公开(公告)号：US20120031764A1

公开(公告)日：2012-02-09

申请号：US13202050

申请日：2010-02-17

申请人： Tetsuya Osaka ,  Yutaka Okinaka ,  Kazutaka Senda ,  Ryota Iwai ,  Masaru Kato

发明人： Tetsuya Osaka ,  Yutaka Okinaka ,  Kazutaka Senda ,  Ryota Iwai ,  Masaru Kato

IPC分类号： C25D3/48 ,  C25D7/00

CPC分类号： C25D3/62

摘要： Disclosed is a microcrystalline-to-amorphous gold alloy-plated film having excellent electrical properties and excellent mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and the advantageous properties of an amorphous structure can be obtained by allowing a microcrystalline phase and an amorphous phase to exist in a mixed state at a specific ratio. The average particle diameter of the microcrystals is 30 nm or smaller, the volume fraction of the microcrystals is 10 to 90%, the knoop hardness is Hk 180 or more, the specific resistivity is 200 μΩ-cm or less. In the film, hardness and abrasion resistance can be improved while maintaining a good specific resistivity value and chemical stability both inherent to gold at practically insignificant levels. Therefore, the film is useful as a material for connecting an electric or electronic component such as a connector and a relay.

摘要翻译： 公开了具有优异的电性能和优异的机械性能的微晶 - 非晶金合金镀膜。 可以通过使微晶相和非晶相以特定比例以混合状态存在来获得包括晶体结构的有利性质和非晶结构的有利特性的物理性质。 微晶的平均粒径为30nm以下，微晶的体积分数为10〜90％，Knoop硬度为Hk 180以上，电阻率为200μΩ·cm-cm以下。 在膜中，可以提高硬度和耐磨性，同时保持金属固有的良好的电阻率值和化学稳定性，几乎不起作用。 因此，该膜作为用于连接诸如连接器和继电器的电气或电子部件的材料是有用的。

公开(公告)号：US20070095440A1

公开(公告)日：2007-05-03

申请号：US11529537

申请日：2006-09-29

申请人： Kazutaka Senda ,  Masaru Kato ,  Tetsuya Osaka ,  Yutaka Okinaka

发明人： Kazutaka Senda ,  Masaru Kato ,  Tetsuya Osaka ,  Yutaka Okinaka

IPC分类号： C22C45/00 ,  C22C5/02

CPC分类号： C22C5/02 ,  B32B15/018 ,  C22C9/00 ,  C22C45/003 ,  C22C45/02 ,  C25D3/562 ,  C25D3/62 ,  C25D7/00 ,  H01H1/023 ,  H01R13/03 ,  H05K3/244

摘要： A gold-cobalt based amorphous alloy plated film consisting of a homogeneous amorphous phase not having microcrystals is formed by electroplating conducted by use of an electroplating bath containing a gold cyanide salt in a concentration of 0.01 to 0.1 mol/dm3 in terms of gold, a cobalt salt in a concentration of 0.02 to 0.2 mol/dm3 in terms of cobalt, and a tungstate in a concentration of 0.1 to 0.5 mol/dm3 in terms of tungsten. The gold-cobalt based amorphous alloy plated film obtained consists of a homogeneous amorphous phase not having microcrystals, and has an enhanced hardness while retaining the good contact resistance and chemical stability intrinsic of gold on such levels as to be free of problems on a practical use basis; therefore, the gold-cobalt based amorphous alloy plated film is effective for use as a contact material in electric and electronic component parts such as relays.

