摘要:
A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool presses the TCP to compression-bond the outer leads to the electrodes of the array substrate, and a waiting position wherein the distal end portion is spaced apart from the TCP. A pressing mechanism having a pressing member is mounted on the support block and movable in interlock with the movement of the heater tool. The pressing member presses the TCP to press the outer leads against the array substrate when the heater tool moves from the waiting position toward the compression bonding position.
摘要:
A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool presses the TCP to compression-bond the outer leads to the electrodes of the array substrate, and a waiting position wherein the distal end portion is spaced apart from the TCP. A pressing mechanism having a pressing member is mounted on the support block and movable in interlock with the movement of the heater tool. The pressing member presses the TCP to press the outer leads against the array substrate when the heater tool moves from the waiting position toward the compression bonding position.
摘要:
The present invention provides a manufacturing method of a flat-panel display unit and a carrier therefor which make it unnecessary to implement alignment in each step, except for alignment which require higher precision, by performing the alignment in advance in the pre-stage of a series of steps. The present invention also provides a manufacturing method of a flat-panel display unit which allows alignment with accuracy of about 50 to 100 .mu.m to be performed simply, reliably and quickly. According to the inventive manufacturing method, a display panel is mounted non-shiftably on the carrier and while being mounted thereon, is then carried between processing machines and is processed by the processing machines. In mounting the display panel on the carrier, it is aligned with the carrier in advance by visually aligning alignment marks thereof. In processing it by the processing machine, the carrier and the processing machine are put into a predetermined state in which they are aligned and thereby, the display panel is put into a state in which it is aligned with the processing machine.
摘要:
A method of manufacturing a flat-panel display device including a series of steps for pasting a light-control tape onto a display panel proper, the series of steps for pasting comprising: a step of determining a start position for pasting; a step of taking out the start end of the light-control tape by drawing to peel a release sheet covering a downward-facing adhesive face of the light-control tape; a step of positioning the start end of the light-control tape to the start position; a step of pressing the start end of the light-control tape onto the start position by a rotatable press roller; a step of continuously pasting the light-control tape onto the display panel proper by moving the display panel proper; a step of cutting the light-control tape when pasted by a predetermined length; and a step of completing of pasting a cut piece of the light-control tape.
摘要:
A tape carrier package is stacked on an array substrate while interposing a thermosetting type anisotropic conductive adhesive between a plurality of first conductors formed on the end portion of the array substrate and a plurality of second conductors formed on the tape carrier package. Subsequently, a heater tool of a thermocompression bonding apparatus applies pressure and heat to the anisotropic conductive adhesive via the tape carrier package. In this case, the anisotropic conductive adhesive is slowly heated up to its hardening end temperature to harden after it softens, thereby thermocompression bonding the first and second conductors to each other by the anisotropic conductive adhesive.
摘要:
There is provided a liquid crystal display device in which the area of a peripheral portion of the glass substrate can be reduced and which can be packaged easily. Three X-side IC chips 22 are directly mounted to a peripheral portion 18 of a glass substrate 14 that constitutes a display portion 16 of a liquid crystal display device 10. Pads 27 for the X-side IC chips 22 are disposed between the X-side IC chips 22. A branch region 32 projecting from a main region 30 of a flexible substrate 28 is disposed between the X-side chips 22. Terminals 38 provided in the branch region 32 are electrically connected to the pads 27.
摘要:
A tape carrier package is stacked on an array substrate while interposing a thermosetting type anisotropic conductive adhesive between a plurality of first conductors formed on the end portion of the array substrate and a plurality of second conductors formed on the tape carrier package. Subsequently, a heater tool of a thermocompression bonding apparatus applies pressure and heat to the anisotropic conductive adhesive via the tape carrier package. In this case, the anisotropic conductive adhesive is slowly heated up to its hardening end temperature to harden after it softens, thereby thermocompression bonding the first and second conductors to each other by the anisotropic conductive adhesive.