公开(公告)号：US10976491B2

公开(公告)日：2021-04-13

申请号：US15795349

申请日：2017-10-27

申请人： The Research Foundation for The State University of New York ,  The Trustees of Columbia University in the City of New York ,  Analog Photonics, LLC ,  Arizona Board of Regents on behalf of the University of Arizona

发明人： Douglas Coolbaugh ,  Michael Watts ,  Michal Lipson ,  Keren Bergman ,  Thomas Koch ,  Jeremiah Hebding ,  Daniel Pascual ,  Douglas La Tulipe

IPC分类号： G02B6/122 ,  G02B6/136 ,  G02B6/132 ,  H01L23/498 ,  H01S5/22 ,  H01L21/48 ,  H01L23/13 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43 ,  H01S5/022 ,  G02B6/12

摘要： In one embodiment an optoelectronic system can include a photonics interposer having a substrate and a functional interposer structure formed on the substrate, a plurality of through vias carrying electrical signals extending through the substrate and the functional interposer structure, and a plurality of wires carrying signals to different areas of the functional interposer structure. The system can further include one or more photonics device integrally formed in the functional interposer structure, and one or more prefabricated component attached to the functional interposer structure.

公开(公告)号：US11435523B2

公开(公告)日：2022-09-06

申请号：US16909557

申请日：2020-06-23

申请人： The Research Foundation for The State University of New York

发明人： Douglas Coolbaugh ,  Douglas La Tulipe ,  Gerald Leake

IPC分类号： G02B6/12 ,  H01L21/48 ,  H01L23/498 ,  H01L31/02 ,  H01L31/0232 ,  G02B6/13 ,  G02B6/42 ,  H01L23/00 ,  G02B6/43 ,  H01L27/12 ,  H01L21/18 ,  H01L21/762 ,  H01L25/18 ,  H01L25/00 ,  H01L25/065

摘要： There is set forth herein an optoelectrical system comprising: a conductive path for supplying an input voltage to a photonics device, wherein the conductive path comprises a base structure through via extending through a substrate and a photonics structure through via, the photonics structure through via extending through a photonics device dielectric stack. There is set forth herein an optoelectrical system comprising: a second structure fusion bonded to an interposer base dielectric stack of a first structure. There is set forth herein a method comprising: fabricating a second wafer built structure using a second wafer, the second wafer built structure defining a photonics structure and having a photonics device integrated into a photonics device dielectric stack of the second wafer based structure; and wafer scale bonding the second wafer built structure to a first wafer built structure.

公开(公告)号：US11550173B2

公开(公告)日：2023-01-10

申请号：US16952013

申请日：2020-11-18

申请人： The Research Foundation for The State University of New York ,  Government of the United States, as Represented by the Secretary of the Air Force ,  Morton Photonics Incorporated

发明人： Douglas Coolbaugh ,  Douglas La Tulipe ,  Paul A. Morton ,  Nicholas G. Usechak

IPC分类号： G02F1/035 ,  G02F1/095 ,  G02B6/12

摘要： There is set forth herein an integrated photonics structure having a waveguide disposed within a dielectric stack of the integrated photonics structure, wherein the integrated photonics structure further includes a field generating electrically conductive structure disposed within the dielectric stack; and a heterogenous structure attached to the integrated photonics structure, the heterogenous structure having field sensitive material that is sensitive to a field generated by the field generating electrically conductive structure. There is set forth herein a method including fabricating an integrated photonics structure, wherein the fabricating an integrated photonics structure includes fabricating a waveguide within a dielectric stack, wherein the fabricating an integrated photonics structure further includes fabricating a field generating electrically conductive structure within the dielectric stack; and attaching a heterogenous structure to the integrated photonics structure, the heterogenous structure having field sensitive material that is sensitive to a field generated by the field generating electrically conductive structure.

公开(公告)号：US11550099B2

公开(公告)日：2023-01-10

申请号：US16575938

申请日：2019-09-19

申请人： The Research Foundation for The State University of New York

发明人： William Charles ,  Douglas Coolbaugh ,  Douglas La Tulipe ,  Gerald L. Leake, Jr.

IPC分类号： G02B6/12 ,  G02B6/42 ,  G02B6/43 ,  H01S5/026 ,  G02B6/13 ,  H01L31/101 ,  H01S5/02345 ,  H01S5/02

摘要： There is set forth herein a method including building a first photonics structure using a first wafer having a first substrate, wherein the building the first photonics structure includes integrally fabricating within a first photonics dielectric stack one or more photonics device, the one or more photonics device formed on the first substrate; building a second photonics structure using a second wafer having a second substrate, wherein the building the second photonics structure includes integrally fabricating within a second photonics dielectric stack a laser stack structure active region and one or more photonics device, the second photonics dielectric stack formed on the second substrate; and bonding the first photonics structure and the second photonics structure to define an optoelectrical system having the first photonics structure bonded the second photonics structure.