摘要翻译： 通过使用含有浓度为0.01〜0.1mol / dm 3的金氰化物盐的电镀浴进行电镀，形成由不具有微晶的均匀非晶相组成的金钴系非晶合金镀膜， SUP>以金为基准，钴浓度为0.02〜0.2mol / dm 3的钴盐，钴浓度为0.1〜0.5mol / dm 3的钨酸盐 以钨为主。 获得的金 - 钴基非晶态合金镀膜由不具有微晶的均匀非晶相组成，并且具有增强的硬度，同时保持金的良好接触电阻和化学稳定性，使得在实际使用中没有问题 基础; 因此，金钴系非晶合金镀膜可以有效地用作电气和电子部件如继电器中的接触材料。

公开(公告)号：US07591911B2

公开(公告)日：2009-09-22

申请号：US11529537

申请日：2006-09-29

申请人： Kazutaka Senda ,  Masaru Kato ,  Tetsuya Osaka ,  Yutaka Okinaka

发明人： Kazutaka Senda ,  Masaru Kato ,  Tetsuya Osaka ,  Yutaka Okinaka

IPC分类号： C22C45/00

CPC分类号： C22C5/02 ,  B32B15/018 ,  C22C9/00 ,  C22C45/003 ,  C22C45/02 ,  C25D3/562 ,  C25D3/62 ,  C25D7/00 ,  H01H1/023 ,  H01R13/03 ,  H05K3/244

摘要： A gold-cobalt based amorphous alloy plated film consisting of a homogeneous amorphous phase not having microcrystals is formed by electroplating conducted by use of an electroplating bath containing a gold cyanide salt in a concentration of 0.01 to 0.1 mol/dm3 in terms of gold, a cobalt salt in a concentration of 0.02 to 0.2 mol/dm3 in terms of cobalt, and a tungstate in a concentration of 0.1 to 0.5 mol/dm3 in terms of tungsten. The gold-cobalt based amorphous alloy plated film obtained consists of a homogeneous amorphous phase not having microcrystals, and has an enhanced hardness while retaining the good contact resistance and chemical stability intrinsic of gold on such levels as to be free of problems on a practical use basis; therefore, the gold-cobalt based amorphous alloy plated film is effective for use as a contact material in electric and electronic component parts such as relays.

摘要翻译： 由不含微晶的均匀非晶相构成的金钴系非晶合金镀膜通过使用含有浓度为0.01〜0.1mol / dm 3的金氰化物金的电镀浴进行电镀而形成，以金为单位， 钴盐，以钴计，浓度为0.02〜0.2mol / dm 3，钨浓度为0.1〜0.5mol / dm 3的钨酸盐。 获得的金 - 钴基非晶态合金镀膜由不具有微晶的均匀非晶相组成，并且具有增强的硬度，同时保持金的良好接触电阻和化学稳定性，使得在实际使用中没有问题 基础; 因此，金钴系非晶合金镀膜可以有效地用作电气和电子部件如继电器中的接触材料。

公开(公告)号：US20050098061A1

公开(公告)日：2005-05-12

申请号：US10969604

申请日：2004-10-20

申请人： Masaru Kato ,  Kazutaka Senda

发明人： Masaru Kato ,  Kazutaka Senda

IPC分类号： C23C16/00 ,  C23C18/44

CPC分类号： C23C18/44

摘要： An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one deposition accelerator selected from the group consisting of a copper compound, a thallium compound, and a lead compound.

摘要翻译： 提供一种无电镀金液，其包括氰化物化合物和抗坏血酸或其衍生物，所述无电镀金液含有选自铜化合物，铊化合物和铅的一种或多种沉积促进剂 复合。

公开(公告)号：US07011697B2

公开(公告)日：2006-03-14

申请号：US10969604

申请日：2004-10-20

申请人： Masaru Kato ,  Kazutaka Senda

发明人： Masaru Kato ,  Kazutaka Senda

IPC分类号： C23C18/40

CPC分类号： C23C18/44

摘要： An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one deposition accelerator selected from the group consisting of a copper compound, a thallium compound, and a lead compound.

