Abstract:
An embedded SCR in conjunction with a Gated-NMOS is created for protecting a chip input or output pad from ESD, by inserting a p+ diffusion and the n-well in the drain side and a part of the drain to forms a low-trigger, high efficiency SCR. The device layout is such that the drain connection is tightly tied together at the p+ diffusion and the n+ drain making that connection very short and, thereby, preventing latch-up. The parasitic SCR is contained entirely within the n+ diffusion (the source of the grounded gate NMOS transistor) at either side of the structure and, therefore, called an embedded SCR. For a 12 volt I/O device each of two n+ drains is placed in its own n-type doped drain (ndd) area straddling halfway the n-well. The structure is repeated as required and a p+ diffusion is implanted at both perimeters and connected to the nearest n+ source and a reference voltage.
Abstract:
A dynamic source coupled ESD protection circuit that dissipates an ESD voltage coupled to an electrical contact pad to protect internal circuits on an integrated circuits chip is described. The ESD protection circuit lowers the snapback voltage of the ESD protection circuit to allow a thinner gate oxide within the internal circuits of the integrated circuit chip. The dynamic substrate coupled electrostatic discharge protection circuit consists of a gated MOS transistor, a capacitor, and a resistor. The gated MOS transistor has a drain region connected to the electrical contact pad. The gate and source are connected to a power supply voltage source. The power supply voltage source will either be a substrate biasing voltage or ground reference point for a gated NMOS transistor. The power supply voltage source will be the power supply voltage source VDD for the gated PMOS transistor. The capacitor has a first plate connected to the electrical contact pad, and a second plate connected to said substrate bulk region of the MOS transistor. The resistor is a polycrystalline silicon resistor that is connected between the second plate of the capacitor and the power supply voltage source.
Abstract:
An embedded parasitic silicon controlled rectifier (SCR) in conjunction with a Gated-NMOS is created for protecting a chip input or output pad from electrostatic discharge ESD, by inserting a p+ diffusion and the n-well in the drain side and a part of the drain to forms a low-trigger, high efficiency SCR. The device layout is such that the drain connection is tightly tied together at the p+ diffusion and the n+ drain making that connection very short and, thereby, preventing latch-up. The parasitic SCR is contained entirely within the n+ diffusion (the source of the grounded gate NMOS transistor) at either side of the structure and, therefore, called an embedded SCR. For a 12 volt I/O device each of two n+ drains is placed in its own n-type doped drain (ndd) area straddling halfway the n-well. The structure is repeated as required and a p+ diffusion is implanted at both perimeters and connected to the nearest n+ source and a reference voltage.
Abstract:
A dynamic source coupled ESD protection circuit that dissipates an ESD voltage coupled to an electrical contact pad to protect internal circuits on an integrated circuits chip is described. The ESD protection circuit lowers the snapback voltage of the ESD protection circuit to allow a thinner gate oxide within the internal circuits of the integrated circuit chip. The dynamic substrate coupled electrostatic discharge protection circuit consists of a gated MOS transistor, a capacitor, and a resistor. The gated MOS transistor has a drain region connected to the electrical contact pad. The gate and source are connected to a power supply voltage source. The power supply voltage source will either be a substrate biasing voltage or ground reference point for a gated NMOS transistor. The power supply voltage source will be the power supply voltage source VDD for the gated PMOS transistor. The capacitor has a first plate connected to the electrical contact pad, and a second plate connected to said substrate bulk region of the MOS transistor. The resistor is a polycrystalline silicon resistor that is connected between the second plate of the capacitor and the power supply voltage source.
Abstract:
An integrated circuit chip includes a semiconductor substrate having thereon a plurality of IMD layers and a plurality of first conductive layers; a first passivation layer overlying the plurality of IMD layers and the first conductive layers; at least a first power/ground mesh wiring line in a first aluminum layer overlying the first Insulating layer; and at least a second power/ground mesh wiring line in a second aluminum layer overlying the first aluminum layer.
Abstract:
A similarity analysis framework is described herein which leverages two or more similarity analysis functions to generate synonyms for an entity reference string re. The functions are selected such that the synonyms that are generated by the framework satisfy a core set of synonym-related properties. The functions operate by leveraging query log data. One similarity analysis function takes into consideration the strength of similarity between a particular candidate string se and an entity reference string re even in the presence of sparse query log data, while another function takes into account the classes of se and re. The framework also provides indexing mechanisms that expedite its computations. The framework also provides a reduction module for converting long entity reference strings into shorter strings, where each shorter string (if found) contains a subset of the terms in its longer counterpart.
Abstract:
A high-voltage MOS transistor includes a gate overlying an active area of a semiconductor substrate; a drain doping region pulled back away from an edge of the gate by a distance L; a first lightly doped region between the gate and the drain doping region; a source doping region in a first ion well; and a second lightly doped region between the gate and the source doping region.
Abstract:
An integrated circuit chip includes a semiconductor substrate having thereon a plurality of IMD layers and first conductive layers embedded in the IMD layers; a first insulating layer overlying the IMD layers and the first conductive layers; a plurality of first power/ground mesh wiring lines, in a second conductive layer overlying the first insulating layer, for distributing power signal or ground signal; and a second insulating layer covering the second conductive layer and the first insulating layer.
Abstract:
The expansion of a population of stem cells or progenitor cells, or precursors thereof, may be accomplished by disrupting or inhibiting p21cip1/waf1 and/or p27, cyclin dependent kinase inhibitors. In the absence of p27 activity, progenitor cells move into the cell cycle and proliferate; whereas in the absence of p21 activity, stem cells move into the cell cycle and proliferate without losing their pluripotentiality (i.e., their ability to differentiate into the various cell lines found in the blood stream). Any type of stem cell or progenitor cell, or precursor thereof, including, but not limited to, hematopoietic, gastrointestinal, lung, neural, skin, muscle, cardiac muscle, renal, mesenchymal, embryonic, fetal, or liver cell may be used in accordance with the invention. The present invention provides a method of expanding a cell population, cells with decreased p27 and/or p21 activity, transgenic animals with a disrupted p27 and/or p21 gene, pharmaceutical compositions comprising the cells of the invention, and methods of using these cells in gene therapy (e.g., stem cell gene therapy) and bone marrow transplantation.