公开(公告)号：US10698156B2

公开(公告)日：2020-06-30

申请号：US15891847

申请日：2018-02-08

申请人： The Research Foundation for The State University of New York

发明人： Douglas Coolbaugh ,  Douglas La Tulipe ,  Gerald Leake

IPC分类号： G02B6/12 ,  H01L21/48 ,  H01L23/498 ,  H01L31/02 ,  H01L31/0232 ,  G02B6/13

摘要： There is set forth herein a method including building an interposer base structure on a first wafer having a first substrate, wherein the building an interposer base structure includes fabricating a plurality of through vias that extend through the first substrate and fabricating within an interposer base dielectric stack formed on the first substrate one or more metallization layer; building a photonics structure on a second wafer having a second substrate, wherein the building a photonics structure includes fabricating within a photonics device dielectric stack formed on the second substrate one or more photonics device; and bonding the photonics structure to the interposer base structure to define an interposer having the interposer base structure and one or more photonics device fabricated within the photonics device dielectric stack. There is set forth herein an optoelectrical system including a substrate; an interposer dielectric stack formed on the substrate, the interposer dielectric stack including a base interposer dielectric stack, and a photonics device dielectric stack, and a bond layer dielectric stack that integrally bonds the photonics device dielectric stack to the base interposer dielectric stack.

公开(公告)号：US20200166720A1

公开(公告)日：2020-05-28

申请号：US16575938

申请日：2019-09-19

申请人： The Research Foundation for The State University of New York

发明人： William CHARLES ,  Douglas COOLBAUGH ,  Douglas La Tulipe ,  Gerald L. LEAKE, JR.

IPC分类号： G02B6/43 ,  H01L21/48 ,  H01S5/02 ,  H01L23/00 ,  H01S5/026 ,  H01S5/042 ,  H01L23/538 ,  G02B6/42 ,  H01L31/02 ,  H01L31/18 ,  H01L25/18 ,  H01S5/022 ,  H01L31/0232 ,  H01S5/125 ,  H01S5/343 ,  H01S5/34

摘要： There is set forth herein a method including building a first photonics structure using a first wafer having a first substrate, wherein the building the first photonics structure includes integrally fabricating within a first photonics dielectric stack one or more photonics device, the one or more photonics device formed on the first substrate; building a second photonics structure using a second wafer having a second substrate, wherein the building the second photonics structure includes integrally fabricating within a second photonics dielectric stack a laser stack structure active region and one or more photonics device, the second photonics dielectric stack formed on the second substrate; and bonding the first photonics structure and the second photonics structure to define an optoelectrical system having the first photonics structure bonded the second photonics structure.

公开(公告)号：US11029466B2

公开(公告)日：2021-06-08

申请号：US16575820

申请日：2019-09-19

申请人： The Research Foundation for The State University of New York ,  The Regents of The University of California

发明人： William Charles ,  John Bowers ,  Douglas Coolbaugh ,  Daehwan Jung ,  Jonathan Klamkin ,  Douglas La Tulipe ,  Gerald L. Leake, Jr. ,  Songtao Liu ,  Justin Norman

IPC分类号： G02B6/12 ,  G02B6/13 ,  G02B6/132

摘要： There is set forth herein a method including a substrate; a dielectric stack disposed on the substrate; one or more photonics device integrated in the dielectric stack; and a laser light source having a laser stack including a plurality of structures arranged in a stack, wherein structures of the plurality of structures are integrated in the dielectric stack, wherein the laser stack includes an active region configured to emit light in response to the application of electrical energy to the laser stack.

公开(公告)号：US20200166703A1

公开(公告)日：2020-05-28

申请号：US16575820

申请日：2019-09-19

申请人： The Research Foundation for The State University of New York ,  The Regents of The University of California

发明人： William CHARLES ,  John BOWERS ,  Douglas COOLBAUGH ,  Daehwan JUNG ,  Jonathan KLAMKIN ,  Douglas La Tulipe ,  Gerald L. LEAKE, JR. ,  Songtao LIU ,  Justin NORMAN

IPC分类号： G02B6/12 ,  G02B6/132 ,  G02B6/13

摘要： There is set forth herein a method including a substrate; a dielectric stack disposed on the substrate; one or more photonics device integrated in the dielectric stack; and a laser light source having a laser stack including a plurality of structures arranged in a stack, wherein structures of the plurality of structures are integrated in the dielectric stack, wherein the laser stack includes an active region configured to emit light in response to the application of electrical energy to the laser stack.