公开(公告)号：US20160093548A1

公开(公告)日：2016-03-31

申请号：US14849026

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： BENJAMIN STASSEN COOK ,  JUAN ALEJANDRO HERBSOMMER ,  DJANGO TROMBLEY ,  STEVEN ALFRED KUMMERL ,  PAUL EMERSON

IPC: H01L23/31 ,  H01L21/288 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L23/3121 ,  H01L21/288 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/5227 ,  H01L24/09 ,  H01L2224/08268 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/146 ,  H05K1/092 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0179 ,  H05K2201/0999 ,  H05K2201/10151

Abstract: A method forming packaged semiconductor devices includes providing a completed semiconductor package having a die with bond pads coupled to package pins. Sensor precursors including an ink and a liquid carrier are additively printed directly on the die or package to provide precursors for electrodes and a sensing material between the sensor electrodes. Sintering or curing removes the liquid carrier such that an ink residue remains to provide the sensor electrodes and sensing material. The sensor electrodes electrically coupled to the pins or bond pads or the die includes a wireless coupling structure coupled to the bond pads and the method includes additively printing an ink then sintering or curing to form a complementary wireless coupling structure on the completed semiconductor package coupled to the sensor electrodes so that sensing signals sensed by the sensor are wirelessly transmitted to the bond pads after being received by the wireless coupling structure.

Abstract translation: 形成封装半导体器件的方法包括提供具有与封装引脚耦合的接合焊盘的芯片的完整半导体封装。 包括油墨和液体载体的传感器前体被直接加印在模具或包装上，以提供用于电极的前体和传感器电极之间的传感材料。 烧结或固化除去液体载体，使得残留墨水以提供传感器电极和传感材料。 电耦合到引脚或接合焊盘或芯片的传感器电极包括耦合到接合焊盘的无线耦合结构，并且该方法包括相加地印刷油墨然后烧结或固化以在完成的半导体封装上形成互补的无线耦合结构，其耦合到 传感器电极使得由传感器感测的感测信号在被无线耦合结构接收之后被无线传输到接合焊盘。