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    MEMS devices having overlying support structures and methods of fabricating the same
    6.
    发明申请
    MEMS devices having overlying support structures and methods of fabricating the same 有权
    具有上覆支撑结构的MEMS器件及其制造方法

    公开(公告)号：US20070019280A1

    公开(公告)日：2007-01-25

    申请号：US11490880

    申请日：2006-07-21

    申请人： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    发明人： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    IPC分类号： G02F1/29 ,  G02B6/00

    CPC分类号： G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

    摘要： Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

    摘要翻译： MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中，用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线，保护电引线免受损坏或其他干扰。

    MEMS devices having overlying support structures
    7.
    发明授权
    MEMS devices having overlying support structures 有权
    具有上覆支撑结构的MEMS器件

    公开(公告)号：US08120125B2

    公开(公告)日：2012-02-21

    申请号：US13012538

    申请日：2011-01-24

    申请人： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark W. Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    发明人： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark W. Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    IPC分类号： H01L29/82

    CPC分类号： G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

    摘要： Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

    摘要翻译： MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中，用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线，保护电引线免受损坏或其他干扰。

    Electromechanical devices having overlying support structures
    10.
    发明授权
    Electromechanical devices having overlying support structures 有权
    具有上覆支撑结构的机电装置

    公开(公告)号：US07566940B2

    公开(公告)日：2009-07-28

    申请号：US11490880

    申请日：2006-07-21

    申请人： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark W. Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    发明人： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark W. Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    IPC分类号： H01L29/82

    CPC分类号： G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

    摘要： Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

    摘要翻译： MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中，用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线，保护电引线免受损坏或其他干扰。