公开(公告)号：US20160093525A1

公开(公告)日：2016-03-31

申请号：US14848941

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： BENJAMIN STASSEN COOK ,  JUAN ALEJANDRO HERBSOMMER ,  MATTHEW DAVID ROMIG ,  STEVEN ALFRED KUMMERL ,  WEI-YAN SHIH

IPC: H01L21/768 ,  H01L23/528

CPC classification number: H01L24/27 ,  H01L21/4867 ,  H01L21/76838 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L2223/6627 ,  H01L2224/24998 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29026 ,  H01L2224/29076 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.

Abstract translation: 一种形成封装半导体器件的方法包括提供一种第一半导体管芯（第一管芯），其上具有接合焊盘，其面朝上安装在封装衬底上或引线框架（衬底）的管芯焊盘上，其中衬底包括端子或接触焊盘 （基板焊盘）。 形成第一电介质层，包括印刷第一电介质前体层，该第一电介质前体层包括具有从衬底焊盘延伸到接合焊盘的第一液体载体溶剂的第一油墨。 印刷第一互连前体层，其包括在从衬底焊盘延伸到接合焊盘的第一介电层上方具有第二液体载体的第二油墨。 烧结或固化第一互连前体层至少去除第二液体载体以形成包括将各个衬底焊盘连接到各个焊盘的墨残余物的导电互连。

公开(公告)号：US20240178085A1

公开(公告)日：2024-05-30

申请号：US18070523

申请日：2022-11-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： STEVEN ALFRED KUMMERL ,  SREENIVASAN K. KODURI ,  SOPHIA DELPAK ,  LAURA MAY ANTIONETTE CLEMENTE

IPC: H01L23/24 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/24 ,  H01L21/56 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L23/49513

Abstract: An electronic device includes a substrate and a die having an active surface disposed on the substrate. A sensor is in communication with the active surface of the die. A ring encircles the sensor and includes a cylindrical wall and a cap, where the cap has a partial circular shape that extends beyond each side of the wall. A mold compound covers the die and abuts an outer surface of the wall thereby forming a cavity in the mold compound to expose the sensor to an environment external to the electronic device.

公开(公告)号：US20160093548A1

公开(公告)日：2016-03-31

申请号：US14849026

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： BENJAMIN STASSEN COOK ,  JUAN ALEJANDRO HERBSOMMER ,  DJANGO TROMBLEY ,  STEVEN ALFRED KUMMERL ,  PAUL EMERSON

IPC: H01L23/31 ,  H01L21/288 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L23/3121 ,  H01L21/288 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/5227 ,  H01L24/09 ,  H01L2224/08268 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/146 ,  H05K1/092 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0179 ,  H05K2201/0999 ,  H05K2201/10151

Abstract: A method forming packaged semiconductor devices includes providing a completed semiconductor package having a die with bond pads coupled to package pins. Sensor precursors including an ink and a liquid carrier are additively printed directly on the die or package to provide precursors for electrodes and a sensing material between the sensor electrodes. Sintering or curing removes the liquid carrier such that an ink residue remains to provide the sensor electrodes and sensing material. The sensor electrodes electrically coupled to the pins or bond pads or the die includes a wireless coupling structure coupled to the bond pads and the method includes additively printing an ink then sintering or curing to form a complementary wireless coupling structure on the completed semiconductor package coupled to the sensor electrodes so that sensing signals sensed by the sensor are wirelessly transmitted to the bond pads after being received by the wireless coupling structure.

Abstract translation: 形成封装半导体器件的方法包括提供具有与封装引脚耦合的接合焊盘的芯片的完整半导体封装。 包括油墨和液体载体的传感器前体被直接加印在模具或包装上，以提供用于电极的前体和传感器电极之间的传感材料。 烧结或固化除去液体载体，使得残留墨水以提供传感器电极和传感材料。 电耦合到引脚或接合焊盘或芯片的传感器电极包括耦合到接合焊盘的无线耦合结构，并且该方法包括相加地印刷油墨然后烧结或固化以在完成的半导体封装上形成互补的无线耦合结构，其耦合到 传感器电极使得由传感器感测的感测信号在被无线耦合结构接收之后被无线传输到接合焊盘。

公开(公告)号：US20150105630A1

公开(公告)日：2015-04-16

申请号：US14050910

申请日：2013-10-10

Applicant: Texas Instruments Incorporated ,  TEXAS INSTRUMENTS DEUTSCHLAND GmbH

Inventor： STEVEN ALFRED KUMMERL ,  ANURAAG MOHAN ,  VIOLA SCHAFFER

IPC: A61B5/0205 ,  A61B5/00

CPC classification number: A61B5/0205 ,  A61B5/02438 ,  A61B5/02444 ,  A61B5/4866 ,  A61B5/681 ,  A61B5/742 ,  A61B2562/0223

Abstract: A heart pulse monitor includes a permanent magnet including a mounting structure for securing the permanent magnet in displaceable contact with a blood vessel of a wearer. The permanent magnet has a thickness defining an axial direction that the permanent magnet is displaceable when blood flows. A fluxgate sensor system is positioned a distance in the axial direction from the permanent magnet to sense an axial magnetic field therefrom. The permanent magnet displaces in the axial direction upon a heart pulse of the wearer resulting in a change in the axial magnetic field which is sensed by the fluxgate sensor system through a change in an induced AC output signal on the sense coil. A processor is coupled to receive information from the induced AC output signal. The processor implements calibration data which converts information from the induced AC output signal into a heart pulse measurement for the wearer.

Abstract translation: 心脏脉搏监测器包括永磁体，其包括用于固定永久磁体与穿戴者的血管可置换接触的安装结构。 永磁体具有限定轴向方向的厚度，当血液流动时永磁体可以移位。 磁通门传感器系统沿轴向方向与永磁体定位，以便从其感测轴向磁场。 永磁体在佩戴者的心脏脉搏上沿轴向移位，导致通过磁感应门传感器系统通过感测线圈上的感应AC输出信号的变化而感测到的轴向磁场的变化。 处理器被耦合以从感应的AC输出信号接收信息。 处理器实现校准数据，其将来自感应AC输出信号的信息转换为用于佩戴者的心脏脉搏测量。