公开(公告)号：US09646906B2

公开(公告)日：2017-05-09

申请号：US14849026

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Django Trombley ,  Steven Alfred Kummerl ,  Paul Emerson

IPC: H01L21/288 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H05K1/09 ,  H05K1/16 ,  H01L23/495

CPC classification number: H01L23/3121 ,  H01L21/288 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/5227 ,  H01L24/09 ,  H01L2224/08268 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/146 ,  H05K1/092 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0179 ,  H05K2201/0999 ,  H05K2201/10151

Abstract: A method forming packaged semiconductor devices includes providing a completed semiconductor package having a die with bond pads coupled to package pins. Sensor precursors including an ink and a liquid carrier are additively printed directly on the die or package to provide precursors for electrodes and a sensing material between the sensor electrodes. Sintering or curing removes the liquid carrier such that an ink residue remains to provide the sensor electrodes and sensing material. The sensor electrodes electrically coupled to the pins or bond pads or the die includes a wireless coupling structure coupled to the bond pads and the method includes additively printing an ink then sintering or curing to form a complementary wireless coupling structure on the completed semiconductor package coupled to the sensor electrodes so that sensing signals sensed by the sensor are wirelessly transmitted to the bond pads after being received by the wireless coupling structure.