摘要翻译： 提供一种无电镀金液，其包括氰化物化合物和抗坏血酸或其衍生物，所述无电镀金液含有选自铜化合物，铊化合物和铅的一种或多种沉积促进剂 复合。

公开(公告)号：US09345145B2

公开(公告)日：2016-05-17

申请号：US13255392

申请日：2010-03-10

申请人： Ryota Iwai ,  Tomoaki Tokuhisa ,  Masaru Kato ,  Tokihiko Yokoshima ,  Masahiro Aoyagi ,  Yasuhiro Yamaji ,  Katsuya Kikuchi ,  Hiroshi Nakagawa

发明人： Ryota Iwai ,  Tomoaki Tokuhisa ,  Masaru Kato ,  Tokihiko Yokoshima ,  Masahiro Aoyagi ,  Yasuhiro Yamaji ,  Katsuya Kikuchi ,  Hiroshi Nakagawa

IPC分类号： H01L23/48 ,  H05K3/18 ,  C23C18/16 ,  C23C18/44 ,  C23C18/18

CPC分类号： H05K3/187 ,  C23C18/1605 ,  C23C18/1607 ,  C23C18/165 ,  C23C18/1834 ,  C23C18/1844 ,  C23C18/1851 ,  C23C18/44

摘要： An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100 μm or smaller, in terms of the width of the exposed substrate area, and having a height of 3 μm or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100 μm or finer is formed therefrom.

摘要翻译： 可以在短时间内填充形成在覆盖基板的抗蚀剂中形成的一个或多个开口的无电镀金液，所述开口宽度在数量级以上，特别是100μm以下 的暴露的基板区域，并且具有3μm或更大的高度。 无电镀金液含有用于在微细区域中沉积的沉积促进剂，由此形成100μm以上的微细图案。

公开(公告)号：US07022169B2

公开(公告)日：2006-04-04

申请号：US10732323

申请日：2003-12-10

申请人： Ryota Iwai ,  Tomoaki Tokuhisa ,  Masaru Kato

发明人： Ryota Iwai ,  Tomoaki Tokuhisa ,  Masaru Kato

IPC分类号： C23C18/42 ,  C23C18/44 ,  B05D1/18

CPC分类号： C23C18/42 ,  C23C18/44

摘要： An electroless gold plating solution is provided that contains no cyanide compound as a source of gold and that contains a decomposition inhibitor represented by general formula (1), provided that, in a case in which the solution contains a gold complex of sulfite and the decomposition inhibitor is cytosine, the pH 6.0 or less is excluded. In the formula, R1 to R4 denote hydrogen atom(s), alkyl group(s) having 1 to 10 carbon atom(s), which may have substituent(s), aryl group(s) having 6 to 10 carbon atoms, which may have substituent(s), alkoxy group(s) having 1 to 10 carbon atom(s), which may have substituent(s), amino group(s) (—NH2), hydroxyl group(s) (—OH), ═O, or halogen atom(s), R2 and R3 or R3 and R4 may crosslink with each other and form a saturated or unsaturated ring and the saturated or unsaturated ring may include oxygen, sulfur or nitrogen atom(s), each of the above-mentioned substituents may be a halogen atom or a cyano group, and may be a single bond or a double bond.

摘要翻译： 提供一种无电镀金液，其不含有氰化合物作为金源，并且含有通式（1）表示的分解抑制剂，条件是在溶液含有亚硫酸盐金分子和分解物的情况下 抑制剂是胞嘧啶，不包括pH6.0或更低。 在式中，R 1至R 4表示氢原子，可具有取代基的具有1至10个碳原子的烷基（一个或多个） s），可具有取代基的碳原子数6〜10的芳基，可以具有取代基的碳原子数1〜10的烷氧基，氨基（s） ）（-NH 2），羟基（-OH），-O或卤素原子，R 2和R 3， / SUB或R 3和R 4可以彼此交联并形成饱和或不饱和环，并且饱和或不饱和环可以包括氧，硫或氮原子（ s），上述取代基中的每一个可以是卤素原子或氰基，并且可以是单键或双键。

公开(公告)号：US06855191B2

公开(公告)日：2005-02-15

申请号：US10353460

申请日：2003-01-29

申请人： Masaru Kato ,  Ryota Iwai

发明人： Masaru Kato ,  Ryota Iwai

IPC分类号： C23C18/44 ,  H05K3/24 ,  C23C18/52 ,  B22F7/00

CPC分类号： C23C18/44 ,  H05K3/244

摘要： An electroless gold plating solution is provided in which an amount of gold deposited by a displacement reaction is at least 15 μg/cm2, and the electroless gold plating solution includes a reducing agent that is oxidized by gold, and a reducing agent that is of the same type as or is a different type from the above reducing agent and is oxidized by a substrate metal. The solution can form a uniform gold coating having good adhesion and low porosity in one step.

