公开(公告)号：US20230326913A1

公开(公告)日：2023-10-12

申请号：US18334317

申请日：2023-06-13

Applicant: Texas Instruments Incorporated

Inventor： Sreenivasan K. Koduri ,  Steven R. Tom ,  Paul Brohlin

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/13 ,  H01L21/48

CPC classification number: H01L25/16 ,  H01L23/49838 ,  H01L25/162 ,  H01L23/13 ,  H01L21/4846 ,  H01L23/3736

Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.

公开(公告)号：US12300678B2

公开(公告)日：2025-05-13

申请号：US18334317

申请日：2023-06-13

Applicant: Texas Instruments Incorporated

Inventor： Sreenivasan K. Koduri ,  Steven R. Tom ,  Paul Brohlin

IPC: H01L23/48 ,  H01L21/48 ,  H01L23/13 ,  H01L23/498 ,  H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373

Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.

公开(公告)号：US11676951B2

公开(公告)日：2023-06-13

申请号：US17219123

申请日：2021-03-31

Applicant: Texas Instruments Incorporated

Inventor： Sreenivasan K. Koduri ,  Steven R. Tom ,  Paul Brohlin

IPC: H01L23/48 ,  H01L21/56 ,  H01L25/16 ,  H01L23/498 ,  H01L23/13 ,  H01L21/48 ,  H01L23/373 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367

CPC classification number: H01L25/16 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/49838 ,  H01L25/162 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48137 ,  H01L2224/48225 ,  H01L2224/49175

Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.

公开(公告)号：US20220208745A1

公开(公告)日：2022-06-30

申请号：US17219123

申请日：2021-03-31

Applicant: Texas Instruments Incorporated

Inventor： Sreenivasan K. Koduri ,  Steven R. Tom ,  Paul Brohlin

IPC: H01L25/16 ,  H01L23/498 ,  H01L21/48 ,  H01L23/13 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/31

Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.