公开(公告)号：US20080124489A1

公开(公告)日：2008-05-29

申请号：US11944557

申请日：2007-11-23

申请人： Taro Yamamoto ,  Yasushi Takiguchi ,  Akihiro Fujimoto ,  Hideharu Kyouda ,  Junichi Kitano ,  Osamu Miyahara ,  Kenji Tsutsumi

发明人： Taro Yamamoto ,  Yasushi Takiguchi ,  Akihiro Fujimoto ,  Hideharu Kyouda ,  Junichi Kitano ,  Osamu Miyahara ,  Kenji Tsutsumi

IPC分类号： C23C14/28 ,  B05C11/00

CPC分类号： H01L21/6715 ,  H01L21/67178 ,  H01L21/67276

摘要： A coating film forming apparatus includes a process section including one or more coating units and one or more thermally processing units; a pre-coating cleaning unit configured to perform cleaning on a back surface and an edge portion of a substrate; and a pre-coating check unit configured to check a state of a back surface and an edge portion of the substrate. A control section is configured to realize a sequence of cleaning the substrate by the pre-coating cleaning unit, checking the substrate by the pre-coating check unit, making a judgment based on a check result thus obtained of whether or not a state of particles on a back surface and an edge portion of the substrate is within an acceptable range, and permitting transfer of the substrate into the process section where the state of particles is within the acceptable range.

摘要翻译： 涂膜形成装置包括具有一个或多个涂布单元和一个或多个热处理单元的处理部分; 构造成在基板的背面和边缘部分上进行清洗的预涂层清洁单元; 以及配置为检查基板的背面和边缘部分的状态的预涂层检查单元。 控制部被配置为通过预涂清洁单元实现清洁基板的顺序，通过预涂单元检查基板，基于由此获得的检查结果判断颗粒的状态 在基板的后表面和边缘部分处于可接受的范围内，并且允许将基板转移到颗粒状态在可接受范围内的处理部分中。

公开(公告)号：US07959988B2

公开(公告)日：2011-06-14

申请号：US11944557

申请日：2007-11-23

申请人： Taro Yamamoto ,  Yasushi Takiguchi ,  Akihiro Fujimoto ,  Hideharu Kyouda ,  Junichi Kitano ,  Osamu Miyahara ,  Kenji Tsutsumi

发明人： Taro Yamamoto ,  Yasushi Takiguchi ,  Akihiro Fujimoto ,  Hideharu Kyouda ,  Junichi Kitano ,  Osamu Miyahara ,  Kenji Tsutsumi

IPC分类号： C23C14/28

CPC分类号： H01L21/6715 ,  H01L21/67178 ,  H01L21/67276

摘要： A coating film forming apparatus includes a process section including one or more coating units and one or more thermally processing units; a pre-coating cleaning unit configured to perform cleaning on a back surface and an edge portion of a substrate; and a pre-coating check unit configured to check a state of a back surface and an edge portion of the substrate. A control section is configured to realize a sequence of cleaning the substrate by the pre-coating cleaning unit, checking the substrate by the pre-coating check unit, making a judgment based on a check result thus obtained of whether or not a state of particles on a back surface and an edge portion of the substrate is within an acceptable range, and permitting transfer of the substrate into the process section where the state of particles is within the acceptable range.

摘要翻译： 涂膜形成装置包括具有一个或多个涂布单元和一个或多个热处理单元的处理部分; 构造成在基板的背面和边缘部分上进行清洗的预涂层清洁单元; 以及配置为检查基板的背面和边缘部分的状态的预涂层检查单元。 控制部被配置为通过预涂清洁单元实现清洁基板的顺序，通过预涂单元检查基板，基于由此获得的检查结果判断颗粒的状态 在基板的后表面和边缘部分处于可接受的范围内，并且允许将基板转移到颗粒状态在可接受范围内的处理部分中。

公开(公告)号：US08366872B2

公开(公告)日：2013-02-05

申请号：US13161185

申请日：2011-06-15

申请人： Kenji Tsutsumi ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

发明人： Kenji Tsutsumi ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

IPC分类号： C23F1/02

CPC分类号： C23C26/00 ,  G03F1/80 ,  G03F7/707 ,  G03F7/70916 ,  H01L21/308 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68707

摘要： According to the present invention, during the photolithography processing of a substrate, exposure processing is performed immediately after removal of a coating film on the rear surface of the substrate, and a coating film is formed on the rear surface of the substrate immediately after the exposure processing. Thereafter, etching treatment and so on are performed, and a series of these treatment and processing steps are performed a predetermined number of times. The coating film has been formed on the rear surface of the substrate at the time for the etching treatment, so that even if the coating film gets minute scratches, the rear surface of the substrate itself is protected by the coating film and thus never scratched. Further, since the coating film on the rear surface of the substrate is removed immediately before the exposure processing, the rear surface of the substrate can be flat for the exposure processing.

