspension member, the temperature of the IC chip itself may be maintained within a range of acceptable degree and that of the magnetic head may be also kept to be lower. When the electric power consumption of the IC chip is equal to or less than 410 mW, the disc side area thereof should be equal to or more than 1.1 mm2. The IC chip is mounted on a surface of the suspension member at a side facing to the disc at a position where a relative linear velocity equal to or more than 25 m/sec is generated with respect to said disc.
摘要:
A method of manufacturing a head suspension assembly includes attaching underfill to a portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted, disposing the IC chip on the attached underfill, and performing ultrasonic bonding of the IC chip.
摘要:
A head suspension assembly includes a magnetic head slider with at least one thin-film magnetic head element, an actuator fixed to the magnetic head slider for performing precise positioning of the at least one thin-film magnetic head element, a support member for supporting the actuator, a flexible first lead conductor member with one end electrically connected to the at least one thin-film magnetic head element, at least part of the first lead conductor member being formed on the support member, and a second lead conductor member with one end electrically connected to the actuator. At least part of the second lead conductor member is formed on the support member. The support member has a first portion on which the one end of the first lead conductor member is formed and a second portion. The first portion is individually separated from the second portion.
摘要:
The object of the invention is to provide a write/read head supporting mechanism for a magnetic or optical disk system having a micro-displacement actuator, by which any impediment to the displacement capability of the actuator is eliminated to achieve reliability improvements. The write/read head supporting mechanism comprises a slider, a suspension and an actuator as at least head constituents. The slider is provided with an electromagnetic transducer element or an optical module. The slider supported on the suspension by way of the actuator is displaceable relatively with respect to the suspension by the actuator. Between relatively displacing head constituents there is a space. Preferably, friction-reducing means should be provided in the space.
摘要:
A HSA includes a magnetic head slider with at least one thin-film magnetic head element, an actuator fixed to the magnetic head slider for performing precise positioning of the at least one thin-film magnetic head element, an IC chip having a first circuit for the thin-film magnetic head element and a second circuit for driving the actuator, and a suspension for supporting the actuator and the IC chip.
摘要:
A head suspension assembly includes a magnetic head slider with at least one thin-film magnetic head element, a head IC chip with a circuit for the at least one thin-film magnetic head element, and a support member for supporting the magnetic head slider and the head IC chip. The support member has a recess portion for reducing a protruded height of the head IC chip at a position for mounting the head IC chip.
摘要:
A method of testing a performance of the HGA has a step of writing information from the at least one thin-film magnetic head element onto a magnetic disk with driving the actuator for displacement by applying an alternating drive signal to the actuator, a step of reading out the information of at least one rotation of the magnetic disk by the at least one thin-film magnetic head element without driving the actuator for displacement, a step of storing the information read-out from the magnetic disk as a read-out information along a disk-rotating direction, a step of moving the HGA toward an off-track direction by a predetermined distance, a step of repeatedly executing the reading, storing and moving steps to obtain two-dimensional read-out information along the disk-rotating direction and the off-track direction, and a step of determining, from the two-dimensional read-out information, an off-track position where the read-out information becomes maximum at each position along the disk-rotating direction, the determined off-track positions being recognized as displaced positions of the actuator in response to the applied alternating drive signal.