摘要翻译： 提供一种无电镀金液，其中通过置换反应沉积的金的量为至少15mug / cm 2，并且无电镀金液包括被金氧化的还原剂和还原剂， 与上述还原剂具有相同类型或不同的类型，并被基底金属氧化。 该溶液可以在一个步骤中形成具有良好粘附性和低孔隙率的均匀金涂层。

公开(公告)号：US20120119352A1

公开(公告)日：2012-05-17

申请号：US13255392

申请日：2010-03-10

申请人： Ryota Iwai ,  Tomoaki Tokuhisa ,  Masaru Kato ,  Tokihiro Yokoshima ,  Masahiro Aoyagi ,  Yasuhiro Yamaji ,  Katsuya Kikuchi ,  Hiroshi Nakagawa

发明人： Ryota Iwai ,  Tomoaki Tokuhisa ,  Masaru Kato ,  Tokihiro Yokoshima ,  Masahiro Aoyagi ,  Yasuhiro Yamaji ,  Katsuya Kikuchi ,  Hiroshi Nakagawa

IPC分类号： H01L23/48 ,  C09D1/00 ,  H01L21/768

CPC分类号： H05K3/187 ,  C23C18/1605 ,  C23C18/1607 ,  C23C18/165 ,  C23C18/1834 ,  C23C18/1844 ,  C23C18/1851 ,  C23C18/44

摘要： An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100 μm or smaller, in terms of the width of the exposed substrate area, and having a height of 3 μm or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100 μm or finer is formed therefrom.

摘要翻译： 可以在短时间内填充形成在覆盖基板的抗蚀剂中形成的一个或多个开口的无电镀金液，所述开口宽度在数量级以上，特别是100μm以下 的暴露的基板区域，并且具有3μm或更大的高度。 无电镀金液含有用于在微细区域中沉积的沉积促进剂，由此形成100μm以上的微细图案。

公开(公告)号：US08145266B2

公开(公告)日：2012-03-27

申请号：US10549304

申请日：2004-02-25

申请人： Tateo Toyama ,  Masaru Kato

发明人： Tateo Toyama ,  Masaru Kato

IPC分类号： H04M1/00

CPC分类号： H04N21/4126 ,  H04M1/72527 ,  H04N5/44 ,  H04N21/41407 ,  H04N21/4183 ,  H04N21/42607 ,  H04N21/439 ,  H04N21/44 ,  H04N21/6112 ,  H04N21/6125

摘要： A portable audio/video playback apparatus of the present invention comprises an apparatus main body 1 and a broadcast receiver unit 4 removably attached to the apparatus main body. The apparatus main body 1 includes interfaces 32, 33 for connecting thereto the broadcast receiver unit; an audio processing circuit 22 connected to one interface 32 for processing and feeding an external audio signal to a speaker 24; and a video processing circuit 27 connected to the other interface 33 for processing and feeding an external video signal to a display 13. The broadcast receiver unit 4 includes interfaces 55, 56 connected to the foregoing interfaces 32, 33 and decoders 47, 48 for feeding an audio signal and a video signal included in a received television broadcast signal to the interfaces 55, 56.

摘要翻译： 本发明的便携式音频/视频播放装置包括装置主体1和可拆卸地附接到装置主体的广播接收单元4。 设备主体1包括用于与广播接收机单元连接的接口32,33; 连接到一个接口32的音频处理电路22，用于处理和馈送外部音频信号到扬声器24; 和连接到另一个接口33的视频处理电路27，用于处理外部视频信号并将其馈送到显示器13.广播接收机单元4包括连接到前述接口32,33的接口55,56和用于馈送的解码器47,48 包括在接收的电视广播信号中的音频信号和视频信号到接口55,56。