摘要翻译： 根据本发明，在基板的光刻处理中，在除去基板背面的涂膜后立即进行曝光处理，在曝光后立即在基板的背面形成涂膜 处理。 此后，进行蚀刻处理等，并且进行一系列这些处理和处理步骤预定次数。 在蚀刻处理时，已经在基板的背面形成了涂膜，使得即使涂膜受到微小的划痕，基板本身的后表面也被涂膜保护，因此不会被刮伤。 此外，由于在曝光处理之前立即除去基板后表面上的涂膜，所以基板的后表面可以是平坦的，用于曝光处理。

公开(公告)号：US08703400B2

公开(公告)日：2014-04-22

申请号：US13041935

申请日：2011-03-07

申请人： Kenji Tsutsumi ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

发明人： Kenji Tsutsumi ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

IPC分类号： G03F7/26

CPC分类号： H01L21/67225 ,  H01L21/67051 ,  H01L21/6715 ,  Y10S414/136 ,  Y10S414/141

摘要： In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.

摘要翻译： 在涂布处理装置中，在第一处理室中，由转印臂保持的基板的前表面和后表面通过转动机构反转，并且涂布溶液从涂布喷嘴施加到基板的后表面。 将基板转移到第二处理室中，其中通过加热单元将后表面上的涂布溶液加热固化，从而在基板的后表面上形成涂膜。 在曝光处理之前，通过涂布处理装置形成涂膜，由此基板的后表面可以平坦地进行曝光处理。

公开(公告)号：US08083959B2

公开(公告)日：2011-12-27

申请号：US11958839

申请日：2007-12-18

申请人： Hideharu Kyouda ,  Junichi Kitano ,  Osamu Miyahara ,  Kenji Tsutsumi

发明人： Hideharu Kyouda ,  Junichi Kitano ,  Osamu Miyahara ,  Kenji Tsutsumi

IPC分类号： B44C1/22

CPC分类号： H01L21/31144 ,  H01L21/67207

摘要： In the present invention, a plurality of rounds of patterning are performed on a substrate. In a patterning system, the substrate on which a first round of patterning has been performed is transferred to a planarizing film forming unit, where a planarizing film is formed above the substrate. The substrate is then transferred to the patterning system and subjected to a second round of patterning. The time from the completion of the forming processing of the planarizing film to the start of the second round of patterning is managed to be constant among the substrates. According to the present invention, in the pattern forming processing of performing a plurality of rounds of patterning, a pattern with a desired dimension can be stably formed above the substrate.

摘要翻译： 在本发明中，在基板上进行多次图案化。 在图案形成系统中，已经进行了第一轮图案化的基板被转印到平坦化膜形成单元，其中在基板上形成平坦化膜。 然后将衬底转移到图案化系统并进行第二轮图案化。 从平面化膜的成形处理完成到第二轮图案化开始的时间被控制为在基板之间是恒定的。 根据本发明，在进行多次图案化的图案形成处理中，可以稳定地在基板上方形成具有期望尺寸的图案。

公开(公告)号：US20080176003A1

公开(公告)日：2008-07-24

申请号：US12016436

申请日：2008-01-18

申请人： Kenji TSUTSUMI ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

发明人： Kenji TSUTSUMI ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

IPC分类号： C08F2/46 ,  B05B5/00 ,  B05B7/24

CPC分类号： H01L21/67225 ,  H01L21/67051 ,  H01L21/6715 ,  Y10S414/136 ,  Y10S414/141

摘要： In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.

摘要翻译： 在涂布处理装置中，在第一处理室中，由转印臂保持的基板的前表面和后表面通过转动机构反转，并且涂布溶液从涂布喷嘴施加到基板的后表面。 将基板转移到第二处理室中，其中通过加热单元将后表面上的涂布溶液加热固化，从而在基板的后表面上形成涂膜。 在曝光处理之前，通过涂布处理装置形成涂膜，由此基板的后表面可以平坦地进行曝光处理。

公开(公告)号：US20120061021A1

公开(公告)日：2012-03-15

申请号：US13299457

申请日：2011-11-18

申请人： Hideharu Kyouda ,  Junichi Kitano ,  Osamu Miyahara ,  Kenji Tsutsumi

发明人： Hideharu Kyouda ,  Junichi Kitano ,  Osamu Miyahara ,  Kenji Tsutsumi

IPC分类号： C23F1/08

CPC分类号： H01L21/31144 ,  H01L21/67207

摘要： In the present invention, a plurality of rounds of patterning are performed on a substrate. In a patterning system, the substrate on which a first round of patterning has been performed is transferred to a planarizing film forming unit, where a planarizing film is formed above the substrate. The substrate is then transferred to the patterning system and subjected to a second round of patterning. The time from the completion of the forming processing of the planarizing film to the start of the second round of patterning is managed to be constant among the substrates. According to the present invention, in the pattern forming processing of performing a plurality of rounds of patterning, a pattern with a desired dimension can be stably formed above the substrate.

