公开(公告)号：US20140091326A1

公开(公告)日：2014-04-03

申请号：US13954533

申请日：2013-07-30

Applicant: Texas Instruments Incorporated

Inventor： Andy Quang Tran ,  Lance Wright

IPC: H01L27/14 ,  H01L21/82

CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

Abstract: A semiconductor proximity sensor (100) has a flat leadframe (110) with a first (110a) and a second (110b) surface, the second surface being solderable; the leadframe includes a first (111) and a second (112) pad, a plurality of leads (113, 114), and fingers (115, 118) framing the first pad, the fingers spaced from the first pad by a gap (116) which is filled with a clear molding compound. A light-emitting diode (LED) chip (120) is assembled on the first pad and encapsulated by a first volume (140) of the clear compound, the first volume outlined as a first lens (141). A sensor chip (130) is assembled on the second pad and encapsulated by a second volume (145) of the clear compound, the second volume outlined as a second lens (146). Opaque molding compound (150) fills the space between the first and second volumes of clear compound, forms shutters (151) for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. A layer (180) of solder is on the second leadframe surface of the pads, leads, and fingers.

Abstract translation: 半导体接近传感器（100）具有带有第一（110a）和第二（110b）表面的扁平引线框架（110），该第二表面是可焊接的; 所述引线框架包括第一焊盘（111）和第二焊盘（112），多个引线（113,114）和构成所述第一焊盘的指状物（115,118），所述指状物与所述第一焊盘间隔开间隙（116 ）填充有透明模塑料。 发光二极管（LED）芯片（120）组装在第一焊盘上并由清洁化合物的第一容积（140）封装，第一容积被概述为第一透镜（141）。 传感器芯片（130）组装在第二垫上并由清洁化合物的第二体积（145）封装，第二体积被概述为第二透镜（146）。 不透明模塑料（150）填充第一和第二体积的透明化合物之间的空间，形成用于第一透镜和第二透镜的快门（151），并且形成从手指框架上升的壁以产生用于LED的封闭空腔。 焊料层（180）位于焊盘，引线和手指的第二引线框表面上。

公开(公告)号：US09608158B2

公开(公告)日：2017-03-28

申请号：US15336566

申请日：2016-10-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Andy Quang Tran ,  Lance Wright

IPC: H01L23/495 ,  H01L27/14 ,  H01L21/82 ,  H01L31/16 ,  H01L31/0232 ,  H01L31/08 ,  H01L31/02 ,  H01L31/09 ,  H01L31/101

CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor.

公开(公告)号：US20170047469A1

公开(公告)日：2017-02-16

申请号：US15336566

申请日：2016-10-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Andy Quang Tran ,  Lance Wright

IPC: H01L31/16 ,  H01L31/08 ,  H01L31/02 ,  H01L31/0232

CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor.

Abstract translation: 制造半导体接近传感器的方法包括提供具有第一表面和第二表面的扁平引线框架。 第二个表面是可焊接的。 引线框架包括第一和第二焊盘，多个引线和构成第一焊盘的指状物。 指状物通过填充有透明模塑料的间隙与第一垫片隔开。 发光二极管（LED）芯片组装在第一焊盘上并由第一体积的透明化合物封装。 第一卷被列为第一个镜头。 传感器芯片组装在第二焊盘上并被第二体积的透明化合物封装。 第二卷被列为第二个镜头。 不透明的模塑料填充第一和第二体积的透明化合物之间的空间并且形成从手指框架上升的壁以产生用于LED的封闭空腔。 焊盘，引线和手指连接到板上，使用焊料层来附接接近传感器。

公开(公告)号：US20160043064A1

公开(公告)日：2016-02-11

申请号：US14922732

申请日：2015-10-26

Applicant: Texas Instruments Incorporated

Inventor： Andy Quang Tran ,  Lance Wright

IPC: H01L25/16 ,  H01L33/62 ,  H01L31/0232 ,  H01L31/16 ,  H01L33/58 ,  H01L31/18 ,  H01L33/54

CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor.

