公开(公告)号：US20120031764A1

公开(公告)日：2012-02-09

申请号：US13202050

申请日：2010-02-17

申请人： Tetsuya Osaka ,  Yutaka Okinaka ,  Kazutaka Senda ,  Ryota Iwai ,  Masaru Kato

发明人： Tetsuya Osaka ,  Yutaka Okinaka ,  Kazutaka Senda ,  Ryota Iwai ,  Masaru Kato

IPC分类号： C25D3/48 ,  C25D7/00

CPC分类号： C25D3/62

摘要： Disclosed is a microcrystalline-to-amorphous gold alloy-plated film having excellent electrical properties and excellent mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and the advantageous properties of an amorphous structure can be obtained by allowing a microcrystalline phase and an amorphous phase to exist in a mixed state at a specific ratio. The average particle diameter of the microcrystals is 30 nm or smaller, the volume fraction of the microcrystals is 10 to 90%, the knoop hardness is Hk 180 or more, the specific resistivity is 200 μΩ-cm or less. In the film, hardness and abrasion resistance can be improved while maintaining a good specific resistivity value and chemical stability both inherent to gold at practically insignificant levels. Therefore, the film is useful as a material for connecting an electric or electronic component such as a connector and a relay.

摘要翻译： 公开了具有优异的电性能和优异的机械性能的微晶 - 非晶金合金镀膜。 可以通过使微晶相和非晶相以特定比例以混合状态存在来获得包括晶体结构的有利性质和非晶结构的有利特性的物理性质。 微晶的平均粒径为30nm以下，微晶的体积分数为10〜90％，Knoop硬度为Hk 180以上，电阻率为200μΩ·cm-cm以下。 在膜中，可以提高硬度和耐磨性，同时保持金属固有的良好的电阻率值和化学稳定性，几乎不起作用。 因此，该膜作为用于连接诸如连接器和继电器的电气或电子部件的材料是有用的。

公开(公告)号：US20070095440A1

公开(公告)日：2007-05-03

申请号：US11529537

申请日：2006-09-29

申请人： Kazutaka Senda ,  Masaru Kato ,  Tetsuya Osaka ,  Yutaka Okinaka

发明人： Kazutaka Senda ,  Masaru Kato ,  Tetsuya Osaka ,  Yutaka Okinaka

IPC分类号： C22C45/00 ,  C22C5/02

CPC分类号： C22C5/02 ,  B32B15/018 ,  C22C9/00 ,  C22C45/003 ,  C22C45/02 ,  C25D3/562 ,  C25D3/62 ,  C25D7/00 ,  H01H1/023 ,  H01R13/03 ,  H05K3/244

摘要： A gold-cobalt based amorphous alloy plated film consisting of a homogeneous amorphous phase not having microcrystals is formed by electroplating conducted by use of an electroplating bath containing a gold cyanide salt in a concentration of 0.01 to 0.1 mol/dm3 in terms of gold, a cobalt salt in a concentration of 0.02 to 0.2 mol/dm3 in terms of cobalt, and a tungstate in a concentration of 0.1 to 0.5 mol/dm3 in terms of tungsten. The gold-cobalt based amorphous alloy plated film obtained consists of a homogeneous amorphous phase not having microcrystals, and has an enhanced hardness while retaining the good contact resistance and chemical stability intrinsic of gold on such levels as to be free of problems on a practical use basis; therefore, the gold-cobalt based amorphous alloy plated film is effective for use as a contact material in electric and electronic component parts such as relays.