摘要翻译： 在本发明中，在基板上进行多次图案化。 在图案形成系统中，已经进行了第一轮图案化的基板被转印到平坦化膜形成单元，其中在基板上形成平坦化膜。 然后将衬底转移到图案化系统并进行第二轮图案化。 从平面化膜的成形处理完成到第二轮图案化开始的时间被控制为在基板之间是恒定的。 根据本发明，在进行多次图案化的图案形成处理中，可以稳定地在基板上方形成具有期望尺寸的图案。

公开(公告)号：US20110240597A1

公开(公告)日：2011-10-06

申请号：US13161185

申请日：2011-06-15

申请人： Kenji TSUTSUMI ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

发明人： Kenji TSUTSUMI ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

IPC分类号： C23F1/02

CPC分类号： C23C26/00 ,  G03F1/80 ,  G03F7/707 ,  G03F7/70916 ,  H01L21/308 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68707

摘要： According to the present invention, during the photolithography processing of a substrate, exposure processing is performed immediately after removal of a coating film on the rear surface of the substrate, and a coating film is formed on the rear surface of the substrate immediately after the exposure processing. Thereafter, etching treatment and so on are performed, and a series of these treatment and processing steps are performed a predetermined number of times. The coating film has been formed on the rear surface of the substrate at the time for the etching treatment, so that even if the coating film gets minute scratches, the rear surface of the substrate itself is protected by the coating film and thus never scratched. Further, since the coating film on the rear surface of the substrate is removed immediately before the exposure processing, the rear surface of the substrate can be flat for the exposure processing.

摘要翻译： 根据本发明，在基板的光刻处理中，在除去基板背面的涂膜后立即进行曝光处理，在曝光后立即在基板的背面形成涂膜 处理。 此后，进行蚀刻处理等，并且进行一系列这些处理和处理步骤预定次数。 在蚀刻处理时，已经在基板的背面形成了涂膜，使得即使涂膜受到微小的划痕，基板本身的后表面也被涂膜保护，因此不会被刮伤。 此外，由于在曝光处理之前立即除去基板后表面上的涂膜，所以基板的后表面可以是平坦的，用于曝光处理。

公开(公告)号：US07926441B2

公开(公告)日：2011-04-19

申请号：US12016436

申请日：2008-01-18

申请人： Kenji Tsutsumi ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

发明人： Kenji Tsutsumi ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

IPC分类号： B05C15/00

CPC分类号： H01L21/67225 ,  H01L21/67051 ,  H01L21/6715 ,  Y10S414/136 ,  Y10S414/141

摘要： In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.

摘要翻译： 在涂布处理装置中，在第一处理室中，由转印臂保持的基板的前表面和后表面通过转动机构反转，并且涂布溶液从涂布喷嘴施加到基板的后表面。 将基板转移到第二处理室中，其中背面上的涂布溶液通过加热单元加热固化，从而在基板的后表面上形成涂膜。 在曝光处理之前，通过涂布处理装置形成涂膜，由此基板的后表面可以平坦地进行曝光处理。

公开(公告)号：US20080176002A1

公开(公告)日：2008-07-24

申请号：US12015029

申请日：2008-01-16

申请人： Kenji TSUTSUMI ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

发明人： Kenji TSUTSUMI ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

IPC分类号： C23C26/00 ,  H01L21/306

CPC分类号： C23C26/00 ,  G03F1/80 ,  G03F7/707 ,  G03F7/70916 ,  H01L21/308 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68707

摘要： According to the present invention, during the photolithography processing of a substrate, exposure processing is performed immediately after removal of a coating film on the rear surface of the substrate, and a coating film is formed on the rear surface of the substrate immediately after the exposure processing. Thereafter, etching treatment and so on are performed, and a series of these treatment and processing steps are performed a predetermined number of times. The coating film has been formed on the rear surface of the substrate at the time for the etching treatment, so that even if the coating film gets minute scratches, the rear surface of the substrate itself is protected by the coating film and thus never scratched. Further, since the coating film on the rear surface of the substrate is removed immediately before the exposure processing, the rear surface of the substrate can be flat for the exposure processing.

摘要翻译： 根据本发明，在基板的光刻处理中，在除去基板背面的涂膜后立即进行曝光处理，在曝光后立即在基板的背面形成涂膜 处理。 此后，进行蚀刻处理等，并且进行一系列这些处理和处理步骤预定次数。 在蚀刻处理时，已经在基板的背面形成了涂膜，使得即使涂膜受到微小的划痕，基板本身的后表面也被涂膜保护，因此不会被刮伤。 此外，由于在曝光处理之前立即除去基板后表面上的涂膜，所以基板的后表面可以是平坦的，用于曝光处理。