Abstract translation: 制造半导体接近传感器的方法包括提供具有第一表面和第二表面的扁平引线框架。 第二个表面是可焊接的。 引线框架包括第一和第二焊盘，多个引线和构成第一焊盘的指状物。 指状物通过填充有透明模塑料的间隙与第一垫片隔开。 发光二极管（LED）芯片组装在第一焊盘上并由第一体积的透明化合物封装。 第一卷被列为第一个镜头。 传感器芯片组装在第二焊盘上并被第二体积的透明化合物封装。 第二卷被列为第二个镜头。 不透明的模塑料填充第一和第二体积的透明化合物之间的空间并且形成从手指框架上升的壁以产生用于LED的封闭空腔。 焊盘，引线和手指连接到板上，使用焊料层来附接接近传感器。

公开(公告)号：US09171830B2

公开(公告)日：2015-10-27

申请号：US14627839

申请日：2015-02-20

Applicant: Texas Instruments Incorporated

Inventor： Andy Quang Tran ,  Lance Wright

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L25/16 ,  H01L27/14 ,  H01L21/82 ,  H01L31/0232 ,  H01L31/16 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound, forms shutters for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor.

Abstract translation: 制造半导体接近传感器的方法包括提供具有第一表面和第二表面的扁平引线框架。 第二个表面是可焊接的。 引线框架包括第一和第二焊盘，多个引线和构成第一焊盘的指状物。 指状物通过填充有透明模塑料的间隙与第一垫片隔开。 发光二极管（LED）芯片组装在第一焊盘上并被第一体积的透明化合物封装。 第一卷被列为第一个镜头。 传感器芯片组装在第二焊盘上并被第二体积的透明化合物封装。 第二卷被列为第二个镜头。 不透明模塑料填充第一和第二体积的透明化合物之间的空间，形成用于第一和第二透镜的百叶窗，并且形成从手指框架上升的壁以产生用于LED的封闭空腔。 焊盘，引线和手指连接到板上，使用焊料层来附接接近传感器。

公开(公告)号：US20130034937A1

公开(公告)日：2013-02-07

申请号：US13646199

申请日：2012-10-05

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Frank Yu ,  Lance Wright ,  Chien-Te Feng ,  Sandra Horton

IPC: H01L21/56

CPC classification number: H01L23/4951 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/30181 ,  H01L2224/30505 ,  H01L2224/30519 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/1305 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming an electronic assembly includes attaching a backside metal layer the bottomside of a semiconductor die. An area of the backside metal layer matches an area of the bottomside of the die. A die pad and leads are encapsulated within the molding material. The leads include an exposed portion that includes a bonding portion. A gap exposes the backside metal layer along a bottom surface of the package. Bond wires couple the pads on the topside of the die to the leads and the bonding portions. Packaged semiconductor device is soldered to a printed circuit board (PCB). The backside metal layer and the bonding portions of the leads are soldered substrate pads on said PCB.

Abstract translation: 形成电子组件的方法包括将半导体管芯的底部的背面金属层附着。 背面金属层的区域与模具的底部区域相匹配。 芯片焊盘和引线封装在模制材料内。 引线包括包括接合部分的暴露部分。 间隙沿着包装的底部表面暴露背面金属层。 接合线将管芯顶部的焊盘连接到引线和接合部分。 封装半导体器件焊接到印刷电路板（PCB）。 背面金属层和引线的接合部分是焊接在所述PCB上的衬底焊盘。

公开(公告)号：US09515059B2

公开(公告)日：2016-12-06

申请号：US14922732

申请日：2015-10-26

Applicant: Texas Instruments Incorporated

Inventor： Andy Quang Tran ,  Lance Wright

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L25/16 ,  H01L27/14 ,  H01L21/82 ,  H01L31/0232 ,  H01L31/16 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62 ,  H01L33/54

CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor.