摘要翻译： 通过使用含有浓度为0.01〜0.1mol / dm 3的金氰化物盐的电镀浴进行电镀，形成由不具有微晶的均匀非晶相组成的金钴系非晶合金镀膜， SUP>以金为基准，钴浓度为0.02〜0.2mol / dm 3的钴盐，钴浓度为0.1〜0.5mol / dm 3的钨酸盐 以钨为主。 获得的金 - 钴基非晶态合金镀膜由不具有微晶的均匀非晶相组成，并且具有增强的硬度，同时保持金的良好接触电阻和化学稳定性，使得在实际使用中没有问题 基础; 因此，金钴系非晶合金镀膜可以有效地用作电气和电子部件如继电器中的接触材料。

公开(公告)号：US07591911B2

公开(公告)日：2009-09-22

申请号：US11529537

申请日：2006-09-29

申请人： Kazutaka Senda ,  Masaru Kato ,  Tetsuya Osaka ,  Yutaka Okinaka

发明人： Kazutaka Senda ,  Masaru Kato ,  Tetsuya Osaka ,  Yutaka Okinaka

IPC分类号： C22C45/00

CPC分类号： C22C5/02 ,  B32B15/018 ,  C22C9/00 ,  C22C45/003 ,  C22C45/02 ,  C25D3/562 ,  C25D3/62 ,  C25D7/00 ,  H01H1/023 ,  H01R13/03 ,  H05K3/244

摘要： A gold-cobalt based amorphous alloy plated film consisting of a homogeneous amorphous phase not having microcrystals is formed by electroplating conducted by use of an electroplating bath containing a gold cyanide salt in a concentration of 0.01 to 0.1 mol/dm3 in terms of gold, a cobalt salt in a concentration of 0.02 to 0.2 mol/dm3 in terms of cobalt, and a tungstate in a concentration of 0.1 to 0.5 mol/dm3 in terms of tungsten. The gold-cobalt based amorphous alloy plated film obtained consists of a homogeneous amorphous phase not having microcrystals, and has an enhanced hardness while retaining the good contact resistance and chemical stability intrinsic of gold on such levels as to be free of problems on a practical use basis; therefore, the gold-cobalt based amorphous alloy plated film is effective for use as a contact material in electric and electronic component parts such as relays.

摘要翻译： 由不含微晶的均匀非晶相构成的金钴系非晶合金镀膜通过使用含有浓度为0.01〜0.1mol / dm 3的金氰化物金的电镀浴进行电镀而形成，以金为单位， 钴盐，以钴计，浓度为0.02〜0.2mol / dm 3，钨浓度为0.1〜0.5mol / dm 3的钨酸盐。 获得的金 - 钴基非晶态合金镀膜由不具有微晶的均匀非晶相组成，并且具有增强的硬度，同时保持金的良好接触电阻和化学稳定性，使得在实际使用中没有问题 基础; 因此，金钴系非晶合金镀膜可以有效地用作电气和电子部件如继电器中的接触材料。

公开(公告)号：US07011697B2

公开(公告)日：2006-03-14

申请号：US10969604

申请日：2004-10-20

申请人： Masaru Kato ,  Kazutaka Senda

发明人： Masaru Kato ,  Kazutaka Senda

IPC分类号： C23C18/40

CPC分类号： C23C18/44

摘要： An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one deposition accelerator selected from the group consisting of a copper compound, a thallium compound, and a lead compound.

摘要翻译： 提供一种无电镀金液，其包括氰化物化合物和抗坏血酸或其衍生物，所述无电镀金液含有选自铜化合物，铊化合物和铅的一种或多种沉积促进剂 复合。

公开(公告)号：US20050098061A1

公开(公告)日：2005-05-12

申请号：US10969604

申请日：2004-10-20

申请人： Masaru Kato ,  Kazutaka Senda

发明人： Masaru Kato ,  Kazutaka Senda

IPC分类号： C23C16/00 ,  C23C18/44

CPC分类号： C23C18/44

摘要： An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one deposition accelerator selected from the group consisting of a copper compound, a thallium compound, and a lead compound.

摘要翻译： 提供一种无电镀金液，其包括氰化物化合物和抗坏血酸或其衍生物，所述无电镀金液含有选自铜化合物，铊化合物和铅的一种或多种沉积促进剂 复合。