公开(公告)号：US12293856B2

公开(公告)日：2025-05-06

申请号：US17348418

申请日：2021-06-15

Applicant: The Texas A&M University System ,  FORMOSA PLASTICS CORPORATION

Inventor： Hung-Jue Sue ,  Chia-Ying Tsai ,  Kwang-Ming Chen ,  Kun-Pei Hsieh ,  Chao-Shun Chang ,  Ssu-Ping Huang

IPC: H01B1/22 ,  B22F1/054 ,  B22F1/07 ,  B22F1/102 ,  B22F9/24 ,  C08J3/20 ,  C08J3/205 ,  C08J3/215 ,  C08K3/08 ,  C08K7/06 ,  C08K9/04 ,  C09K5/14 ,  B22F1/107

Abstract: The present disclosure provides a copper nanowire composition. The copper nanowire composition includes copper nanowire having associated ligands with the structure HNR1R2, where R1 is hydrogen, alkyl group, or arylalkyl group, R2 is alkyl group or arylalkyl group, wherein the associated ligand has an amount of 100 wt % to 10000 wt % versus a weight of the copper nanowire.