Abstract translation: 制造半导体接近传感器的方法包括提供具有第一表面和第二表面的扁平引线框架。 第二个表面是可焊接的。 引线框架包括第一和第二焊盘，多个引线和构成第一焊盘的指状物。 指状物通过填充有透明模塑料的间隙与第一垫片隔开。 发光二极管（LED）芯片组装在第一焊盘上并由第一体积的透明化合物封装。 第一卷被列为第一个镜头。 传感器芯片组装在第二焊盘上并被第二体积的透明化合物封装。 第二卷被列为第二个镜头。 不透明的模塑料填充第一和第二体积的透明化合物之间的空间并且形成从手指框架上升的壁以产生用于LED的封闭空腔。 焊盘，引线和手指连接到板上，使用焊料层来附接接近传感器。

公开(公告)号：US20150162317A1

公开(公告)日：2015-06-11

申请号：US14627839

申请日：2015-02-20

Applicant: Texas Instruments Incorporated

Inventor： Andy Quang Tran ,  Lance Wright

IPC: H01L25/16 ,  H01L31/0232 ,  H01L33/62 ,  H01L33/58 ,  H01L31/16 ,  H01L31/18

CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound, forms shutters for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor.

Abstract translation: 制造半导体接近传感器的方法包括提供具有第一表面和第二表面的扁平引线框架。 第二个表面是可焊接的。 引线框架包括第一和第二焊盘，多个引线和构成第一焊盘的指状物。 指状物通过填充有透明模塑料的间隙与第一垫片隔开。 发光二极管（LED）芯片组装在第一焊盘上并由第一体积的透明化合物封装。 第一卷被列为第一个镜头。 传感器芯片组装在第二焊盘上并被第二体积的透明化合物封装。 第二卷被列为第二个镜头。 不透明模塑料填充第一和第二体积的透明化合物之间的空间，形成用于第一和第二透镜的百叶窗，并且形成从手指框架上升的壁以产生用于LED的封闭空腔。 焊盘，引线和手指连接到板上，使用焊料层来附接接近传感器。

公开(公告)号：US08994154B2

公开(公告)日：2015-03-31

申请号：US13954533

申请日：2013-07-30

Applicant: Texas Instruments Incorporated

Inventor： Andy Quang Tran ,  Lance Wright

IPC: H01L23/495 ,  H01L27/14 ,  H01L21/82

CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

Abstract: A semiconductor proximity sensor (100) has a flat leadframe (110) with a first (110a) and a second (110b) surface, the second surface being solderable; the leadframe includes a first (111) and a second (112) pad, a plurality of leads (113, 114), and fingers (115, 118) framing the first pad, the fingers spaced from the first pad by a gap (116) which is filled with a clear molding compound. A light-emitting diode (LED) chip (120) is assembled on the first pad and encapsulated by a first volume (140) of the clear compound, the first volume outlined as a first lens (141). A sensor chip (130) is assembled on the second pad and encapsulated by a second volume (145) of the clear compound, the second volume outlined as a second lens (146). Opaque molding compound (150) fills the space between the first and second volumes of clear compound, forms shutters (151) for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. A layer (180) of solder is on the second leadframe surface of the pads, leads, and fingers.

Abstract translation: 半导体接近传感器（100）具有带有第一（110a）和第二（110b）表面的扁平引线框架（110），该第二表面是可焊接的; 所述引线框架包括第一焊盘（111）和第二焊盘（112），多个引线（113,114）和构成所述第一焊盘的指状物（115,118），所述指状物与所述第一焊盘间隔开间隙（116 ）填充有透明模塑料。 发光二极管（LED）芯片（120）组装在第一焊盘上并由清洁化合物的第一容积（140）封装，第一容积被概述为第一透镜（141）。 传感器芯片（130）组装在第二垫上并由清洁化合物的第二体积（145）封装，第二体积被概述为第二透镜（146）。 不透明模塑料（150）填充第一和第二体积的透明化合物之间的空间，形成用于第一透镜和第二透镜的快门（151），并且形成从手指框架上升的壁以产生用于LED的封闭空腔。 焊料层（180）位于焊盘，引线和手指的第二引线框表面上。