公开(公告)号：US10940534B2

公开(公告)日：2021-03-09

申请号：US15741980

申请日：2016-08-23

申请人： TANAKA KIKINZOKU KOGYO K.K.

发明人： Teruhisa Iwai ,  Yuichi Makita ,  Hidekazu Matsuda ,  Hitoshi Kubo

IPC分类号： B22F1/00 ,  B22F9/30 ,  H01B1/22 ,  C08J7/06 ,  H05K1/09 ,  H05K3/12 ,  B23K35/02 ,  B23K35/30 ,  C08J3/20 ,  C08K3/08 ,  C08K5/17 ,  H01C17/065 ,  C08K9/04 ,  B22F5/00 ,  H01C7/00

摘要： A metal paste formed by kneading a solid content including silver particles and a solvent, in which the solid content includes silver particles containing silver particles having a particle size of 100 to 200 nm by 30% or more based on the number of particles, the silver particles have an average particle size of 60 to 800 nm as a whole, the silver particles constituting the solid content are bound with an amine compound having 4 to 8 carbon atoms in total as a protective agent, and the metal paste contains as an additive a high-molecular-weight ethyl cellulose having a number average molecular weight of 40000 to 90000. Since the metal paste contains a high-molecular-weight ethyl cellulose, a sintered body having a low resistance can be maintained while printability is improved. The metal paste has favorable printability, and can form a sintered body having a low resistance even in a low temperature region of 150° C. or lower.

公开(公告)号：US09901985B2

公开(公告)日：2018-02-27

申请号：US14891725

申请日：2014-05-20

申请人： Tanaka Kikinzoku Kogyo K.K.

发明人： Yuichi Makita ,  Yuusuke Ohshima ,  Hidekazu Matsuda ,  Noriaki Nakamura ,  Junichi Taniuchi ,  Hitoshi Kubo

IPC分类号： B22F9/30 ,  B22F1/00

CPC分类号： B22F9/30 ,  B22F1/0018 ,  B22F2301/255 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00

摘要： The present invention provides a method for producing silver particles, the method capable of adjusting the particle diameter to be within the range of several tens of nanometers to several hundreds of nanometers and also producing silver particles with a uniform particle diameter. The present invention relates to a method for producing silver particles by heating of a reaction system containing a thermally-decomposable silver-amine complex precursor, including a process of producing a silver-amine complex, a process of adding an organic compound having an amide (carboxylic amide) as a skeleton to a reaction system, and a process of heating the reaction system, in which a water content in the reaction system before the heating is 20 to 100 parts by weight relative to 100 parts by weight of the silver compound. The present invention can produce uniform silver particles while the particle diameter is controlled.

公开(公告)号：US09607922B2

公开(公告)日：2017-03-28

申请号：US14778684

申请日：2014-03-03

申请人： Tanaka Kikinzoku Kogyo K.K.

发明人： Kenji Matsuda ,  Dai Shinozaki ,  Yuichi Makita ,  Hitoshi Kubo ,  Yusuke Ohshima ,  Hidekazu Matsuda ,  Junichi Taniuchi

IPC分类号： H01L23/34 ,  H01L23/367 ,  H01L23/00 ,  H01L23/373 ,  H01L23/36 ,  H05K7/20

CPC分类号： H01L23/367 ,  H01L23/34 ,  H01L23/36 ,  H01L23/373 ,  H01L23/3736 ,  H01L24/01 ,  H01L2924/0002 ,  H05K7/20409 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor chip which can be a heat-generating semiconductor chip or a semiconductor relay substrate in which an integrated circuit or wiring is built in. A sintered-silver-coated film is adhered on a surface layer part of the semiconductor substrate, interposed by a silicon oxide film. A heat-dissipating fin (heat sink), which may be copper or aluminum, is bonded on the sintered-silver-coated film, interposed by an adhesive layer.