公开(公告)号：US5557508A

公开(公告)日：1996-09-17

申请号：US160186

申请日：1993-12-02

申请人： Teruhiro Sato ,  Tomio Wada ,  Yoshiyuki Hirayama

发明人： Teruhiro Sato ,  Tomio Wada ,  Yoshiyuki Hirayama

IPC分类号： H05K5/04 ,  H05K3/34 ,  H05K9/00

CPC分类号： H05K9/0049 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/10371 ,  H05K2201/10871 ,  H05K2201/10924 ,  Y10S174/34 ,  Y10T29/49128

摘要： Single flat metal sheet blank in which thin metallic parts including side frames which are to form side walls, a shield plate and external lead and the like are connected together in a developed state in positional relationships necessary for the assembly of the high-density circuit module. A circuit board is then placed on one side of the shield plate of the flat metal sheet blank. Terminals having pedestals are formed on the shield plate. The terminals are inserted into holes formed in the circuit board and connected to conductors on the circuit board. Then, operations such as severance or bending are effected on selected connecting portions at which the thin metallic parts arranged in developed state are inter-connected, and required processings are executed on the portions to be jointed, whereby the circuit module is completed. According to this production method, a space for receiving circuit components is formed between the circuit board and the shield plate, so that both sides of the circuit board can be used for mounting the circuit components, whereby a high packaging density is attained.

摘要翻译： 单层扁平金属板坯料，其中包括形成侧壁的侧框架的薄金属部件，屏蔽板和外部引线等在显影状态下以高密度电路模块组装所需的位置关系连接在一起 。 然后将电路板放置在平板金属板坯的屏蔽板的一侧上。 具有基座的端子形成在屏蔽板上。 将端子插入形成在电路板中的孔中并连接到电路板上的导体。 然后，在选择的连接部分进行诸如切断或弯曲的操作，其中布置成展开状态的薄金属部件相互连接，并且在待连接部分上执行所需的处理，从而完成电路模块。 根据该制造方法，在电路基板和屏蔽板之间形成有用于接收电路部件的空间，从而电路板的两侧可用于安装电路部件，从而获得高的封装密度。

公开(公告)号：US5162971A

公开(公告)日：1992-11-10

申请号：US495425

申请日：1990-03-19

申请人： Teruhiro Sato ,  Tomio Wada ,  Mikio Kobayashi

发明人： Teruhiro Sato ,  Tomio Wada ,  Mikio Kobayashi

IPC分类号： H01L25/16 ,  H05K1/02 ,  H05K1/05 ,  H05K3/34 ,  H05K5/00

CPC分类号： H01L25/165 ,  H05K3/3405 ,  H05K5/0091 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/05 ,  H05K2201/1034 ,  H05K2201/10371 ,  H05K2201/10924 ,  H05K3/3447

摘要： A high-density circuit module has a box shaped shielding case made from a plate blank which is bent to provide the shield case. A printed wiring board is placed on the bottom surface portion of the shielding case, and a plurality of electronic components are soldered to conductor lands of the printed wiring board. A plurality of externally connected leads are soldered to connection lands of the printed wiring board. A process for producing the high-density circuit module includes the steps of placing the printed wiring board on the blank, then soldering the electronic components and leads to the printed wiring board and then bending the blank to provide the shielding case. The plurality of externally connected leads are formed from a plurality of leads which are originally integrally connected to the bottom surface portion of the shielding case, by separating the plurality of leads form the bottom surface portion of the shielding case. A high-density circuit module having a small number of parts and a simple structure is easily manufactured.

摘要翻译： 高密度电路模块具有由板坯制成的箱形屏蔽壳体，其被弯曲以提供屏蔽壳体。 印刷线路板被放置在屏蔽壳体的底面部分上，并且多个电子部件被焊接到印刷电路板的导体焊盘。 多个外部连接的引线焊接到印刷电路板的连接焊盘。 制造高密度电路模块的方法包括以下步骤：将印刷线路板放置在坯料上，然后将电子元件焊接到印刷线路板上，然后弯曲坯料以提供屏蔽壳。 多个外部连接的引线由原来一体地连接到屏蔽壳体的底面部分的多个引线形成，通过将多根引线分离成屏蔽壳体的底面部分。 容易制造具有少量部件和简单结构的高密度电路模块。

公开(公告)号：US5198794A

公开(公告)日：1993-03-30

申请号：US672935

申请日：1991-03-21

申请人： Teruhiro Sato ,  Tomio Wada

发明人： Teruhiro Sato ,  Tomio Wada

IPC分类号： H01C1/14 ,  H01C17/24

CPC分类号： H01C17/24 ,  H01C1/14

摘要： A trimmed resistor is provided which has no directional feature when used and is easily mounted on a printed base board. In the trimmed resistor, there are formed four external electrodes arranged at peripheral portions of a rectangular insulation base plate in a point symmetrical distribution about a center of the insulation base plate, a film-like resistance body connected with all of the external electrodes, and a protective film covering the film-like resistance body. Two electrodes among the above-mentioned four electrodes are used as resistor terminals, and a cut slit for trimming is formed in the resistance body longitudinally or as starting from a side of the electrodes serving as resistor terminals.

摘要翻译： 提供了一种修整的电阻器，在使用时没有方向特性，并且易于安装在印刷的基板上。 在微调电阻器中，形成四个外部电极，以围绕绝缘基板的中心的点对称分布形成矩形绝缘基板的周边部分，与所有外部电极连接的膜状电阻体，以及 覆盖膜状电阻体的保护膜。 上述四个电极中的两个电极用作电阻器端子，并且用于修整的切割狭缝纵向地形成在电阻体中，或者从用作电阻端子的电极的一侧开始形成。